在鑄造過程之熱傳模式分析中，砂模與金屬界面熱傳情形是一關鍵性的問題，若無法妥善地處理此界面條件，會直接影響分析的結果。由於模與鑄件間不是緊密接觸，在模與金屬界面之熱傳方析中，需要一界面熱傳係數h來估算金屬的界面熱束q。
　　本文針對濕砂模鑄造實驗，使用純金屬鋁、鋁合金(A356)及錫鉛(Sn-20wt%Pb)合金作為鑄造材料，以圓柱與長方體作為鑄件模型，用熱電偶量測出於砂模與金屬界面附近之溫度對時間的關係圖，利用Beck逆運算法、總容量法及銅塊法三種不同的方法，來計算砂模與金屬界面之熱束與熱傳係數。
　　金屬液凝固時，在不同位置的冷卻曲線都很類似，純鋁之冷卻曲線會停滯在凝固溫度一段時間，A356鋁合金及錫鉛合金則呈現初生相（或初晶）和共晶兩個凝固階段，並在初生相階段有復輝現象產生。模與金屬界面之熱束(q)和熱傳係數(h)隨著時間之變化趨勢很相似，A356鋁合金與錫鉛合金的q與h對時間之變化呈現兩個高峰，鋁金屬僅有一個高峰。Beck逆運算法、總容量法及銅塊法之比較，h的情況跟q相似，Beck逆運算法與總容量法較接近，銅塊法跟其他兩種方法相差較多。以計算方法而言，以銅塊法最容易，總容量法其次，Beck逆運算法需要繁複之迭代，最為困難。

　　In the heat-transfer analysis of a casting process, how to deal with the heat-transfer condition at the mold/metal interface is a key problem. If the problem is not handled properly, it will directly affect the analysis result. Since the contact between mold and metal is not perfect, the heat-transfer analyzer needs a heat-transfer coefficient h to balance the heat flux q at the interface.
　　In this paper, the experiment method of green-sand-mold casting is used and the casting materials are pure aluminum, A356 alloy and Sn-20Wt%Pb alloy. The casting geometry is cylindrical. Thermocouples are utilized to measure the temperatures near the mold/metal interface. The Beck inverse, a lump capacitance and copper-assisted measurement methods are used to calculate interfacial heat flux and heat-transfer coefficient.
　　During the solidification of liquid metal, the cooling curves of different locations are similar. The cooling curve of pure aluminum would stay at the solidification temperature for a while. The curves of A356 and tin-lead alloys show two solidification stages of: one is the primary phase (or pro-eutectic) solidification, and the other is the eutectic one. The time-varying trends of interfacial heat flux and heat transfer coefficient are similar. In the curves of q (or h) versus time of A356 and tin-lead alloys have two peaks, corresponding with two solidification stages. However, the curve of pure aluminum only has one peak. The curves of q or h predicted by the Beck inverse method are similar to those of the lump capacitance method, but they are quite different from those of the copper-assisted measurement method. From the point of computing method, the copper-assisted method is the simplest way and the Beck inverse method is the most difficult one.

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