本研究建立微電鍍製程技術，並利用此技術設計及製作以玻璃與塑膠（PMMA）為基材的十字型電泳晶片及微流體計數器晶片。而且發展出種微流體元件，其製程如下所述：
（1）微熱壓成型塑膠晶片：
本研究利用微電鍍鎳的技術，在S50C鋼材上鍍出十字型電泳晶片的圖形，並利用微熱壓成型技術將電鍍的圖型轉移至PMMA材質上，製作高深寬比的微流體晶片。
（2）射出成形塑膠晶片：
本研究也是利用微電鍍鎳的技術，在射出模具上鍍出十字型晶片的圖案，利用射出成形機，進行PMMA的射出，將模具上的圖案轉移至射出的PMMA塑膠上。
（3）微流體計數晶片：
此晶片利用SU-8-50負光阻作微流體計數器的結構層，在玻璃晶片上電鍍銅電極當作流體計數器的偵測電極，用來偵測微粒子在流體中的流速及大小。
（4）無電極電鍍銅噴嘴：
本研究在改善傳統微噴霧器的噴嘴，利用無電鍍鍍的方式，在毛細管的表面鍍上一層導電的銅金層，用來做微噴灑的加電壓噴嘴。
本研究發展一簡易且可靠的微電鍍製程，可製作出各式微流體元件。元件中應用微電鎳技術熱壓及射出成形的塑膠微管道結構，及用來作微流體偵測的電極，微噴灑噴嘴的無電鍍銅等技術，可以應用於化學分析方面。

In this study, critical micro-electroplating techniques to manufacture micro-capillary electrophoresis (CE) chips and microfluidic devices on glass and polymethymethacrylate (PMMA) substrates have been demonstrated. Four microfluidic devices are developed and described as follows.
(1) CE chips using hot-embossing methods
Templates with inverse images of CE channels are fabricated using micro-electroplating techniques. The images of microstructures are then transferred from templates to plastic plates by using hot embossing methods Microfluidic chips with a high aspect ratio can be achieved.
(2) CE chips using injection molding methods
Micro injection molding methods are used to duplicate micro CE chips.
(3)Micro flow cytometer chips:
SU-8-50 negative photo resist is used as structures of the micro flow cytometer for cell counting and sorting. A pair of electroplated copper electrodes is used to detect signals caused by cells.
(4)Hollow spray nozzles
A silica-based capillary is coated with a layer of copper by using electroless plating methods. Then core material is etched to form a hollow metal nozzle for electrospray applications.
In summary, micro electroplating fabrication process is developed in this study for applications of microfluidics. Micro fluidic devices with a high aspect ratio can be duplicated using hot-embossing or injection molding methods. An innovative micro flow cytometer is demonstrated using SU-8 as microstructures and electroplated coppers as sensing electrodes.

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