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研究生: 王琮翰
Wang, Tsung-Han
論文名稱: 玻璃-鋁接合之雷射焊接參數的數值模擬與實驗驗證
Numerical Modeling and Experimental Validation of Laser Welding Parameters for Glass-Aluminum Bonding
指導教授: 羅裕龍
Lo, Yu-Lung
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2026
畢業學年度: 114
語文別: 英文
論文頁數: 55
中文關鍵詞: 雷射焊接異種材料焊接相場斷裂傳熱模擬
外文關鍵詞: Laser welding, Dissimilar bonding, Phase-field fracture, Heat transfer simulation
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  • 本研究提出一項結合數值模擬與實驗驗證的整合式研究,針對 BOROFLOAT® 33 玻璃與 AA1050 鋁之直接雷射焊接進行探討,旨在解決兩種材料在熱性質與機械性質上高度不匹配所帶來的長期挑戰。本研究建立一套三維 COMSOL Multiphysics 模型,以模擬擺動式奈秒雷射作用下之暫態熱傳行為與熱誘發應力分佈,模型中針對玻璃採用體積熱源,而對鋁材則採用表面熱源進行描述。為預測脆性玻璃中裂紋的起始與擴展行為,本研究進一步導入全耦合熱-機相場模型,使損傷能在熱梯度與殘留應力的驅動下連續演化。模擬結果顯示,高雷射功率與低掃描速度會顯著提高裂紋驅動能量並促進裂紋形成,而中等能量輸入則可有效侷限應力集中。實驗雷射焊接結果驗證了上述模擬預測,在熔池形貌、孔洞生成以及裂紋行為等方面,模擬所得之損傷場與實際觀察結果呈現高度一致。為進一步最佳化製程參數,本研究以相場模型輸出的損傷結果作為訓練資料,建立人工神經網路模型並構建高解析度製程參數圖譜。結果顯示,在雷射功率約 30–50 W 且掃描速度為 3–5 mm/s 的條件下,可獲得低損傷接合區域,形成無裂紋焊道,其最大剪切強度可達 8.5 MPa,表現優於多數已報導之玻璃-金屬雷射焊接研究。本研究所建立之數值-實驗整合分析架構,提供一套無需中介層的玻璃-金屬雷射焊接參數最佳化策略,並可作為未來光電、微流體與先進封裝應用之穩健基礎。

    This study presents an integrated numerical–experimental investigation of direct laser welding between BOROFLOAT® 33 glass and AA1050 aluminum, aiming to resolve the long-standing challenges associated with their large mismatch in thermal and mechanical properties. A three-dimensional COMSOL Multiphysics model was developed to simulate transient heat transfer and thermally induced stress under a wobbling nanosecond laser, incorporating a volumetric heat source for glass and surface heat sources for aluminum. To predict crack initiation and propagation in the brittle glass, a fully coupled thermo-mechanical phase-field model was implemented, enabling the continuous evolution of damage driven by thermal gradients and residual stresses. Simulation results reveal that high laser power and low scanning speed significantly elevate damage-driving energy and promote cracking, whereas moderate energy input confines stress localization. Experimental welding trials validated these predictions, showing close correspondence between simulated damage fields and observed molten morphology, pore formation, and crack behavior. To further optimize process parameters, artificial neural networks (ANNs) were trained on phase-field damage outputs to construct a high-resolution processing map. The resulting map identifies an optimal low-damage window at ~30–50 W with a scanning speed of 3–5 mm/s, yielding crack-free seams and a maximum shear strength of 8.5 MPa—surpassing many reported glass-metal welding benchmarks. This combined computational–experimental framework provides a quantitative strategy for optimizing glass–metal laser welding without the use of interlayers, offering a robust foundation for future optoelectronic, microfluidic, and packaging applications.

    ABSTRACT i 中文摘要 iii Outline v LIST OF TABLES vii LIST OF FIGURES viii 1.Introduction 1 2. Materials and Methodologies 4 2.1 Materials 4 2.2 Simulation setup 6 2.3 Experimental setup 14 3.Result of Simulation and Experiment 17 3.1 Simulation results 17 3.2 Experimental results 19 4. Crack analysis 21 4.1 Cracking criterion for laser welding of BF33-Al 21 4.2 Optimized processing map of BF33-Al 22 4.2.1Circular packaging design model for parameter optimization 22 4.2.2 Final Optimized Processing Map 24 5. Verification in Experiments and Analysis 28 5.1 Verification of Optimized Processing Map 28 5.2 Shear Strength Analysis 30 5.3 SEM & EDS Analysis 33 6. Conclusions 37 References 41

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