幾丁聚醣為一種價格便宜且可廣泛的被應用的的天然高分子，胺基可以與重金屬離子形成鍵結而吸附，因此本研究利用冷凍乾燥製程並使用酒精取代氫氧化鈉來將薄膜內的醋酸置換出來。採用掃瞄式電子顯微鏡觀察表面形貌及拉伸試驗機檢測製程時不同階段的機械性質；以三聚磷酸鈉為交聯劑增加對不同化學環境的抵抗能力，並探討在不同pH值或溫度對於吸附和脫附銅離子的影響，利用硝酸進行脫附試驗，使用原子吸收光譜儀檢測銅離子吸附和脫附之間的效率轉換情形；再搭配X光光電子光譜儀及傅立葉轉換紅外光譜儀對化學鍵結變化情形做分析。
實驗結果顯示：使用酒精置換醋酸的幾丁聚醣薄膜可以讓薄膜孔洞直徑約170~240 μm，並在三聚磷酸鈉交聯後平均仍有190 μm。加上交聯劑後的幾丁聚醣薄膜的機械和化學性直接有明顯的變化。從化學分析知，幾丁聚醣對於銅離子的吸附是由於上面的胺基的存在造成，而本製程置備出來的幾丁聚醣薄膜擁有適當的孔洞大小可以讓銅離子輕易的擴散於其中。銅離子以40 oC、pH=5環境下的吸附量最多，吸附量達52.41 mg/g。
由實驗結果推論幾丁聚醣吸附或脫附銅離子的機制如下：(1) 乾燥後由XPS發現大量的Cu-O鍵結和Cu2+訊號，和胺基產生庫倫靜電力相互吸引；(2) 當pH值降低，會造成胺基質子化程度增加而減少用來吸附銅離子的負電荷位置；(3) 脫附則是發生於幾丁聚醣的胺基吸引氫離子或是螯合。然而，幾丁聚醣膜的第一次脫附效率約為75 %，而第二次則為60%。顯示出這樣的環境處理可以使幾丁聚醣於銅離子吸附更為實用。

Chitosan is an inexpensive and a widely available nature polymer; its amine group is usually competent to bind with heavy metal ions. In this study, chitosan films were prepared by freeze-drying procedure, and replaced sodium hydroxide by using alcohol to metathesis acetic acid inner the thin film. Morphologies and mechanical properties of the as-prepared chitosan films in different processing stages were measured by Scanning Electron Microscope and MTS. In addition, the chitosan films were purposely cross-linked with tripolyphosphate to increase the resistance of chemicals in different processing stages, such as the pH values and the temperature for copper ion adsorption/desorption. Desorption rate of copper ions was tested by nitric acid solution and measured by Atomic Adsorption spectrometry. Chemical structures of the tested chitosan films were characterized by Fourier Transform Infrared Spectrometer and X-ray Photoelectron Spectroscopy. The proposed mechanism for copper ion adsorption and desorption was thereafter studied.
Experimental results demonstrated that the pore sizes of the pristine and the cross-linked chitosan films were about 170~240 and 190 μm, respectively. Mechanical and chemical properties of the cross-lined chitosan film were significantly enhanced. From the chemical analyses, the adsorption of copper ions was resulted by the presence of amine group in chitosan and enhanced by the easily-diffusion (or the appropriate porosity) of copper ions in the chitosan matrix. The adsorption capacity was maximized at 52.41 mg/g under 40 oC and the pH value of 5.
The apparent mechanism of the copper ion adsorption/desorption can be proposed as: (1) The bonding of copper-oxygen and copper ion attract amine group each other with electrostatic attraction in the dryied thin film and find copper-oxygen was the mainly bonding from XPS; (2) As decreased the pH value in solution, the protonation of the amine group also increases, leading to the rise of the negatively-charged sites for binding with copper ions; (3) The desorption occurs when the amine group is attacked and chelated by H+. Moreover, the first and second desorption efficiencies were estimated as 75 % and 60 %, which is still promising for the preliminary treatment on the copper ions adsorption.

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