本研究之主要目的為探討不同Sb添加量(0.5、1.0、2.0、3.0wt.%)對Sn-1.5Ag-0.7Cu-0.05Ni低銀無鉛銲料於迴銲後與150℃熱儲存後的顯微組織、介金屬化合物層(界面IMC層)厚度及其機械性質之影響。
根據本次研究結果得知SAC157-0.05Ni合金銲料添加0.5wt.%Sb元素後內部組織具有顯著的細化現象，且共晶組織中的Ag3Sn以及(Cu, Ni)6Sn5因Sb與Sn原子半徑相近而產生置換式反應轉變成Ag3(Sn,Sb)與(Cu,Ni)6(Sn,Sb)5，隨著Sb添加量的提升，初析β-Sn及(Cu,Ni)6(Sn,Sb)5有逐漸粗大化的趨勢，這使得共晶組織的析出空間逐漸受到壓縮並造成不連續性的產生，此外，共晶組織中的Ag3(Sn,Sb)將隨著Sb添加量的提升板片化逐漸顯著。於熱儲存前硬度試驗的部分發現不論基地或共晶組織的硬度皆隨著Sb添加量的增加而逐漸提升，而熱儲存後其硬度下降量將隨著Sb添加量的增加而逐漸減少，即Sb的添加將提升銲料的抗熱性。界面IMC層總厚度觀察方面，發現添加0.5-1.0wt.%的Sb元素可降低熱儲存前後界面IMC層總厚度，而其厚度成長趨勢隨著Sb添加量的增加而逐漸減緩，這是因為隨著Sb添加量的增加固溶強化效果逐漸提升導致擴散係數降低。
於剪切試驗的部分，發現由於0.5wt.%的Sb添加產生細晶化以及固溶強化的效果，因此剪切強度及塑性變形能力皆有所提升，然而於熱儲存後剪切強度的下降量仍然明顯。當添加量達到1.0wt.%，雖然其熱儲存前之剪切強度比起添加量為0.5wt.%的更高但由於細晶化效果的弱化使得塑性變形能力下降，於熱儲存225hr後1.0wt.%的Sb添加表現出最低的剪切強度下降量。此外，當添加量為0.5-1.0wt.%時在剪切斷口的部分觀察到其微觀組織具有明顯的延性破斷特徵。
綜合顯微組織觀察、硬度試驗、IMC層厚度觀察、剪切試驗與剪切斷面分析後，於研究結果顯示Sb添加量於0.5-1.0wt.%時將可有效降低Sn-1.5Ag-0.7Cu-0.05Ni合金銲料銲點的界面IMC層厚度，並改善抗熱性與熱儲存前後之機械性質及其可靠度表現。

The purpose of this study was to investigate the effects of Sb addition (0.5, 1.0, 2.0, 3.0wt.%)on the microstructure, thickness of IMC layer and mechanical properties of low-silver Sn-1.5Ag-0.7Cu-0.05Ni(SAC157-0.05Ni) lead-free solder after refolw and 150℃ thermal aging.
The experimental results show that when 0.5wt.%Sb is added to SAC157-0.05Ni, the microstructure of solder has significant refinement. Since the atomic radius of Sb is similar to Sn, it will cause the substitution reaction and change Ag3Sn and (Cu,Ni)6Sn5 into Ag3(Sn,Sb) and (Cu,Ni)6(Sn,Sb)5.With the increase of Sb addition, the primary β-Sn and (Cu,Ni)6(Sn,Sb)5 are gradually coarsen. It causes the precipitation space of the eutectic structure to be gradually compressed and causes discontinuity. In addition, the flake-like shape of Ag3(Sn,Sb) will become more noticeable. In the microhardness test before thermal aging, with the increasing amount of Sb addition, the hardness of base and eutectic structure will grow. Furthermore, the reduction of the hardness after thermal aging will gradually decrease as the amount of Sb increases. That is, the addition of Sb will increase the heat resistance of the solder. In the observation of the total thickness of the interface IMC layer, it was found that 0.5-1.0wt.% Sb element addition can reduce the total thickness of the interface IMC layer after reflow and thermal aging. Furthermore, the thickness growth trend gradually slows down with the increase of Sb addition. Due to the addition amount of Sb increases, the solid solution strengthening effect gradually become distinctive, which results in a decrease of the diffusion coefficient.
In the shear test and the fracture analysis, it was found that the effect of grains refining and solid solution strengthening was enhanced by the addition of 0.5 wt.% of Sb. Thus, the shear strength was improved and the plastic deformation ability was also increased. Nevertheless, the reduced amount of shear strength after thermal aging still obvious. When the addition amount reaches 1.0 wt.%, although the shear strength is higher than the addition amount of 0.5 wt.%, the plastic deformation ability is lowered due to the weakening of grains refining effect. After the 150℃ thermal aging for 225 hours, the solder with 1.0 wt.% Sb addition shows the lowest amount of shear strength drop, and its fracture section can be found that it still has obvious ductile fracture characteristics.
According to the microstructure observations, microhardness test, IMC layer thickness observations, shear test and fracture section analysis, the results show that the addition amount of Sb at 0.5-1.0wt.% can effectively reduce Sn-1.5Ag-0.7Cu-0.05Ni interface IMC layer thickness and improve the heat resistance as well as mechanical properties after reflow and 150℃ thermal aging. It means that only small amount of Sb addition can effectively enhance the reliability of low-silver Sn-1.5Ag-0.7Cu-0.05Nilead-free solder.

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