本研究架設了一個非接觸、非干涉，可以做大面積即時量測，反射式的形貌測量儀。主要是改變過去三維顯微鏡的架構，將整體架構縮小化，量測光源改為LED，採用一次外反射來擴大量測面積且嘗試利用單影像處理來來做測量，主要目的是往小體積手持式裝置的目標前進。
所架設的光路同時可擷取包含了過去的雙影像處理，以及我們想實現的單影像處理所需的影像。利用影像光強度轉換成反射率，進而可以推算出待測物的高度資訊且分析出三維形貌。本系統提供微米級的量測，量測面積為2400 μm*1800 μm，最大高度範圍可以達到約440 μm。
我們利用共軛焦顯微鏡以及表面輪廓儀來做高度以及形貌結果的比較，其高度誤差小於1%。我們也針對單影像量測結果進行量測限制上的分析與探討。
最後，我們所提出的架構有非接觸式大範圍即時快速量測、架構簡單且成本低的優點。

The object of this study is to achieve a simple structure real-time, non-scanning, non-contact, non-interferometric, reflection-type profiler. We utilized light-emitting diode (LED) as a light source and performed a single image processing to analyze the profile of samples to narrow down the size of the full system for the possibility of commercialization.
The proposed system provides a micrometer-scale measurement. The framework allows rapid acquisition of the two-dimensional surface images, which combined with the reflectance acquired by CCD’s intensity imaging allows the transformation into three-dimensional surface profile. The main advantage of this system is fast measurement of large area profile by use of the rapid image acquisition of CCD and also has lower cost than the other 3D-profilometer.

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