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研究生： 王郁翔
Wang, Yu-hsiang
論文名稱： 銦基界面散熱材料與銅、鎳基材之界面反應與相平衡
Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates
指導教授： 林士剛
Lin, Shih-Kang
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2014
畢業學年度： 102
語文別： 中文
論文頁數： 129
中文關鍵詞： 界面散熱材料 、Cu/In/Ni 、三明治反應偶 、界面反應 、相平衡
外文關鍵詞： Thermal interface materials (TIMs), interfacial reactions, Cu/In/Ni, Phase equilibria
相關次數： 點閱：122  下載：8 
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    • 隨著三維度電子構裝(3D IC)以及高效能元件的發展，熱管理(Thermal Management)已經成為元件可靠度最重要的議題之一。為了將產生的熱有效的從電子元件裡排出，界面散熱材料(Thermal Interface materials, TIMs)被用來填補界面之間的孔隙以降低接觸熱阻。界面散熱材料有許多種類，但是用銲料做成的銲料界面散熱材料(Solder-TIMs)有許多優點，因此更適合被使用在電子封裝中；In具有許多的優點，例如導熱係數高、壓縮性好容易使用等，因此In在目前的先進電子元件中被廣泛使用。Cu是常見的散熱片材料而Ni在凸塊底層金屬中常被當作擴散阻礙層，因此Cu/In/Ni三明治結構在電子構裝的散熱系統中是不可或缺的部分，且其中的界面反應更可成為In基界面散熱材料　可靠度的一大依據，因此Cu/In/Ni三明治結構成為本論文所深入探討的系統。
    而當In基界面散熱與基材接合時，其界面反應的研究與可靠度十分相關，本研究中利用Cu/In/Ni三明治結構反應偶 ，於280 oC以及360 oC 下進行不同的時間的退火反應，模擬迴銲過程中所發生的反應，並利用Cu-In、In-Ni以及Cu-Ni二元熱力學模型，建構出Cu-In-Ni三元等溫橫截面圖來探討界面反應中介金屬相的生成、變化以及機制。
    另外，本研究中針對Cu/In/Ni 三明治反應偶360 oC界面反應中生成Cu11In9相的奇特現象，於In-rich corner製備了10組Cu-In-Ni的三元合金，於360 oC下進行長時間退火達相平衡，並透過分析樣品的金相、組成、及X-ray繞射等資料，來確定合金中之生成相，利用這些實驗數據來優化Cu-In-Ni 360 oC等溫橫截面圖，並利用此等溫橫截面圖來探討Cu/In/Ni三明治結構反應偶於360 oC下界面反應的生成機制。

    With many advantages, pure indium is usually used as Thermal interfacial materials (TIMs) to applied to minimize the contact thermal resistances. Copper and nickel are commonly used in electronics. As a result, the Cu/In/Ni sandwich structure is an essential component in the heat dissipation system. In this study, three different sandwich-type diffusion couples, namely Cu/In/Cu, Ni/In/Ni, and Cu/In/Ni, were annealed at 280 °C and 360 °C for various lengths of time. The IMCs were then identified with the corresponding phase diagrams. For the asymmetric Cu/In/Ni couples, a porous layer with tiny grains and special rod-like grains Cu11In9 were formed at the Cu/In interface; however, a thin planar Ni3In7 and discontinuous bulky Cu11In9 grains were found at the In/Ni interface. The microstructural evolution and the mechanism of phase transformations are discussed in this paper. Furthermore, a tentative Cu-In-Ni ternary phase diagram is proposed to elucidate the progression of Cu/In/Ni interfacial reactions. In addition, series of ternary Cu-In-Ni alloys were designed, fabricated, and heat-treated at 360 °C. And a new ternary compound was found in the Cu-In-Ni 360 oC isothermal section.

    摘要 II Abstract III 誌謝 VII 目錄 VIII 表目錄 XI 圖目錄 XII 第一章　前言 1 第二章　文獻回顧 3 2.1 界面散熱材料 3 2.1.1 界面散熱材料分類 4 2.1.2 In基銲料界面散熱材料 4 2.2 界面反應 6 2.2.1 界面反應與擴散理論 7 2.2.2 Cu/In及Cu/In/Cu液固界面反應 8 2.2.3 In/Ni及Ni/In/Ni液固界面反應 10 2.2.4 Cu/In/Ni液固界面反應 11 2.3 Cu-In-Ni 三元相平衡 12 2.3.1 相平衡理論 12 2.3.2 Cu-In 二元系統及其熱力學模型 14 2.3.3 Ni-In二元系統及其熱力學模型 15 2.3.4 Cu-Ni二元系統及其熱力學模型 16 2.3.5 Cu-In-Ni 三元系統及其熱力學模型 17 第三章　研究方法 18 3.1 Cu/In/Ni三明治反應偶之製備與界面反應 18 3.1.1反應偶製備及前處理 18 3.1.2界面反應 19 3.2 Cu-In-Ni三元系統360 oC下等溫橫截面圖 19 3.3分析方法 20 3.4 CAPHAD熱力學計算相圖 21 第四章　結果與討論 23 4.1 Cu/In/Cu三明治反應偶之界面反應 23 4.1.1 Cu/In/Cu三明治反應偶於280 oC下界面反應 23 4.1.2 Cu/In/Cu三明治反應偶於360 oC下界面反應 27 4.2 Ni/In/Ni三明治反應偶之界面反應 30 4.2.1 Ni/In/Ni三明治反應偶於280 oC下界面反應 30 4.2.2 Ni/In/Ni三明治反應偶於360 oC下界面反應 33 4.3 Cu/In/Ni三明治反應偶之界面反應 35 4.3.1 Cu/In/Ni 280 oC及360 oC計算等溫橫截面圖 35 4.3.2 Cu/In/Ni三明治反應偶於280 oC下界面反應 39 4.3.3 Cu/In/Ni三明治反應偶於360 oC下界面反應 51 4-4 Cu-In-Ni 於360 oC等溫橫截面圖之In-rich corner 59 第五章　結論 87 參考文獻 89 附錄A液相線投影圖 95 A.1液相線投影圖實驗方法 95 A.2 Cu-In-Ni液相線投影圖 96 附錄B Cu-In-Ni 三元等溫橫截面圖 115 B.1 Cu-In-Ni 三元等溫橫截面圖實驗方法 115 B.2 Cu-In-Ni 三元等溫橫截面圖 116 B.2.1 Cu-In-Ni 280 oC等溫橫截面圖 116 B.2.2 Cu-In-Ni 360 oC等溫橫截面圖 126

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