| 研究生: |
張翊程 Chang, Yi-Cheng |
|---|---|
| 論文名稱: |
利用電紡絲製程與電漿蝕刻製備銅銀奈米纖維 Fabrications of Copper-Silver Nanofibers via Electrospinning and Plasma Etching |
| 指導教授: |
郭昌恕
Kuo, Chang-Shu |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2020 |
| 畢業學年度: | 108 |
| 語文別: | 英文 |
| 論文頁數: | 139 |
| 中文關鍵詞: | 電紡絲 、電漿 、銅銀奈米纖維 、銅銀奈米纖維的結構 、抗氧化 、電極 |
| 外文關鍵詞: | electrospinning, plasma, copper-silver nanofibers, structure of Cu-Ag nanofibers, resistance to oxidation, electrodes |
| 相關次數: | 點閱:111 下載:0 |
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本研究透過電紡絲技術和電漿蝕刻製程成功製備出銅銀和銀奈米纖維。電紡絲溶液之高分子使用易受電漿蝕刻的聚環氧乙烷以及少量的聚丙烯酸,加入銅及銀前驅物,並使用環境友善的醋酸水溶液所組成。電紡絲製程完成後,再分別採用常壓電漿以及低壓氬氣電漿給于高分子適度的蝕刻,同時裂解銅和銀的前驅物形成金屬銅銀。在電漿蝕刻製程中,金屬銅銀會逐漸累積在纖維表面並形成連續導電相,優勢是不需要使用化學還原劑。透過穿透式電子顯微鏡之線掃描分析以及化學分析電子光譜儀的表面分析驗證常壓電漿製備的銅銀奈米纖維具有銀殼層包住內核銅銀之結構,展現良好的導電性以及抗氧化的能力。銅銀電紡絲在低壓電漿製程之收縮裂開之行為也被研究,並且透過調整配方中金屬對高分子之含量比來解決。低壓氬氣電漿製程製備的銅銀電紡絲具有銅在表面濃度高於銀的結構,但仍展現良好的抵抗氧化能力。無序沉積的電紡銅銀之導電網路由於具有良好的導電性,本質導電度可達106 (S/m), 具有應用於電極的潛力。
Copper-silver nanofibers were fabricated successfully via electrospinning technique and plasma etching. The plasma-vulnerable polymer, poly(ethylene oxide), poly(acrylic acid), and silver nitrate, copper nitrate trihydrate as metal precursor were fully dissolved in acetic acid aqueous solution which was friendly to environment. The atmospheric pressure plasma and low pressure argon plasma were employed to provide moderate etching to the polymer, as well as to decompose the silver and copper precursor that formed metallic copper and silver. During the plasma etching, the metallic copper and silver were formed and gradually accumulated to the fiber surface, forming the continuous conductive domain. The advantage was without utilizing the chemical reagent. The TEM-EDS linescan and ESCA demonstrated that the structure of Cu-Ag nanofibers synthesized via atmospheric pressure plasma was silver sheath covered the core of Cu-Ag, performing excellent conductivity and resistance to oxidation. The shrinkage and crack formation of Cu-Ag nanofibers synthesized via low pressure argon plasma were investigated. The adequate adjustment to weight ratio of metal/polymer in recipe could prevent the crack formation. The Cu-Ag nanofibers synthesized via argon plasma had higher concentration of Cu on nanofibers surface, but still performed fine resistance to oxidation. Randomly-deposited electrospun nanofibers and resultant copper-silver nanofibers revealed the excellent electrical conductivity (106 S/m), having potential in the application of electrodes.
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