本研究添加微量的銀、鋁與鎵並改變鎵含量來觀察鎵元素對錫鋅銀鋁銲錫性質的影響。本實驗室已發表錫鋅銀鋁鎵五元銲錫的專利，但對於鎵元素在五元銲錫中所扮演的角色並不清楚，因此本研究改變不同鎵元素在錫鋅銀鋁銲錫中的含量，討論鎵元素對錫鋅系銲錫之熱性質、拉伸性質、潤濕性及抗氧化性等性質的影響。
銲錫顯微結構顯示，銲錫基地中會出現樹枝狀的AgZn3化合物、針棒狀的富鋅相與β錫的組織，而由於添加銀的關係，銲錫合金的基地從原本的錫鋅共晶組織轉變成亞共晶組織。由EPMA的結果顯示，鎵會均勻固溶於錫基地中，並有部份會固溶於富鋅相中，而鋁則會在晶界偏析。熱差分析(Differential Scanning Calorimetry, DSC)的結果顯示，隨著鎵含量的增加(0.05~2wt%)，銲錫的固相線溫度會從197℃降至183℃，並會使銲錫的固液兩相區增大。因為五元銲錫已是亞共晶的成份，因此在銲錫靠近液相線附近會生成肩狀的放熱峰。在機械性質方面，隨著鎵含量的增加，銲錫的抗拉強度與伸長率都會增加，而當鎵含量超過1wt%後，銲錫的伸長率會從原本的42%降至20%，並從拉伸破斷面可以得知不同鎵含量的五元銲錫均為延性破斷。
在潤濕實驗中發現，添加鎵會增進銲錫的潤濕性，而錫鋅銀鋁鎵五元銲錫隨著鎵含量的增加，最大潤濕力會增加，而潤濕時間、潤濕角、界面張力與界面反應的活化能則會減少。在界面反應方面，鎵含量低於0.5wt%之五元銲錫與銅基材反應會在界面生成Cu5Zn8、AgZn3與Al4.2Cu3.2Zn0.7介金屬化合物，而當鎵含量達到0.5wt%，則CuZn5會在Cu5Zn8與AgZn3之間生成。經過高溫150℃時效後，界面的Al4.2Cu3.2Zn0.7與CuZn5與介金屬化合物則均會轉變成Cu5Zn8化合物，而隨著時效時間增加至1000小時，AgZn3化合物也會消失，且銀會固溶在Cu5Zn8化合物內。由於銲錫內鋅的消耗使錫會往界面擴散並在銲錫與基材的界面生成Cu6Sn5化合物。添加鎵也會使Cu5Zn8化合物厚度增厚，並在時效1000小時後在IMC與銲錫之間出現一條連續的裂縫。
熱重分析(Thermal Gravimetric Analysis，TGA)的結果顯示，銲錫在250℃純氧的環境下，增加鎵含量，可以增進Sn-8.5Zn-0.5Ag-0.1Al-xGa銲錫的抗氧化性。本實驗利用聚焦離子束(Focus Ion Beam，FIB)加工，觀察銲錫的橫截面發現氧化層的厚度約30~100 nm，並可以發現鎵含量較低(0.05wt%)銲錫的氧化層較不緻密，有孔洞的存在，而隨著銲錫鎵含量的增加，五元銲錫(2wt%Ga)則會生成緻密的氧化層。從歐傑(Auger Electron Spectroscopy，AES)表面、歐傑縱深分析與薄膜XRD等分析得知，五元銲錫生成的氧化物為ZnO，而鋁與鎵則會傾向往銲錫表面聚集。

This study investigated the addition of Ga to improve the properties of Sn-Zn series Pb-free solders. Our laboratory had been awarded the patent of Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solder. But the role of Ga in solder was not understood clearly. Therefore, this work investigated the effect of Ga on thermal, mechanical and wetting properties of Sn-Zn-Ag-Al containing solders.
The microstructure of Sn-8.5Zn-0.5Ag-0.1Al-xGa (x=0.05~2wt%) solder consists of needle Zn-rich phase and dendritic AgZn3 compound distributed in the Sn matrix. The addition of Ag results in the conversion of the eutectic structure. The results of EPMA analysis indicated that Ga dissolves in Sn matrix as well as in Zn-rich phases, while Al may segregate at grain boundary of β-Sn. The results of DSC (Differential Scanning Calorimetry) analysis reveal that the increase in the Ga% from 0.05% to 2% will lowers the solidus temperature of the solder from 197oC to 183oC and expand the two phase region as well. It is noteworthy that a shoulder can be seen in the DSC curve at higher Ga contents, indicating the formation of hypoeutectic structure. The results of mechanical test showed that with an increase in Ga content up to 1wt% will improve the average tensile strengths and total elongation of the solder. Yet, the total elongation of solders drops from 42% to 20% when Ga content increases from 1 to 2wt%. The facture surface morphology indicates that all the specimens exhibit a ductile dimple pattern.
The investigation of wetting behavior indicates that wetting time and wetting angle decreased while the wetting force increases with an increase in Ga content. The intermetallic compounds formed at the interface after wetting experiment were Al4.2Cu3.2Zn0.7, Cu5Zn8 and AgZn3 in the solder of lower Ga contents, while the CuZn5 forms between Cu5Zn8 and AgZn3 when the composition of Ga approaches 0.5wt%. The aging treatment at 150℃ converts the Al4.2Cu3.2Zn0.7 and CuZn5 compound to Cu5Zn8. The AgZn3 was decomposed and Ag dissolves in Cu5Zn8 after aging for 1000 hours. Addition of Ga into the solder also increases the thickness of Cu5Zn8 compound. Long time aging results in the formation of voids and consequently cracks between IMC and solder.
The results of Thermogravimetric Analysis under O2 atmosphere at 250°C show that an increase in Ga content enhances the oxidation resistance of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders. The cross sectional investigation of solder surface with the aid of focus ion beam (FIB) shows that the thickness of oxidation layer was about 30~100 nm. The oxidation layer was found to be porous at low Ga content. The surface oxide layers were further examined by Auger electron spectroscopy (AES) and thin-film XRD to show that the oxide layer formed was ZnO with the segregation of Al and Ga.

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