本研究藉由高溫熱儲存實驗探討高溫銲料95Pb-5Sn微結構組織以及其與Ni/Cu金屬層銲接後的界面微觀結構變化，同時利用熱浸接合(Hot Dipping)試件評估銲點接合強度與其破斷模式。將直徑1.5mm的銅棒利用無電鍍鎳的方式分別鍍上不同厚度(2μm、1μm、0.5μm)的鎳層，並透過自行熔煉的95Pb-5Sn銲料熔融成液態以熱浸接合的方式製成單一銲點之試件，之後進行200℃高溫熱儲存實驗。
實驗結果顯示95Pb-5Sn在空冷冷卻的析出過程中，固溶於α-Pb基地內的β-Sn會有足夠的時間於基地內緩慢析出，會在α-Pb晶粒中以線條狀且方向大致相同的形貌分佈其中。隨著高溫熱儲存時間的增加晶粒有持續粗大化的現象，且能發現在晶界上之析出物有粗大化(Coarsening)的情形，而晶界處周圍的晶粒內部β-Sn析出物分佈有減少的情況，出現無析出區(Precipitate-Free Zones)。
銲料與Ni/Cu銲點接合界面處生成波浪狀之Ni與Sn的金屬間化合物，而無電鍍鎳層中多餘的P原子會被往IMC底下排，形成一較黑的富鏻層(P-rich Layer)層，隨著熱儲存時間的增加IMC層厚度逐漸成長並且成為為多邊形的顆粒，400小時之後約增長至1.58μm。在400小時高溫熱儲存實驗後2μm、1μm之Ni層依然能保有阻障之能力，但0.5μm厚度鎳層則在經過200小時後即喪失阻障之效果。在剛接合完之銲點的拉伸破壞位置大部份皆在銲料本身，破壞處發生的韌窩狀組織底部相當乾淨並未有任何IMC化合物，隨著高溫熱儲存時間的增長破裂模式產生轉變，至400小時之後發生破壞處皆在界面上出現，破斷處開始出現IMC的金屬間化合物，且銲點接合強度上亦有降低的趨勢。

This research is to discuss the 95Pb-5Sn microstructure and solid/solid interfacial microstructure variation of 95Pb-5Sn solder combining with Ni/Cu UBM. Diffusion barrier Ni layer was coating on copper rods by electroless plating. Using the solders to join two rods whose diameter is 1.5mm. Those solder joints are stored isothermally at 200℃for up to 400 h and evaluate different thickness (2μm、1μm、0.5μm) of diffusion barrier prevent reaction between tin and copper ability and the tensile strength of solder joint.
Experimental results show that the β-Sn precipitates with lamella in the α-Pb due to the slower cooling rate during high temperature stored end of experiment. After 95Pb-5Sn solder are combined with Ni/Cu, Sn atoms react with Ni atoms to form Ni and Sn intermetallic compound. Thus remainder P atoms are exhausted toward electroless Ni layer to produce dark P-rich layer. The thickness of interfacial intermetallic compound and P-rich layer raised with high temperature storage time increasing. After aged at 200℃ for 400h, the 2μm、1μm thickness diffusion barrier remains ability. However after aged at 200℃ for 200h, the 0.5μm diffusion barrier loses function that prevent reaction between tin and copper.
The strength of joint result show that the tensile strength of the joint decrease distinctly after 200℃ thermal storage. The fracture position of solder joints at as-soldered occurred at the inside of solder. However, the fracture position tended to occur at the interfacial intermetallic compound surface with high temperature storage time increase.

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