本文研究選用合適的KrF準分子雷射之能量密度及工作距離(從燒蝕表面到投光鏡頭的距離)，來產生截面寬度漸變的微溝槽。加工參數的選擇根據可預測燒蝕截面的電腦程式。此程式結合Fourier 光學所預測的局部光通量分佈及量測所得到的PI材料之燒蝕率曲線求取燒蝕後的截面位置。我們也由不同的能量密度與工作距離造成的燒蝕結果，歸納出引導參數選用的關係，如：燒蝕結構側壁角度隨能量密度的降低而增加，且雷射光束寬度隨工作距離的增加而增加，但局部光通量會隨工作距離的增加而降低。為說明本方法的應用，本文以V形溝槽、U形溝槽、尖筆形溝槽及光纖接合器為例子，顯示其預測及製作的截面形狀。

　In this work a method selecting suitable fluences and working distances (defined as the distance from the ablated surface to the projection lens) to generate microgrooves with varying width by a KrF excimer lasers is developed. The selection of the machining parameters is based on a computer program predicting the profile of the ablated surface. The program combines the prediction of the local distribution of light flux by the Fourier optics and the curve of ablation rate of polyimide obtained by measurement to calculate the location of the ablated surface. We also induce some guides of the parameter selection from ablation results for various fluences and working distances. These include the correlations that the side wall angle of the ablated structure increases with the decrease of the fluence, the increase of the working distance increases the width of the laser beam, but decreased the local light flux. The predicted and fabricated profiles of the V-groove, the U-groove, the style-groove and the fiber-chip coupling are presented to demonstrate the application of the present method.

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