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研究生： 黃冠仁
Huang, Guan-Ren
論文名稱： CO2雷射加工高分子及玻璃材料的缺陷改善探討
Investigation of defect improvement of CO2 laser micromachining on polymer and glass
指導教授： 鍾震桂
Chung, Chen-Kuei
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年： 2006
畢業學年度： 94
語文別： 中文
論文頁數： 104
中文關鍵詞： 覆蓋層 、雷射切割 、水輔助 、凸塊改善
外文關鍵詞： laser micromachining, water assisted, bulge improvement, cover layer
相關次數： 點閱：94  下載：4 
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    • 　　本文主要研究CO2雷射對高分子材料PMMA和Pyrex玻璃加工時常出現的缺陷並嘗試找出改善的方法。當加工PMMA時，凸塊會在切削邊緣產生。若加上一覆蓋層再進行加工，可以得到較平整的表面且沒有凸塊，在計算上配合熱能與材料汽化熱的觀點所得到的理論值與實驗值對照並發現兩者非常接近，且適用於加覆蓋層的深度預測，在不同的覆蓋層所加工的結果比較可幫助對凸塊形成和被移除的機制有更進一步的瞭解。另外當使用CO2雷射在空氣中直接對Pyrex玻璃加工時容易出現的裂痕、燒焦與凸塊的現象，這些可經由將試片浸於水中再進行切削的水輔助實驗而得到改善。在實驗中分別針對功率、切削速度、水深、光斑尺寸、聚焦位置和覆蓋層的有無來做比較與討論，試找出分別適用於切割和加工微流道的製程參數，希望能達到試片表面平整且無凸塊的目標，以利於晶片接合並提高其氣密度。

    　　The formation and improvement of defects during CO2 laser micromachining polymer, e.g. PMMA and Pyrex glass were studied in this thesis. As PMMA was being laser micromachined, the bulges were formed at the rims of the channel formed by laser beam. By coating a cover layer on PMMA when PMMA was machined, we could get a smooth surface without bulges after removing the layer. A theoretical value of channel depth calculated by ideas of thermal energy and specific energy is very close to the experimental, and the trends are also the same by using cover layer. With different cover layers and comparing the results, we could get more information to understand the phenomena of formation and elimination of bulges. As we used CO2 laser to micromachine Pyrex glass in ambient air, defects like cracks, scorches and bulges could be occurred. We could improve these defects by water-assisted method of immersing glass in water during laser machining. In order to find the optimal experimental parameters for cutting or fabricating microchannels on glass, e.g. laser power, cutting speed, water depth, spot size and cover layer were studied to understand the effect of defect improvement. The two aspects of studies were to achieve the aim of smooth surface without bulges and cracks beneficial for the bonding of microfludic chips and related application.

    摘要................................................I Abstract...........................................II 誌謝..............................................III 目錄...............................................IV 表目錄............................................VII 圖目錄...........................................VIII 符號表............................................XIV 第一章 緒論........................................1 1.1研究動機........................................1 1.2 研究目的.......................................4 1.3 本文架構.......................................5 第二章 文獻回顧....................................7 2.1 高分子材料的加工技術...........................7 2.1.1 傳統高分子材料加工技術.....................7 2.1.2 雷射高分子材料加工技術.....................8 2.2 玻璃的加工技術................................11 2.2.1 傳統玻璃加工技術..........................11 2.2.2 雷射玻璃加工技術..........................13 第三章 實驗方法與步驟.............................17 3.1 雷射加工系統介紹..............................17 3.2 觀察與量測設備介紹............................19 3.2.1 光學顯微鏡................................19 3.2.2 表面粗度儀................................19 3.2.3 共軛焦3D光學表面形貌量測儀................20 第四章 高分子雷射加工凸塊改善與結構控制...........22 4.1 試片材料與雷射加工機制介紹....................22 4.2 雷射加工實驗流程..............................26 4.2.1 無覆蓋層PMMA雷射加工......................26 4.2.2 加覆蓋層PMMA雷射加工......................28 4.3 比較不同雷射加工方式..........................32 4.3.1 無覆蓋層PMMA之雷射加工....................32 4.3.2 加覆蓋層PMMA之雷射加工....................36 4.4 以數學式預測加工深度..........................46 第五章 玻璃雷射加工缺陷改善.......................56 5.1 雷射與試片材料................................58 5.2 雷射加工實驗流程..............................59 5.3 空氣中的雷射加工實驗..........................61 5.3.1 空氣中雷射加工的缺陷......................62 5.3.2 空氣中雷射加工參數的影響..................65 5.4 水輔助雷射加工實驗............................67 5.4.1 水輔助雷射加工對缺陷的改善................68 5.4.2 不同水深的影響............................70 5.4.3 水輔助雷射加工參數的影響..................74 5.5 在水中不同加工方式實驗........................78 5.5.1 不同光斑大小的影響........................78 5.5.2 變化聚焦面高度的差異......................85 5.5.3 貼上膠帶加工比較撕除前後的差異............88 第六章 結論與未來方向.............................92 6.1 結論..........................................92 6.2 未來方向......................................94 參考文獻...........................................97 簡歷..............................................104

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