本文主要分析具鋁薄膜之矽晶圓在磨削加工時的特徵且根據實驗結果找出一套經驗公式，此公式可以預測在不同鍍膜厚度下比磨削能與最大切屑厚度的關係。為了有效控制加工時的實際切深本文同時結合工件剛性、砂輪結合劑性質與機台剛性推導出一套可以成功預測實際切深與設定切深之間差異的模式，在本文中採用乾式平面研磨的方式，利用高號數之鑽石砂輪針對矽晶圓以不同結合劑做驗證。
針對具鋁薄膜之矽晶圓在磨削加工時的分析最主要著重於探討其比磨削能、磨削力、臨界切深、徑向磨削係數與表面形貌之特徵，結果發現鋁薄膜越厚時，比磨削能與磨削力皆呈現越大的趨勢，而臨界切深和徑向磨削係數則相反。

This thesis analyzes characteristics of silicon substrate coated with aluminum thin film in grinding process and an empirical formula facilitating the prediction the specific grinding energy under varying thickness of maximum undeformed chip and aluminum thin film was developed based on the experimental results. For controlling the actual cutting depth more precisely, this thesis developed a model considering work piece hardness, bonder material of the wheel and machine stiffness. The model can predict the difference between nominal cutting depth and actual cutting depth. It was verified by experiments with different bond material of the wheel in vertical grinding with silicon.

Analysis of characteristics of silicon substrate coated with aluminum thin film in grinding process mainly focused on specific grinding energy, grinding force, critical cutting depth, ratio of normal and tangential grinding forces, and surface integrity, the experimental results show that thicker aluminum film can cause larger specific grinding energy and grinding force, but smaller critical cutting depth and ratio of normal and tangential grinding forces.

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