| 研究生: |
李婉菁 Lee, Wan-Ching |
|---|---|
| 論文名稱: |
製造商與客戶於系統級封裝屏蔽設計之價格協商 Price Bargaining between Manufacturer and Customer in Shielding Design of System-in-Package |
| 指導教授: |
謝中奇
Hsieh, Chung-Chi |
| 學位類別: |
碩士 Master |
| 系所名稱: |
管理學院 - 工業與資訊管理學系碩士在職專班 Department of Industrial and Information Management (on the job class) |
| 論文出版年: | 2019 |
| 畢業學年度: | 107 |
| 語文別: | 中文 |
| 論文頁數: | 51 |
| 中文關鍵詞: | 系統級封裝 、電磁屏蔽 、納許議價模型 |
| 外文關鍵詞: | System-in-Package, Shielding, Nash bargaining model |
| 相關次數: | 點閱:52 下載:0 |
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全球電子產業市場已步入成長平緩的高原期,電子產品由過去標準化規格的個人電腦轉變為客製化規格的行動裝置,加上新興市場崛起,低價化與短生命週期的電子產品成為趨勢。近年來全球邁入物聯網 (Internet of Things, IoT) 的資料經濟時代,看好穿戴式裝置、智慧家庭產品及個人健康照護等的未來成長性,電子產品朝可攜、省電、高效能、小型化等構面發展演進,此將為半導體產業鏈帶來相關挑戰與商機。
而半導體為電子產品的重要零組件,物聯網產品的元件與智慧型手機具備相同基礎功能外,更強調輕薄短小,因此系統級封裝 (System in Package, SiP) 為產品微小化的關鍵技術。電子產品可能在使用過程中會產生電磁輻射,甚至干擾其他裝置之正常運作,甚至影響人體健康,在進行電磁屏蔽開發設計時,除了要考量外觀尺寸和訊號屏蔽,更重要的是價格考量,因為價格直接影響製造商與客戶彼此的獲利。
本研究在一間製造商與一間客戶的供應鏈結構中,針對單一系統級封裝產品,應用於兩種屏蔽設計,透過納許議價模型來分析探討製造商與客戶針對不同屏蔽設計的系統級封裝產品價格協商,取得雙方獲利最大的設計,縮短產品的研發時間和報價週期,快速回應客戶需求,搶得市場先機。
研究結果顯示,不同屏蔽設計選擇,因製造商製造流程不同,會產生不同封裝尺寸,進而有個別的製造商封裝成本;製造商對不同客戶的議價力,除了直接影響製造商對客戶的售價,亦會對製造商和客戶雙方獲利產生影響,進而影響最終屏蔽設計選擇。
In the initial request for quotation (RFQ) stage, this study intends to solve the price negotiation strategy of a manufacturer and its customer through a Nash bargaining model with asymmetric bargaining power. This study is based on a simple supply chain in semiconductor industries in which an IC packaging manufacturer provides different
shielding designs of System-in-Package (SiP) that might benefit itself and its customer. The key results of this study are: First, while the same RFQ has the same function and bill of materials (BOM), designs with different SiP package sizes and different shielding designs result in different package manufacturing costs. Second, the results from a case study reveal that manufacturing costs have a negative effect on the manufacturer’s profit and the customer’s profit, the customer’s selling price has a positive effect on the manufacturer's profit and the customer's profit, and the manufacturer's bargaining power
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校內:2024-07-26公開