MID (Molded interconnect device，MID)技術不同於傳統的印刷電路板，優勢是能將機械與電子功能整合於單一塑膠零件上，更提供了三維立體網狀電路的優越性，使得產品的功能提升、外觀多元化以及微小化，也有效節省了空間與組裝時間。在MID技術之兩段式射出成型具有製程簡單化、快速化、低成本、易加工等的優勢，但兩材料的結合強度與塑膠材料金屬化的性質，是此製程存在的問題。所有的結構物都必須承受一定的外力，當有外力負載時結構要能承受且不能斷裂，這就是結構強度的要求。本論文使用有限元素軟體ANSYS模擬拉伸與彎曲，比較PC/ABS與FR4兩種不同材料的基板，在拉伸的軸向拉力和彎曲的均勻分佈力的負載下，觀察銅線、銅線與基板界面之間應力的變化。

The MID (Molded interconnect device, MID) technology is different from the traditional printed circuit boards. The advantage is combing with mechanical and electrical functions in a single plastic parts, also provides the advantages of three-dimensional mesh circuit, making enhancement of the product , the appearance of pluralism and miniaturization, also effectively saves space and assembly time. Two-component injection molding of MID has the advantages of simple process, fast, low cost, easy processing, but the bonding strength between the two materials and the character of metallization is the problems of process. All structures must support external force, the structure should support and can’t fracture under loading conditions , which is the requirement of structural strength requirement. This study is using finite element software ANSYS simulation of tensile and bending, compare the PC / ABS substrate with FR4 substrate. Observe the stress of copper wire and the interface of copper wire and substrate under the axial force and uniformly load .

[1]Y. Zhuo, X. L. Du, and J. Q. Zhu, "Three-dimensional automatic routing for the design of moulded interconnect devices," International Journal of Computer Integrated Manufacturing, vol. 24, pp. 302-311, 2011.
[2]A. Islam, H. N. Hansen, P. T. Tang, and J. Sun, "Process chains for the manufacturing of molded interconnect devices," International Journal of Advanced Manufacturing Technology, vol. 42, pp. 831-841, Jun 2009.
[3]張弘超, "射出成形製程參數對為特徵孔洞充填影響," 成功大學航空太空工程研究所碩士論文, 2004.
[4]陳駿逸, "雙料射出成型在內嵌式連接裝置之研究," 成功大學航空太空工程研究所碩士論文, 2011.
[5]K. Feldmann, F. Schüßler, and P. Wölflick, "MID and Foil –Technologies for Flexible Circuit Carriers," 6th International Congress on Molded Interconnect Devices, pp. 1-15, 2004.
[6]K. Feldmann and F. Pohlau, "MID in the Automotive Industry - Potentials, Benefits and Applications," Twenty-Second IEEE/CPMT Electronics Manufacturing Technology Symposium, pp. 76 - 81, 1998.
[7]N.N, "Technologie 3D-MID -- Räumliche elektronische Baugruppen -- Herstel-lungsverfahren, Gebrauchsanforderungen, Materialkennwerte," Carl Hanser Verlag, 2004.
[8]Q. J. Yang, G. H. Lim, R. M. Lin, F. F. Yap, H. L. J. Pang, and Z. P. Wang, "Experimental Modal Analysis of PBGA Printed Circuit Board Assemblies.," IEEE/CPMT Electronic Packaging Technology Conference, pp. 290-296, 1997.
[9]A. Arriaga, J. M. Lazkano, R. Pagaldai, A. M. Zaldua, R. Hernandez, R. Atxurra, and A. Chrysostomou, "Finite-element analysis of quasi-static characterisation tests in thermoplastic materials:Experimental and numerical analysis results correlation with ANSYS," Polymer Testing, vol. 26, pp. 284-305, May 2007.
[10]L. Li, S. M. Kim, S. H. Song, T. W. Ku, W. J. Song, J. Kim, M. K. Chong, J. W. Park, and B. S. Kang, "Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite," Journal of Materials Processing Technology, vol. 201, pp. 746-750, May 2008.
[11]http://asia.matweb.com/reference/tensilestrength.asp.
[12]陳何啟, "複合材料圓管接頭受彎矩作用下之應力分析," 逢甲大學機械工程研究所碩士班碩士論文, 2006.
[13]陳精一 and 蔡國忠, "電腦輔助工程分析 : ANSYS 使用指南," 全華科技圖書股份有限公司, 2000.
[14]王栢村, "電腦輔助工程分析之實務與應用," 全華科技圖書股份有限公司, 2001.
[15]陳申岳, "ANSYS有限元素法軟體-實物產品可靠度分析," 全華科技圖書股份有限公司, 2004.
[16]陳精一, "ANSYS電腦輔助工程分析," 全華科技圖書股份有限公司, 2000.
[17]林樹均, 葉均蔚, 劉增豐, and 李勝隆, "材料工程實驗與原理," 全華科技圖書股份有限公司, 1990.
[18]徐志銘, "電子封裝之熱疲勞壽命模擬與測試," 逢甲大學航太與系統工程學系碩士班碩士論文, 2007.