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研究生: 張誠泰
Zhang, Cheng-Tai
論文名稱: 以田口方法最佳化不銹鋼316L損傷修補之定向能量沉積製程參數研究
Optimization of Directed Energy Deposition Process Parameters for SS316L Damage Repair Using the Taguchi Method
指導教授: 黃聖杰
Hwang, Sheng-Jye
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2025
畢業學年度: 113
語文別: 中文
論文頁數: 201
中文關鍵詞: 定向能量沉積製程逆向工程3D掃描儀田口灰關聯分析孔隙率沉積路徑規劃修補
外文關鍵詞: Directed energy deposition, Damage repair, Taguchi grey relational analysis, Toolpath planning, UB and CHB method
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  • 積層製造為近年新興之製程之一,與傳統加工方式相比,採用加法製造原理,將材料沉積於指定位置後以雷射熔融凝固形成產品。此製程具節省材料、縮短加工週期與成形複雜幾何等優點,主要技術包含:定向能量沉積與選擇性雷射熔融。
    為提升沉積品質,以田口灰關聯分析方法作為實驗設計工具,進行多品質製程因子組合之優化實驗。由分析結果可得五項控制因子:雷射功率、重疊程度、供粉量、掃描速度及雷射頭抬升高度對三項品質:沉積效率、沉積速率及孔隙率皆具有顯著影響,據此決定出能兼顧各品質需求之最佳因子組合。接著,利用實驗數據進行變異數分析,以辨識對各品質影響最顯著之因子,並透過一次一因子實驗進一步微調最佳化製程參數組合。為驗證該最佳參數組合對沉積品質之影響,本研究進行拉伸試驗,結果顯示沉積試片之抗拉強度僅較原始材料下降約10%,證實所建立之最佳製程參數具備良好可行性。
    此外,為進一步提升DED在損壞工件修補中的適用性,本研究結合3D掃描與逆向工程建立損壞工件之精確STL模型,並以U-shaped boundary(UB)與Convex-hull boundary(CHB)兩種演算法界定清創範圍。透過沿y軸0.5 mm之切片,可有效辨識損傷區域並規劃清創路徑,確保加工後具備足夠沉積空間。UB方法搭配固定Z-offset之沉積路徑完成實作驗證,結果顯示界面熔接緊密且堆疊品質良好;CHB方法則提出適用於平板型損傷邊界之分區與路徑規劃策略,作為後續推廣至更高幾何變異修補場景之基礎。
    將最佳參數應用於工件修補中,首先於Mastercam進行路徑規劃,並結合後處理器設定與雷射系統專用M碼生成可於設備上執行之NC程式。於UB方法界定之修補區域內,本研究以Z-offset 45%搭配逐層交替方向、錯開層間起點及順逆銑交替掃描等策略進行沉積,以避免局部熱累積並改善供粉不均造成的表面凹凸,使堆疊形貌更為穩定一致。至於CHB方法,由於邊界幾何較為複雜,本研究提出底部螺旋路徑平整凹陷並以之字形路徑填補之策略;惟此路徑僅於軟體環境規劃,尚未實際驗證。
    最終,針對UB實作修補區域所進行之橫截面分析顯示,沉積層與基材之間形成緊密且均勻的冶金結合,界面完整且未見孔洞或未熔合缺陷,充分驗證本研究所建立之DED修補流程具備高度可行性與可靠性,並展現其於實際工件修補應用之潛力。

    Additive manufacturing (AM) has emerged as a promising technology, building components layer by layer by depositing material, melting it with a laser, and allowing it to solidify. Compared with conventional subtractive machining, AM offers reduced material waste, shorter processing cycles, and the ability to fabricate complex geometries. Two major AM methods dominate industrial applications: Directed Energy Deposition (DED) and Selective Laser Melting (SLM).
    To improve deposition quality, the Taguchi method combined with Grey Relational Analysis (GRA) was employed to optimize multiple quality characteristics simultaneously. Five process parameters, namely laser power, overlap ratio, powder feed rate, scanning speed, and Z-offset, were investigated with respect to three quality responses: cladding efficiency, deposition rate, and porosity. Analysis results indicated that all five parameters significantly influenced the selected quality characteristics, and an optimal parameter combination was identified to achieve balanced performance. Subsequently, analysis of variance (ANOVA) was conducted to determine the significance of each factor, followed by one-factor-at-a-time (OFAT) experiments for further parameter refinement. Tensile testing was performed to validate the optimized parameter set, and the results showed that the ultimate tensile strength of the deposited specimens was only approximately 10% lower than that of commercial SS316L, demonstrating the feasibility of the optimized process parameters.
    To further enhance the applicability of DED for damaged component repair, this study integrated 3D scanning and reverse engineering techniques to reconstruct an accurate STL model of a damaged workpiece. Two defect enclosure strategies, namely U-shaped Boundary (UB) and Convex-Hull Boundary (CHB), were proposed to define the debridement region. By slicing the model along the y-axis at intervals of 0.5 mm, damaged regions could be accurately identified and machining toolpaths generated to ensure sufficient deposition space after debridement. The UB method was experimentally validated using a fixed Z-offset deposition strategy, and the results demonstrated good interfacial bonding and stable deposition quality. In contrast, the CHB method was developed as a repair planning strategy for plate-type damaged regions, incorporating partition-based and toolpath-planning concepts for future applications involving more geometrically complex repair scenarios.
    The optimized parameters were applied to repair processes. For the UB-based repair region, a combination of 45% Z-offset, alternating scanning directions, staggered starting points, and bidirectional scanning was employed to reduce thermal accumulation and improve surface uniformity. For the CHB method, a spiral toolpath was used to level the bottom region, followed by a zigzag strategy for material deposition, although this approach was only validated in simulation. Cross-sectional observations confirmed that the UB-based repair achieved sound metallurgical bonding without defects such as porosity or lack of fusion.
    Overall, this study establishes an integrated DED repair framework combining reverse engineering, algorithm-assisted boundary design, Taguchi–GRA optimization, and path-planning strategies, demonstrating strong potential for practical repair of high-value metallic components.

    摘要 I Extend Abstract III 誌謝 LII 目錄 LIV 表目錄 LIX 圖目錄 LXI 符號說明 LXV 第一章、緒論 1 1.1 前言 1 1.1.1 積層製造 1 1.1.2 定向能量沉積製程(DED) 2 1.2 研究動機 4 1.3 文獻回顧 5 1.3.1 3D 掃描在逆向工程之應用 5 1.3.2 DED製程因子與品質研究 6 1.3.3 實驗設計與分析方法 7 1.3.4 路徑規劃與DED產品形貌 9 1.4 研究目的 12 1.5 論文架構 13 第二章、理論背景與研究方法 15 2.1 雷射加工原理與光束品質指標 15 2.1.1 雷射工作原理 15 2.1.2 光纖雷射 16 2.1.3 雷射光束品質指標之定義與物理意義 17 2.2 修補幾何建構方法 18 2.2.1 受損基板製備與3D掃描 18 2.2.2 U-shaped boundary method包圍幾何圖形與加工路徑 21 2.2.3 Convex-hull boundary method包圍幾何圖形與加工路徑 26 2.3 田口實驗設計方法 33 2.3.1 田口方法概述 33 2.3.2 實驗設計與控制因子 34 2.3.3 固定因子 42 2.3.4 產品品質 43 2.3.5 訊號雜訊比(Signal-to-noise ratio, SNR) 46 2.3.6 L16直交表 48 2.4 變異數分析(ANOVA) 51 2.5 灰關聯分析方法[40] 54 第三章、實驗設備與材料 57 3.1 實驗設備 57 3.1.1 DED實驗設備 57 3.1.2 雷射光束特徵 64 3.2 實驗材料 66 3.2.1 不鏽鋼316L (SS316L) 66 3.2.2 SS316L粉末品質 67 第四章、實驗設計與結果分析討論 69 4.1 初步實驗 69 4.1.1 單層單道沉積實驗結果 69 4.1.2 多層多道沉積實驗結果 73 4.2 以沉積效率(CE)為品質之田口實驗結果分析 74 4.2.1 實驗結果 74 4.2.2 結果分析 75 4.2.3 變異數分析 78 4.3 以沉積速率(DR)為品質響應之田口實驗結果分析 79 4.3.1 實驗結果 79 4.3.2 結果分析 80 4.3.3 變異數分析 82 4.4 以孔隙率(Pt)為品質響應之田口實驗結果分析 83 4.4.1 實驗結果 83 4.4.2 結果分析 86 4.4.3 變異數分析 88 4.5 田口灰關聯分析法 89 4.5.1 經處理後之數據 91 4.5.2 結果分析 92 第五章、一次一因子實驗與拉伸實驗 94 5.1 一次一因子實驗 94 5.1.1 實驗目的與設計 94 5.1.2 實驗結果 95 5.2 拉伸實驗 98 第六章、沉積路徑規劃與工件製作 103 6.1 沉積路徑生成工具與工件設計 103 6.1.1 Mastercam CAD/CAM 103 6.1.2 修補工件幾何 104 6.2 路徑規劃 107 6.2.1 路徑規劃流程 107 6.2.2 路徑規劃(U-shaped boundary method) 108 6.2.3 路徑規劃(Convex-hull boundary method) 110 6.2.4 Mastercam後處理器 113 6.3 目標工件沉積結果(U-shaped boundary method) 114 第七章、結論與未來展望 118 7.1 結論 118 7.2 未來展望 121 參考文獻 122 索引 130

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