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研究生: 宋進祥
Sung, Chin-Hisang
論文名稱: 積層陶瓷電容器之可靠度評估與失效分析
Reliability Evaluation and Failure Analysis for Multilayer Ceramic Capacitors(MLCC)
指導教授: 陳榮盛
Chen, Rong-Sheng
學位類別: 碩士
Master
系所名稱: 工學院 - 工程科學系碩士在職專班
Department of Engineering Science (on the job class)
論文出版年: 2006
畢業學年度: 94
語文別: 中文
論文頁數: 93
中文關鍵詞: 有限元素法加速壽命試驗積層陶瓷電容器可靠度
外文關鍵詞: Finite Element Method (FEM), reliability, Multi-layer Ceramic Capacitor(MLCC), Highly Accelerate Life Test (HALT)
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  • 在科技快速變遷的時代,產品的生命週期逐漸縮短,產品從研發試作至量產上市的時間愈縮愈短,如何由產品先行試作至快速量產,並確保產品可靠度無虞是企業的核心競爭力之一。因此,如何在短時間內了解產品的壽命狀況與其可靠度的變化行為,必須擬定一套方法,而加速壽命試驗則成為業界之重要對策。
    本文將Prokopowisz 和 Vaskas提出的加速壽命試驗理論,應用於積層陶瓷電容器(Multi-layer Ceramic Capacitor, MLCC)的加速壽命測試與可靠度分析之研究。配合有限元素法模擬其電容器內部結構應力大小與產品壽命之可靠度關係,以建立應力與壽命關係,並應用於其它尺寸與電容量的電容器,即先以有限元素法分析新結構體的應力,再推估產品之壽命,以縮短產品試作至量產的時間。總之,藉此可預測高應力低壽命之問題,進而提升產品之可靠度。

    Living in an era when technology advances fast, product life cycle becomes

    shorter and shorter. From R&D trail run to mass production, one of the core

    competitive strength for any industry, depends on how fast it takes to advance a

    product from trail run, to the final mass production stage. Therefore, to

    understand the transformation on product life cycle and product reliability, it is

    necessary to mark plans accordingly. One of the important strategy is to conduct

    the Highly Accelerate Life Test(HALT).

    This article will present the research on HALT and product reliability

    analysis, using the theory suggested by Prokopowisz and Vaskas which applied

    on Multi-layer Ceramic Capacitor(MLCC). To establish the relation between

    stress and life cycle, and using it on other sizes of the MLCC, is to model the

    inner structural relation between stress effects with the reliability of product life

    cycle on MLCC .In other words, by using Finite Element Method(FEM) to

    analysis the stress within the new structure the product life cycle can be

    predicted in order to shorter the duration from trail run to mass production.

    Above all, this could predict the problem of higher stress and shorter life

    cycle, making one step forward to increase product reliability.

    目 錄 中文摘要----------------------------------------------------------------------------------Ⅰ 英文摘要----------------------------------------------------------------------------------Ⅱ 誌謝----------------------------------------------------------------------------------------Ⅳ 目錄----------------------------------------------------------------------------------------Ⅴ 表目錄-------------------------------------------------------------------------------------Ⅸ 圖目錄-------------------------------------------------------------------------------------Ⅹ 符號說明-------------------------------------------------------------------------------ⅩⅣ 第1章 緒論------------------------------------------------------------------------------------1 1.1研究動機---------------------------------------------------------------------------------- 1 1.2研究目的---------------------------------------------------------------------------------- 2 1.3研究範圍與方法-------------------------------------------------------------------------2 1.3.1研究範圍------------------------------------------------------------------------------------- 2 1.3.2研究方法------------------------------------------------------------------------------------- 3 1.4文獻回顧---------------------------------------------------------------------------------- 4 1.5論文架構---------------------------------------------------------------------------------- 6 第2章 理論基礎-----------------------------------------------------------------------------7 2.1積層陶瓷電容器失效型態---------------------------------------------------------- 7 2.1.1電容器失效型態的種類--------------------------------------------------------- 7 2.1.2解決策略---------------------------------------------------------------------------- 9 2.2積層陶瓷電容器簡介----------------------------------------------------------------10 2.2.1積層陶瓷電容器製造流程----------------------------------------------------13 2.2.2積層陶瓷電容器的分類--------------------------------------------------------15 2.2.3積層陶瓷電容器電容值之計算-----------------------------------------------16 2.3可靠度理論------------------------------------------------------------------------------18 2.3.1可靠度的定義-----------------------------------------------------------------------18 2.3.2可靠度函數與失效率函數--------------------------------------------------------19 2.3.3浴缸型失效模式-------------------------------------------------------------------------------21 2.3.4常用壽命分佈---------------------------------------------------------------------- 23 2.3.5產品可靠度的估計法-------------------------------------------------------------28 2.3.6加速壽命試驗模式----------------------------------------------------------------- 29 2.4加速測試方法----------------------------------------------------------------------------31 2.4.1熱應力-------------------------------------------------------------------------------- 31 2.4.2非熱應力------------------------------------------------------------------------------ 32 2.4.3複合應力-------------------------------------------------------------------------------32 2.5失效判訂準則----------------------------------------------------------------------------34 第3章 實證研究-----------------------------------------------------------------------------35 3.1實驗方式----------------------------------------------------------------------------------36 3.1.1試件規格-----------------------------------------------------------------------------37 3.1.2儀器設備-----------------------------------------------------------------------------37 3.1.3實驗步驟-----------------------------------------------------------------------------41 3.2實驗分析流程---------------------------------------------------------------------------45 3.3電容值/絕緣阻抗(Cap/IR)初值量測------------------------------------------------46 3.4電容值之初值量測分佈情形-------------------------------------------------------47 3.5高加速壽命測試-----------------------------------------------------------------------53 3.6應力分析模擬與平均破壞時間(MTTF)------------------------------------------ 68 3.7實例驗證------------------------------------------------------------------------------- 78 第4章 結論與展望------------------------------------------------------------------------83 4.1結論----------------------------------------------------------------------------------------83 4.2展望----------------------------------------------------------------------------------------84 參考文獻--------------------------------------------------------------------------------------85 附錄一積層陶瓷電容器編碼原則及尺寸規格-----------------------------------------------88 附錄二 EIA(Electronic Industries Alliance)---------------------------------------------- 89 附錄三韋伯分佈之機率密度函數、可靠度函數與失效率函數演算過程-----90 附錄四韋伯分佈和韋伯斜率(Weibull slope)之說明----------------------------------91 自述----------------------------------------------------------------------------------------------93

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