為滿足電子產品輕薄短小的要求，覆晶技術逐漸取代打線技術成為目前電子構裝的明日之星，其中凸塊外觀的檢測便是擔任凸塊製程品質的把關者。
現今產業界對錫鉛凸塊高度三維的量測以雷射量測為居多，由於雷射量測有其技術上的限制及目前面臨的諸多問題，本研究試著採用共焦顯微鏡搭配CCD連續影像的擷取，進而由數學運算式來求得凸塊的高度近似值。
最後實驗的結果與理論吻合且得到非常接近實際凸塊的高度值，此結果滿足業界對凸塊精度檢驗且快速檢驗的要求。另外透過各種不同條件的比較，了解到硬體上的差異，影像取樣區域的大小及取樣的樣品數對實驗結果的影嚮。

To satisfy the trend of the electronic products size reduced and weight thinned, The “Flip Chip Technology” has instead of the ”Wire Bonding Technology” progressively and becomes the primary selection for IC package process. Bump exterior inspection process is the important monitor for the quality control of bump manufactured process.

Currently, the Laser Technology is the most popular choice for 3D Lead solder bump height measurement on the production. But due to the existed laser technology limitation and encountered issues, the laser measurement method is not fully suitable for further application requirement on bump development roadmap. So, here we try to apply the “Confocal Microscope” technology and collocate with CCD for the continued image captured then through mathematical calculation to get the closed bump height.

The final experiment results conform to the “Confocal Microscope Method”, and achieve the equivalent result with actual bump height. In additional, the result is not only satisfied the measurement accurate specification but the high throughput required expectation. The last, through the varied conditions comparison, we understand the impacts come from equipment variation, image pixel area selection and sample size selection.

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