印刷電路板在製程中，往往因複合材料及設計方式而導致尺寸變化不均勻的變形，導致鑽孔不準，影響孔偏及短路問題，為了改善這些問題，需先進行對這些設計的了解，再利用製程調控的方式進行改善。
本論文研究目的在於探討印刷電路板在經過熱壓處理後，產生經緯向的尺寸變化之行為表現，並找出最佳製程參數條件以降低尺寸變化的不均勻性。由於印刷電路板板材為一種含銅之複合材料，在受到高溫高壓下因其熱膨脹係數的不同會產生尺寸變化不均勻狀況。本研究係以板厚、殘銅率以及裁板尺寸等組合先使用全因子實驗找出其設計對變形之趨勢，再以溫度、壓力、升溫速率及降溫速率等壓合製程條件搭配板框設計，並利用田口實驗找出最佳及穩健之製程條件，最後導入實務電路板中，以實際雷射作業進行偏移確認。
透過實驗結果得到殘銅率與板厚設計趨勢對印刷電路板尺寸變化具有負面影響，以及使用板框及降低升溫速率及降溫速率等壓合製程條件有助於降低印刷電路板尺寸變化不均勻狀況。

In the manufacturing process, the printed circuit board is often deformed due to non-uniform dimensional changes, caused by the composite materials and design methods. It will lead to the hole bias and short circuit. To improve these problems, it is necessary to understand these designs and then to explore the adjustment of the process parameters to achieve the improvement. The purpose of this study is first to investigate the behavior of dimensional changes in printed circuit boards after hot-pressing based on the different combinations of the working parameters, board thickness, residual copper ratio, and panel size. Afterwards, the pressing process parameters (temperature, pressure, heating rate, cooling rate), matching up with the frame design, are used to find out their optimal recipe to control the non-uniformity of dimensional changes. Through experimental results, the design trends of residual copper ratio and board thickness have a negative impact on the PCB dimensional change, and the use of the frame design and the lowering of the heating rate and cooling rate, etc., can help reduce the non-uniform dimension change of the printed circuit board.

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