自工業革命以來，材料發展逐漸朝向輕、薄、短、小、易傳輸且無毒化、可回收再利用為重要考量。IC的發展趨勢為：接點數增加、訊號速度快、功率大幅上升及腳距縮小。伴隨著IC的發展趨勢，無鉛焊錫材料也因應構裝型態也必須朝向間距微小化、多腳化及薄型化的方向發展，才能滿足市場的需求。
本研究採用化學還原法(Chemical reduction method)來製備Sn-3.5Ag-0.5Zn無鉛焊錫合金。在常溫常壓下，使用硫酸錫、硝酸銀、硝酸鋅為前驅物，NaBH4當作還原劑來進行反應，並在反應過程中添加PVP作為保護劑，於反應完成後得到Sn-3.5Ag-0.5Zn合金的沉澱物。在經過清洗、過濾、乾燥等製程後，使用XRD進行結構鑑定，並在掃描式電子顯微鏡及穿透式電子顯微鏡下進行觀測，發現此方法可以成功地得到粒徑分佈在10至30nm的錫-銀-鋅合金；經由不同的條件，可以比較NaBH4及PVP添加量對形成的錫-銀-鋅合金所造成的影響並且探討反應機制的關係。實驗顯示NaBH4及PVP及溫度量化好的條件。

Since industrial revolution, the trend of material development gradually becomes lighter, thinner, shorter and smaller. Now portable, non-toxic, recyclable properties are the keys. The trend of IC development has innovated into more connecting spots, smaller lead pitch, better performance, faster signal amd smaller form factors, as well as free-lead solder meterial. With the growing environmental concern, the latter is getting more attention.
This research makes nano-sized Sn-3.5Ag-0.5Zn, lead-free solder alloy by using “Chemical Reduction Method”. Keu results are as follows. Under room temperature and atmospheric pressure, the Sn-3.5Ag-0.5Zn, lead-free solder alloy is synthesized by using SnSO4, AgNO3, Zn(NO3)2 as precursor and NaBH4 as reductant and PVP as protection agent during reaction. Through refining and processing of the Sn-3.5Ag-0.5Zn alloy first and then by cleaning, filtering and drying of the Sn-3.5Ag-0.5Zn precipitation, the alloy with sizes ranging from 10 to 30 nm can be obtained.
In addition, through comparing the different reactions of Sn-3.5Ag-0.5Zn alloy by adding different quantity of NaBH4 and PVP. the significance for which NaBH4, PVP and temperature interplay is described.

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