隨著微衛星應用快速發展，高密度電子元件在環境嚴苛與空間有限的條件下，散熱問題日益受到重視。熱電致冷器(TEC)因其固態設計、無振動且壽命長等特性，已成為太空熱控制系統中理想的選擇。
本研究首先探討二維材料作為熱電材料的應用潛力，運用數值模擬結合二維材料所構成之薄膜式TEC進行分析，接著探討幾何參數對致冷器的影響。最後配合實際製程需求，針對縮小後的三層圓形設計進行最佳化分析。
模擬結果顯示，二維材料MoS2與SnSe因具備高賽貝克係數、優異的導電性與低熱導率，可有效提升致冷性能，使TEC的冷熱端溫差達18.3 °C，約為矽基材料的8倍之多。幾何設計方面，圓形設計因熱流分佈均勻，其冷端溫度可達4.8 °C；而多層結構則能進一步提升最大溫差，提升至45.17 °C，但也造成操作電流的範圍變小。
另外，結合響應曲面法與非支配排序基因演算法-Ⅱ，針對縮小後的三層圓形TEC進行幾何最佳化。所獲得之帕雷托前緣能依照使用者需求，在致冷性能與材料使用量之間作出適當的取捨與權衡。

With the growth of microsatellite applications, effective thermal management in compact, harsh environments is crucial. Thermoelectric coolers (TECs), with their solid-state reliability, are ideal for space. This study investigates 2D materials in TECs through thin-film simulations, focusing on geometric design.
Using MoS2 and SnSe to enhance cooling performance, achieving a ΔT of 18.3 ℃, which is approximately eight times higher than silicon-based TECs. Circular designs and multistage structure further improve cooling, with cold-end temperatures reaching 4.8 ℃ and a maximum ΔT of 45.17 ℃.
A triple-stage circular TEC was optimized using response surface method and non-dominated sorting genetic algorithm-Ⅱ, producing a pareto front to balance cooling performance and material usage.

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