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研究生：	曾雅珮 Tseng, Ya-Pei
論文名稱：	IC測試承座探針接觸阻抗分析 Analysis of IC Socket Spring Pin Contact Resistance
指導教授：	周榮華 Chou, Jung-Hua
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系碩士在職專班 Department of Engineering Science (on the job class)
論文出版年：	2010
畢業學年度：	98
語文別：	中文
論文頁數：	79
中文關鍵詞：	BGA元件、測試基座、彈簧探針
外文關鍵詞：	Device testing, IC socket, Spring pin, Contact resistance
相關次數：	點閱：122 下載：17
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隨電子產品日新月異的更新進步，隨受市場變動壓力由上游晶圓廠到下游的封裝測試也朝向產品輕、薄、微小化而努力。IC後晶圓到切割封裝C過程中，歷經層層風險，測試工程內主要將封裝後產品進行再次驗證，並確保產品功能性良好。
在測試工程內，測試承座扮演承上轉下角色，其接觸探針也是佔成本耗材高比例之汰品。測試探針損耗除增加其測試成本之外，影響測試結果誤判，為了讓測試品質與成本控制更加優良與便捷，本研究利用計數器置入IC測試基座上，紀錄BGA IC元件接觸次數，藉由定荷重裝置在定電壓、定電流下量取接觸電阻，觀察其電阻變化。其中利用計數器協助統計其接觸次數多寡，觀察全新探針與使用接觸次數50000次、118000次、180000次等其電阻值變化，經由SEM觀察後發現其表面電弧狀況將其影響整體電性表現，不因測試使用次數增多而其電性表現較差。將其方法運用於生產測試中可管控與推論其探針失效狀況。
關鍵字﹕BGA元件、測試基座、彈簧探針

The manufacturing of an IC electronic device goes through various processes from wafer fabrication to assembly, experiencing different levels of tresses and risks. The final test validates the functionality of each DUT (Device Under Test) in the package form before its shipment.

BGA sockets with spring pins acting as an interface between the load board and the DUT during testing are high-price consumables. The quality of sockets determines the yield of the IC testing. However, the performance of a socket decreases with the increasing number of touches and can cost a lot if it is replaced wrongly.

Therefore, to get the balance between quality and cost of sockets, a counter embedded in the BGA socket is used to record the number of touches between the pins and solder balls in this study. Thus, wear of the four contact points of the spring pin to the solder ball can be monitored to see its effect on the contact resistance real time.

The results show that there is variation in contact resistance even in new pins. Thus, the time of replacing individual pins due to wear varies. The increase in contact resistance is mainly caused by wear and arcing as the number of touches increase. On the other hand, the spring force of individual pins is not significantly affected by the number of touches; namely, the spring force is not a good indicator of pin wearing. A meter system is designed and deployed in this study to monitor the increase in contact resistance so that the socket quality can be assured.

Keywords: Device testing, IC socket, Spring pin, Contact resistance

摘要..................................................I 
Abstract..................................................II 
致謝.................................................. III 
文目錄...................................................IV 
圖目錄...................................................VII 
表目錄..................................................XIII 
英文縮寫對照表...........................................XIV 
第一章 緒論 ............................................... 1 
1 前言...............................................1 
2 研究動機............................................3 
3 研究目的............................................4 
4 實驗架構............................................5 
第二章 IC測試工程與設備...................................6 
1 IC測試工程目的................................... 6 
2 IC測試介紹.......................................6 
3測試硬體結構介紹....................................8 
4 IC測試作業流程....................................12
第三章 IC測試基座演進與結構.................................15 
1BGA元件測試基座結構..................................15 
2 BGA 元件測試探針種類................................17
3測試基座需求.........................................21 
4探針之材質與表面電鍍..................................25 
5 接觸型態...........................................27 
6 IC測試承座保養與清潔方法.............................29 
7 IC測試基座失效原因與預估.............................31 
第四章 實驗設備與方法.......................................38 
1探針測試計數實驗與方法.................................38 
2定荷重實驗與方法 .....................................40
2-1 設備示意圖...........................................41
2-2 Kelvin Testing 設備 ..............................42 
2-3 探針電阻測試流程規劃................................43 
3 SEM表面與成分分析....................................44 
3-1 探針電阻測試流程規劃................................45 
第五章 數據探討與結論.......................................46 
1 全新探針量測數據.......................................46 
2測貨中探針量測數據......................................50 
3報廢探針量測數據........................................53 
3-2報廢探針量測數據二 ...................................56 
4 SEM表面分析...........................................57 
5 XRF表面分析...........................................63 
6 堪用與淘汰探針SEM、X-Ray 分析與結果....................64 
7 X-Ray檢查整體結構.....................................68 
8實際生產測試陣列分析....................................69 
9 探針電性與彈力測試與SEM分析............................71 
10表面成分分析..........................................72 
第六章 結論與建議 .........................................74 
1結論..................................................74 
2建議.................................................76 
參考文獻.................................................77
                                    

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校內：2015-09-02公開
校外：2020-01-01公開

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