本論文針對背向散射電子應用在金屬及陶瓷材料時所個別遇到的材料氧化及導電性不佳的問題提出了鍍上導電薄膜於觀測材料表面的解決方法，其鍍膜的目的在於隔絕試片與大氣直接接觸，避免氧化問題；以及增加陶瓷材料導電性，減少電荷累積問題。而材料表面鍍上薄膜時，薄膜的厚度及材料種類皆會影響背向散射電子的訊號，因此該論文將會個別探討厚度及材料原子序對背向散射電子訊號的
影響。
在材料的選擇，金屬基板有鋁、銅及銀；陶瓷基板則有氧化鋁、氧化鋯、氧化鈰；鍍層材料亦有鋁、鎳、和鉑；而鍍層利用電子束蒸鍍的方法，厚度則是介於 0nm 到 8nm，每 2nm 為一區間。最後再進行EBSD 掃描，利用 TSL OIM Analysis 6 軟體得到 Image quality、Confidential index、Fit、Hough peak intensity 的數值；Image J軟體得到二次電子圖像灰階值的分佈；CASIO 4.2 軟體進行電子入射情形，得到電子穿透深度及不同材料所對應的背向電子散射係數。
實驗結果發現， 隨著鍍層的增厚，電子訊號必定受到阻擋影響而訊號衰退，其衰退情形隨著基板原子序的增加而變的緩慢，對金屬基板而言，鋁基板訊號衰退速度最快、銅基板次之、銀基板則是最慢衰退。陶瓷基板而言，也有相同的趨勢，氧化鋁基板的訊號退最快、 氧化鋯次之、氧化鈰最慢。模擬結果對比得知，原子序越大的基板將有較大的背向散射系數，造成背向散射電子的產率也會增加，因而使
得電子訊號率退較慢。
此外，針對鍍層的原子序進行觀察得知，除了鉑鍍層之外，鋁鍍層、鎳鍍層所造成訊號遮蔽效果為鎳鍍層大於鋁鍍層，其與模擬結果所得的電子訊號遮蔽效果相符。而模擬結果中的鉑鍍層，因原子序遠大於鋁、鎳，因此所造成的遮蔽效果最為顯著，訊號衰退最快，而實際量測結果發現，鉑鍍層得遮蔽效果卻不如鎳鍍層，係因實際結果中，鉑鍍層再薄膜時易呈島狀結構分佈，和基板的附著力不佳；而鋁、鎳鍍層附著力好，呈現均勻平坦狀，導致鉑鍍層的原子序最大，但所造
成的遮蔽效果卻不為最大。
不論金屬基材或是陶瓷基材在鋁、鎳、鉑鍍層皆為 2nm 時有最好的效果 EBSD 掃描效果，不論鍍層為鋁或鎳或鉑，在 2nm 厚鍍時雖對電子訊號有不同的遮蔽效應，但大抵上皆可被接解析，有足夠的訊號被偵測，完整的進行相鑑定、觀測晶粒大小及織構方向性，且又同時解決了電荷累積問題，使試片達穩定狀態。

This thesis will propose some methods to solve the oxidation problem on metals and charging problem on ceramics.We deposited a thin conductive film on the surface of substrates, then it would separate the directly contact with atmosphere for metals and conduct the electrons out of the surface for ceramics.But the coating thin film will interfere the incident electrons and block the backscattering electrons out of substrates, so we will discuss the relationship between the atmoic number, film thickness and electron signals.
In the experiment, we chose the Al,Cu,Ag as metal substrates, Al2O3 ,ZrO2 ,CeO2 as ceramic substrates, and Al,Ni,Pt as coating materials. After sample preparation, we
used e-beam deposition to coat thin film from 0 to 8 nm with 2nm a step. Then used FE-SEM to do EBSD mapping, and analyzed with TSL OIM Analysis 6, Image J. Furthermore, using CASIO 4.2 software to simulate the condition in SEM scanning to compete the result with experiment.
According to the results, no matter what the metals or ceramics are, when increasing the substrate atomic number, the backscattering electron signals is stronger than small atomic number materials, and the signal descendant rate is slow. Additionally, we also discussd the effect of thin film thickness and their atomic number. First, we found that the thicker coating film, the faster signals decay rate.
Second, the larger atomic number of coating materials, the higher descendant rate for backscattering electron signals. But we found a exception for Pt coating. Based on the Pt physical properties, the adhesion force for Pt is not quiet well when depositing on substrates, so it is easy to peel off or form the island structure. Owing to the film morphology, the cross-section area for inelastic collide is shrinking, then the interference on elastic backscattering electrons is also reduced. So compare with the rule of larger coating atomic number, larger signals decay rate, it is not suitable for Pt materials.
Last but also the more important,the best condition for solving charging problme and oxidation problem is coating a thin film under 2nm. Even though the coating film will also dimish the backscattering electorn signals, it is still under the acceptable range for resolving by TSL OIM Analysis 6 software.

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