| 研究生: |
許倍瑄 Hsu, Pei-Shuan |
|---|---|
| 論文名稱: |
可溶性聚酯醯亞胺的合成及性質探討 Synthesis and properties of soluble polyesterimide |
| 指導教授: |
王春山
Wang, Chun-Shan |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
| 論文出版年: | 2002 |
| 畢業學年度: | 90 |
| 語文別: | 中文 |
| 論文頁數: | 104 |
| 中文關鍵詞: | 聚酯醯亞胺 |
| 外文關鍵詞: | organo-soluble, ester-imide oligomers, polyesterimides |
| 相關次數: | 點閱:53 下載:3 |
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本研究中可溶性聚醯亞胺之合成方法有二:(1)以2,2-雙-4-胺基苯氧苯丙烷(BAPP)與含矽雙胺(Si)配比並與苯甲酸酐(TMA)反應形成兩末端COOH基的imide oligomer,再藉由環氧樹脂開環而形成聚酯醯亞胺;(2)以2,2-雙-4-胺基苯氧苯丙烷(BAPP)與含矽雙胺(Si)配比,再分別與四種具有酯基的雙酸酐反應合成聚酯醯亞胺,並以本性黏度、溶解度及熱性質等三項探討導入含矽雙胺(polysiloxane)與酯官能基對於聚醯亞胺性質的影響。
本論文所合成HPI、BPI、HEPI、EGPI及EPPI等五系列的聚酯醯亞胺,其溶解度皆隨含矽量的增加,及主鏈上軟鏈結的增加而有所提升。就本性黏度而言,以HPI與BPI二系列所測得的本性黏度最佳,其本性黏度範圍分別為0.3~0.5dl/g及1.1~2.2dl/g。而HEPI及EGPI二系列所測得的本性黏度最差,其本性黏度低於0.3dl/g。在TGA及玻璃轉移溫度測試中,EPPI系列的熱裂解溫度Td5%<490℃,且隨著含矽量的增加,其玻璃轉移溫度下降幅度最大。而HPI與BPI二系列的熱裂解溫度Td5%>500℃,且隨著含矽量的增加,其玻璃轉移溫度下降幅度最小,性質安定。其中又以含矽量5﹪的HPI不僅溶解度佳,熱性質也相當安定。
Two series of soluble polyimides were synthesized by two methods: First, a mixture of 2,2-bis (4-aminophenoxy) propane (BAPP) and diamino (polysiloxane) (Si) in various mole ratio is reacted with trimellitic anhydride (TMA) from the carboxy terminated imide oligomer, followed by epoxy ring opening by the carboxy group to form and polyesterimide. Second, a mixture of 2,2-bis (4-aminophenoxy) propane (BAPP) and diamino (polysiloxane) (Si) in various mole ratio is reacted with four different kinds of ester group containing dianhydrides to form polyesterimides . The main purpose of this study is to explore the effect of ester group and polysiloxane units on the properties of resulting polyimides. For example: solubility, Inherent viscosity and thermal properties.
For all polyimides synthesized, the solubility increase with the amount of polysiloxane and soft link in the main chain. As for inherent viscosity, HPI series ranged from 0.3~0.5dl/g and BPI series ranged from 1.1~2.2dl/g are the best. While HEPI and EGPI series are the worest with less than 0.3dl/g. For TGA and Tg analyses, the decomposition temperatures (Td5%) of EPPI series are < 490oC, and glass transition temperatures (Tg) decrease drastically with the increase in polysiloxane content. In contrast HPI and BPI series have decomposition temperatures (Td5%)>500oC, and Tgs decrease rather slowly with the increase in polysiloxane content. Overall, HPI series with 5﹪ polysiloxane has exhibited not only a good solubility but also an excellent thermal stability.
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