毛細式泵吸環路(CPL)是一種雙相熱傳移熱裝置(two-phase heat transport device)，本研究主要是以微機電製程加工技術(MEMS Fabrication)整合毛細式泵吸環路的熱傳機制來設計並製作一系列的微型毛細式泵吸環路，類似於熱管(Heat Pipe)的設計，應用微觀尺度下液體表面張力的效應驅動微管道內冷卻液體從CPL內部蒸發器中的蒸氣導槽流至冷凝器，藉以冷卻高發熱密度(High heating density)的設備及高階電子元件(如高階CPU或是GaAs晶片)，並觀察及討論其熱傳特性、導出Micro CPL環路的熱傳界限。
初步實驗結果證明影響微型毛細式泵吸環路的操作參數有: 環路啟動方法、環路操作溫度、微環路真空度、儲槽設計及環路乾化(deprime)限制，由結果可以分析出微型MCPL晶片在穩定狀況下，系統工作液體充填率達80%以上、系統抽低壓及增加儲槽設計時，可以將晶片蒸發器表面溫度控制在一定範圍內而不至於有急遽的溫度變動，經由實驗可以找到實驗設計的較大熱傳量及較低熱阻值，經由實驗視流觀察透明環路也可證明蒸氣與液體能夠分開傳送。實驗證明Micro CPL具有優越熱傳性的潛力，經由簡化設計可以符合日益增加的散熱需求，期能成為未來散熱設計趨勢之一。

Capillary Pumped Loop(CPL) is a sort of “two-phase heat transport device”, in this study, it presents MEMS fabrication to integrate the mechanism of CPL to both design and manufacture a set of Micro Capillary Pumped Loop(MCPL). It seems like the design of “Heat Pipe”, it applies the effect of liquid surface tension in micro scale to drive cooled liquid from vapor grooves in MCPL flowing to condenser. It can be used to cool high heating density equipments and high-level electronic devices, such as high-level CPU, GaAs wafer etc. By observing and discussing MCPL’s heat transferring characteristics, thermal limits in Micro CPL can be inferred.
From the preliminary experimental result, it proves that there are several operating parameters affecting MCPL, such as loop start-up techniques, loop operating temperature, level of vaccum in micro loop, reservoir design and loop deprime limitation. It is analyzed that MCPL chips can control surface temperature within the range on evaporator without sharp variation in the steady-state. When both the filling ratio of working fluid in the system is up to 80%, connecting with vaccum pump and reservoir to lower pressure in the system, it can also control surface temperature on evaporator. From the experiments, larger thermal conduction quantity and lower thermal resistance can be found. With experimental observation of flow visualization in the transparent micro loop, it also prove that both vapor and liquid can be transmitted separately. Micro CPL has the superior potential in heat transferring, by simplifying the design, MCPL will tally with increasing demand in heat transferring technology. In the future, MCPL will undoubtedly be one of the trends in designing heat sink devices.

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