選用適當的多孔性吸附劑，並了解吸附劑的吸附行為，乃為設計一固體式吸附系統的首要課題。而吸附劑的吸附能力表現與吸附劑的密度、吸附劑粒徑大小、吸附劑表面的孔洞大小以及被吸附劑的溫度、壓力與濃度有關。然而矽膠使用不同方法量測時其吸附行為會有一定的差異，故為了定量掌握本實驗室所使用之矽膠的吸附特性，設計一適用之重量量測平台相當重要，也正是本論文研究的首要目標。
故本研究自行設計一重量量測平台，其中主要實驗方法為使用對位移具有相當高敏感度的電容式位移感測器，來量測矽膠在吸附水汽過程中其自身的重量變化所造成結構上的位移變化，進而得知其重量變化。然而矽膠在吸附過程中將釋放出大量的吸附熱，導致溫度上升，並使得結構因溫度不均勻而產生局部熱變形。這對量測位移變化來轉換成重量變化會有很大的誤差，故必須得知溫度與熱變形之間的關係，並進行溫度補償的動作。
在實驗中我們分別選擇取樣週期為1min、3min來量測矽膠重量的動態變化。由實驗結果來看，未使用溫度補償來換算重量會與實際吸附水汽量有很大的誤差。而溫度補償則以參考載盤下方溫度當參考溫度，且使用溫度延遲的補償方法可以補償熱變形所帶來的誤差。

The first step of designing a solid adsorbent moisture adsorption system is choosing an appropriate porous adsorbent and understanding the adsorption behavior of solid adsorbent. The adsorption performance of solid adsorbent is related to the density, size of adsorbent and the size of porous hole on adsorbent surface, also is related to the temperature, pressure and concentration of adsorbate. However, different results of the adsorption performance of adsorbent typically are observed, when different methods are used to measure the adsorption behavior of silica gel. In order to understand adsorption performance of our own silica gel, it is important to design a suitable weight measurement system. And this is the most important goal in this research.
In this research we design our own weight measurement system. The experiment method is based on the use of a capacitive displacement sensor to design weight measurement system. Capacitive displacement sensor has high sensitivity on displacement change, and therefore is a suitable displacement sensor to measure structure’s small displacement change caused by the weight change of silica gel in adsorption process. However, as silica gel releases large amount of adsorption heats and let the temperature around structure raise, in the adsorption process the temperature of structure starts to be nonuniform and has local thermal deformation inside of structures. As a result, thermal deformation will result in a big experiment error, so we need to know the relation between temperature and thermal deformation and use that to compensate thermal deformation.
We choose 1min and 3min as sampling time in our experiments, and use these two different sampling times to measure weight change dynamic curve of silica gel in adsorption process. From the experimental results we obtained, it is seen that a large error in the water vapor weight adsorbed by silica gel would arise if we don’t use thermal compensation to calculate adsorption weight from experiment data. We use the temperature under plastic plate as reference temperature when we use thermal compensation to calculate adsorption weight from experiment data. It can compensate thermal deformation error by delaying the time of temperature

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