| 研究生: |
許浚鳴 Hsu, Chun-Ming |
|---|---|
| 論文名稱: |
封裝廠植球區之雙機台排程模式 Scheduling model of dual machines for solder ball mount process of semiconductor assembly plant |
| 指導教授: |
張行道
Chang, Shing-Tao |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 工程管理碩士在職專班 Engineering Management Graduate Program(on-the-job class) |
| 論文出版年: | 2005 |
| 畢業學年度: | 93 |
| 語文別: | 中文 |
| 論文頁數: | 76 |
| 中文關鍵詞: | 生產管理 、生產排程 、封裝廠 、排程法則 、雙機台排程 、演算法 |
| 外文關鍵詞: | production scheduling, dual machine scheduling, assembly plant, BGA., algorithm, production management, rules of scheduling |
| 相關次數: | 點閱:81 下載:7 |
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封裝業在半導體產業供應鏈中扮演重要角色,為符合客戶需求,在品質、交期上必定要更具競爭力,在有限生產規模下,生產線的規劃、變更調整變得非常重要。本研究以BGA系列產品封裝廠植球區如何提升生產效率為主題,探討為符合多元化產品、顧客需求量、生產週期、及機器環境與能力,分析並建立適當的排程模式,使人員、設備、品質及產能有最佳組合。
研究建立以產品為導向之雙機台排程模式,以產品種類及作業複雜度作為機台負荷分類基礎,參考最近出貨產品種類,替每一客戶的固定接腳產品,平均建立在二台植球機上,避免重複性生產訂單發生等待,讓每一種產品在植球機有固定作業路徑。同時封裝廠為使資源充分應用,面對少量多樣產品需求,彙整多家接腳數相近產品在同一機台,讓產能堆疊達機台最大能力。在植球機上有固定規則依循,配合先進先出、最短加工時間優先方法,讓植球區排程保持最佳彈性。最後以實證方式,將本排程模式導入生產線,確認排程模式運作情形。
實證過程中說明排程觀念在植球區製造現場演變的重要性。就植球區作業管理來看,排程不能僅專注在產量及時間因素,需有更多的考量如產品特殊規格需求、機器環境與機器能力、及產品多元特性。面對這些製造要素,本研究排程模式應用於BGA產品植球區,帶來幾項優勢:(1)減少機台作業程式管理,(2)縮短換模時間,(3)提昇生產週期達成率,(4)對產能波動具有穩定效果,(5)改善機台換模造成子批生產週期異常,(6)每種產品有固定作業路徑。
Assembly plays an important role in the supply chain of semiconductor industry. In order to conform the requirements of customers, it is competitive on quality and delivery time. It has becoming more and more important to plan and modify production line under restricted production scale. This research focuses on how to raise production efficiency for BGA (Ball Grid Array) products at solder ball mount process of an assembly plant. In responding to the diversified products, demands of customers, production cycle time, and machine environment, this study analyzes and establishes a applicable scheduling model to form a better mix for staffs, facilities, quality, and capacity.
In the product oriented scheduling model for dual machines, the loads of machines are classified according to the product types and the production complexity. Two machines are based for every pin count product in the solder ball mount process to avoid waiting of repeat orders and let the same type of product have the same path. At the same time, to make fully use of the resources and face diversified products, the products of similar pin counts are arranged in the same machine to reach the machine’s capacity. The solder ball mount process is scheduled to follow the first in first out (FIFO), and shortest processing time first (SPTF) rules to keep flexibility. At last, the scheduling model is tested on real production lines.
The test shows that the developed scheduling model for dual machines of BGA products has the following advantages: (1) reduced numbers of programs for machines, (2) shortened mold change time, (3) completion in cycle time, (4) less fluctuated output, (5) improved cycle time deviation, and (6) fixed operating path for every product.
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