科技日新月異，對於產品需求日益進步，微小化以及高效能普及成為今日發展重點。FC-PBGA(Flip Chip Plastic Ball Grid Array)的發展成為此重點一個重要課題，利用FC-PBGA以及3D system in package，進而推廣出高密度封裝，以及微小化目的。
此論文使用 ANASYS 15.0有限元素分析，分析FC-PBGA封裝，，目前已進行許多關於FC-PBGA之覆晶研究。
在改變各種參數包含了PCB(基板)非均勻材料之K值(熱傳導係數)Kxx、Kyy、Kzz、封膠K值、Underfill K值、散熱板K值、基板K值、基板訊號層封均勻材料之K值Kxx、Kyy、Kzz、黏膠K值、風速和改變材料尺寸包含封膠和散熱板之高度及寬度，進行精密熱模擬數據分析，主要研就在於比較各材料料K值變化、風速及改變元件之尺寸，何者散熱較為明顯，可成為日後發展的一項重點。此研究材料元件包含基板(Stubstrate)、96.5Sn3.5Ag錫球(Solder Ball)、晶片(Chip)、封膠(Molding Compound)、散熱孔(Thermal Via)、印刷機路基板PCB(Print Circuit Bpard )、底膠(Underfill)、黏膠(Glue)。

This paper mainly uses ANASYS15.0 finite element analysis to carry out precision thermal simulation data analysis
The parameters of the structure FC-PBGA discuss the heat dissipation of various parameters under various parameter changes, and the parameters include the heat transfer coefficient, wind speed and material size of each material.
When the parameters are compared with each other, the wind speed of the parameters is the best for the heat dissipation, which can affect the cooling of the structure temperature. The reason is that the temperature change of the structure depends on the thermal conductivity of each element when the wind speed is outside, , The structure temperature will be significantly decreased.
If the combination of three parameters of the structure, will be on the structure of the temperature will be helpful to decline, because the K value of each material will affect the temperature results.

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