本研究之主要目標在於研發一套建構在Pyrex 7740玻璃與矽基板陽極接合之微流道系統，其中利用微機電機械系統（MEMS）與奈米成長技術（Nanotechnology）將奈米結構整合於微流道中。另外藉由氣化的方式將疏水性（Hydrophobic）-過氟庚基三氯矽烷材料沈積於微流道底部來進行表面改質。實驗將溫度感測器（thermocouple）沿著工作流體流動之方向以等間距地埋設在微流道壁面，每個感測器間距6 mm，可詳細的量測微流道底部的局部壁面溫度，並進行研究不同熱通量條件與不同流量條件下的壁面溫度分佈現象，同時藉由影像拍攝微流道中於不同表面性質下之流譜加以比較。
在製程方面，以分段式乾式蝕刻的方式成功製作出長為30mm、寬為1000μm、高為103~105μm，水力直徑Dh=186.76μm之微流道晶片並利用VLS法成功的將奈米結構成長於微流道內。陽極接合方面在含有奈米結構之微流道晶片與Pyrex 7740玻璃接合的過程中，用以提高操作溫度、電壓、接合時間可減少接合失敗率。

The goal of this study is to develop a micro-channel system which anodic bonding Pyrex 7740glass and silicon substrate, and integrate MEMS with Nanotechnology to micro-channel system. Moreover, the Hydrophobic material was deposited at the bottom of the micro-channel by gasification to improve the surface. In the experiment, the thermocouple was equidistance-embed at the bottom of the silicon, which is 6mm of each space in the micro-channel wall along the direction of the working flow, in order to measure the local temperature at the bottom of the wall of the micro-channel in detail and to study the distribution phenomenon of wall temperature in different heat flux and mass flux condition; meanwhile by recording the flow patterns of different surfaces in the micro-channel wall under boiling condition were visualized using a CCD system and analyzed.
In the processes of fabrication, the rectangular micro-channel in the (100) silicon wafer were fabricated by the Inductive Couple Plasma Etcher system. These micro-channel, a length of 30mm, a width of 1000μm and depth of 103~105μm, had on identical rectangular cross-section with a hydraulic diameter of 186.76μm and successfully use nanostructures with the VLS method grow silicon nanowire in micro-channel. In the processes with nanostructures based micro-channel of anodic bonding experiment shows that increase the operation temperature, voltage, and bonding time can reduce the failure.

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