本文主要內容為利用單軸拉伸機構對微小尺寸下之材料進行拉伸測試。再藉由數位影像相關法(Digital Image Correlation Method)所建立的一套影像分析程式與影像擷取系統量測微小試件之變形量，當我們有其變形量與應力值便可以求得微小尺寸下材料的機械性質，如楊氏係數(Young’s Modulus)、蒲松比(Poisson Ratio)。在本次實驗中，待測的微小試件材料有紅銅(Red Brass)與單晶矽(Single-crystal Silicon)薄膜。紅銅材料的尺寸 為 4000*500*120、2000*250*120 、1000*125*120 等三種，矽薄膜材料的尺寸為 400*50*4.5，其單位為微米(μm)。由於微小尺寸下材料的機械性質不能由大尺寸依等比例計算而得，所以經由微小試件的直接測試，以了解其受力下之變形行為即成為一必須的步驟。經由本次實驗的實際測試，驗證了本系統的可行性，並對於數位影像相關法的應用限制、誤差來源及誤差範圍等，亦有所討論。

The main content about this paper is to measure the elastic tensile property (Young’s modulus) of the micro samples by use the single-axial tension mechanism. We use digital-image-correlation method to contribute a package of a soft analyzing program collocating CCD to measure the deformation of the micro samples surface by a photomicroscope. When we have the deformation and stress, we can calculate the tensile property of material, example the Young’s modulus、Poisson Ratio. The micro sample’s material are red brass and single-crystal silicon, the red brass’s size are 4000*500*120、2000*250*120 、1000*125*120 and the single-crystal silicon’s size is 400*50*4.5,the unit is micrometer .The material properties of micro samples can’t be figured out directly by the results of large-scale sizes. So understanding the deforming behaviors by directly testing the micro samples becomes the absolute step. By the measuring results of the experiments we prove the feasibility of our system we set. And we provide some discussions about the limit of the application, the source of error and the error range of digital-image-correlation method.

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