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研究生: 林宥甯
Lin, You-Ning
論文名稱: 均勻模面加熱的嵌入式感應加熱單元之設計
Design of Insert Type Induction Heating Module for Uniform Tool Surface Heating
指導教授: 黃聖杰
Hwang, Sheng-Jye
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2009
畢業學年度: 97
語文別: 中文
論文頁數: 105
中文關鍵詞: 模面溫度溫度均勻性感應加熱
外文關鍵詞: Tool surface temperature, Electromagnetic induction heating, Temperature uniformity
相關次數: 點閱:98下載:3
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  • 由於射出成型量產迅速與低成本生產的兩大優勢,使其成為製造業
    中重要的量產技術。近年來,許多產品具有微特徵、薄型工件等特
    點,且對於產品的表面品質也非常要求,但此類產品在射出成型時
    常碰到許多問題,如微特徵的轉寫性不佳、流痕、表面品質不佳等
    。為解決生產此類產品所碰到的困難,提高模具溫度為經常被採用
    的解決方法,因此提升模溫的相關方法陸續發展,其中電磁感應加
    熱方式因有加熱迅速、能源消耗少、降低環境污染等優勢,使其成
    為主要用以提升模溫的媒介。過去應用感應加熱於提升模溫的研究
    ,未有溫度均勻性相關的研究,且存在因外部加熱而使成型周期增
    加的問題,因此本研究將發展均勻模面加熱的嵌入式感應加熱單元
    以改善這些問題。透過柵欄式感應線圈與磁場集中器的運用,經由
    測試實驗已知可使厚度為7mm 的熱作模具鋼(JIS SKD61)其模面溫
    度於15 秒內由50oC 上升至150oC,並達到94%~95%左右的均勻
    性。而本研究也已運用柵欄式線圈與磁場集中器來製作感應加熱裝
    置,並成功發展出嵌入式感應加熱單元,此加熱單元針對母模板的
    目標區域進行加熱後,該目標區域的溫度均勻性可高達94%~96%
    ,而加熱速率可達3.5oC/sec 左右。

    Injection molding is one of the major fabrication
    technologies, andmany manufacturers used it to fabricate
    products. In recent years,many products have the
    requirements including high surface quality,high gloss and
    high replication. And rising tool surface temperature is
    one of the solutions for the ones. So, many tool surface heatingtechniques have been developed recently. Due to the
    advantages ofelectromagnetic induction heating such as high speed heating, lowenergy consumption and environmental pollution reduction, using theone for tool surface heating is more significant among those tool surface heating techniques.In the past, the studies of using electromagnetic induction heating for tool surface heating indicated that the temperature uniformity and
    increasing cycle time were questionable until now. In this thesis, the insert type induction heating module will be developed to improve those problems. According to the result of coil test experiments, the surface temperature of 7mm thickness hot work die steel (JIS SKD61) could rise from 50oC to 150oC in 15 seconds and the temperature
    uniformity of heated zone reached 94%~95%.In this thesis, the parallel type coil and magnetic flux concentrators were adopted to fabricated induction heating apparatus.
    And the insert type induction heating module was developed
    successfully. This induction heating module could heat the target area of mold cavity uniformly. The uniformity of target area reached 94%~96%. And the heating rate of this module is about 3.5oC/sec

    摘要......................................................I Abstract ................................................II 致謝.....................................................IV 目錄....................................................VII 表目錄..................................................XII 圖目錄......................................................XIV 符號表................................................XVIII 第一章 緒論...............................................1 1-1 前言..................................................1 1-2 射出成型基本介紹......................................2 1-2-1 射出成型製程........................................................2 1-2-2 射出成型的流程......................................3 1-2-3 射出成型的問題......................................3 1-3 文獻回顧與模具加熱方式................................5 1-4 研究動機與目的.......................................17 1-5 文章架構.............................................18 第二章 感應加熱的理論背景................................19 2-1 感應加熱的介紹.......................................19 2-2 金屬的電磁特性.......................................20 2-2-1 電阻率(electrical resistivity).................... 20 2-2-2 相對導磁係數(relative permeability) .............. 21 2-2-3 磁滯損(hysteresis loss)與渦流損(eddy current loss).22 2-2-4 集膚效應(skin effect) .............................23 2-2-5 鄰近效應(proximity effect) ........................24 2-3 金屬的熱學性質.......................................27 2-3-1 比熱(specific heat) ...............................27 2-3-2 熱傳導係數(thermal conductivity)...................27 2-3-3 對流熱傳係數(convection heat transfer coefficient).28 2-4 感應加熱的熱傳模式...................................29 2-4-1 熱傳導(conduction) ................................29 2-4-2 熱對流(convection) ................................29 2-4-3 熱輻射(radiation)..............................................30 2-5 感應加熱的優點.......................................................32 第三章 模擬輔助感應裝置設計..............................33 3-1 前言.................................................33 3-2 ANSYS模擬分析說明....................................35 3-2-1 ANSYS的電磁分析理論................................36 3-2-2 感應加熱分析流程.......................................................37 3-3 感應加熱裝置設計與模擬...............................39 3-3-1 磁路(magnetic path)................................40 3-3-2 磁場控制技術(magnetic flux control technique)的介紹40 3-3-3 感應加熱裝置的初步構想.............................42 3-4 模擬分析與結果.......................................46 3-4-1 元素選擇...........................................46 3-4-2 材料參數設定.......................................47 3-4-3 負載與邊界條件設定.................................47 3-4-4 模擬結果...........................................50 第四章 感應線圈測試實驗..................................52 4-1 感應線圈測試實驗說明.................................52 4-1-1 感應加熱設備.......................................52 4-1-2 紅外線熱影像儀與合成樹脂塗料.......................53 4-1-3 測試用感應線圈的設計構想...........................53 4-2 感應線圈測試實驗.....................................59 4-2-1 實驗步驟...........................................59 4-2-2 實驗過程與結果.....................................60 4-3 溫度均勻性分析.......................................62 4-3-1 溫度均勻性分析說明.................................62 4-3-2 雙排線圈加熱結果溫度均勻性分析.....................63 4-3-3 四排線圈加熱結果溫度均勻性分析.....................64 4-3-4 不同功率下線圈加熱結果溫度均勻性分析...............64 第五章 嵌入式感應加熱單元的設計與射出成型實驗............76 5-1 嵌入式感應加熱單元設計...............................76 5-1-1 嵌入式感應加熱單元設計流程.........................76 5-1-2 測試成品設計.......................................77 5-1-3 感應線圈設計.......................................78 5-1-4 線圈固定座與磁場屏蔽設計...........................79 5-1-5 模座尺寸選擇與嵌入式感應加熱單元...................79 5-2 模具設計.............................................84 5-3 嵌入式感應加熱裝置測試實驗...........................88 5-3-1 加熱裝置測試實驗...................................88 5-3-2 實驗結果...........................................89 第六章 結論與未來發展....................................98 6-1 感應線圈設計.......................................................98 6-2 嵌入式感應加熱單元設計...............................99 6-3 未來發展............................................100 參考文獻................................................101 附錄A ANSYS程式碼.........................................i 索引...................................................viii 作者自介.................................................xi

    [1] Clifford l. Weir, “What Is Injection Molding?,” Introduction to Injection Molding and Extrusion, Society of Plastics Engineers Inc.,1975.
    [2] Dominick V. Rosato and Donald V. Rosato, “Molding Problems and Solutions,” Injection Molding Handbook, Van Nostrand Reinhold Company Inc., New York, 1986.
    [3] 張榮語,射出成型模具設計 —模具設計—,高立,台北,民國八十七年。
    [4] K. M. B. Jansen and A. A. M. Flaman, “Construct of
    Fast-Response Heating Elements for Injection Molding
    Applications,” Polymer Engineering and Science, 34, No.11,
    pp.894-897, 1994.
    [5] M. S. Despa, K. W. Kelly and J. R. Collier, “Injection Molding of Polymeric LIGA HARMS,” Microsystem Technologies, 6, pp.60-66, 1999.
    [6] Ming-Chih Huang and Ching-Chih Tai,“The effective factors in the warpage problem of an injection-molded part with a thin shell feature,” Journal of Materials Processing Technology, 110, pp.1-9, 2001.
    [7] Dong-Hak Kim, Myung-Ho Kang and Young Ho Chun,
    “Development of A Notebook PC Housing by Using MmSH
    (Momentary Mold Surface Heating) Process,” Proceedings of
    ANTEC 2001, pp.3347-3350, 2001.
    [8] David Hatch, David Kazmer and Bingfeng, “Dynamic Cooling Design for Injection Molding,” ANTEC 2001 Conference Proceedings, Texas, pp.428-432, 2001.
    [9] Donggang Yao and Byung Kim, “Development of Rapid Heating and Cooling Systems for Using Injection Molding Applications,”Polymer Engineering and Science, 42, No.12, pp.2471-2481,2002.
    [10] Donggang Yao and Byung Kim, “Developing Rapid Heating and Cooling Systems Using Pyrolytic Graphite,” Applied Thermal Engineering, 23, pp.341-352, 2003.
    [11] Pei-Chi Chang, Study of Thermoplastic Micro Injection Molding Technology, PHD thesis, Department of Mechanical Engineering, National Cheng Kung University, 2006.
    [12] Shia-Chung Chen, Wen-Ren Jong, Yaw-Jen Chang, Jen-An
    Chang and Jin-Chuan Cin, “Rapid Mold Temperature Variation for Assisting the Micro Injection of High Aspect Ratio Micro-feature Parts Using Induction Heating Technology,” Journal of Micromechanics and Microengineering, 16, pp.1783-1791, 2006.
    [13] Ernst Roland, Perrier Damien, Feigenblum José and Hemous Rémi, “3D inductive phenomena modeling,” Proceedings of the COMSOL Users Conference 2006, Paris, 2006.
    [14] Hideaki Fujita, Naoki Uchida and Kazuhiro Ozaki,“Zone
    Controlled Induction Heating (ZCIH) — A New Concept in
    Induction Heating —,” Proceedings of Power Conversion
    Conference, Nagoya, pp.1498-1504, 2007.
    [15] Donggang Yao, Thomas E. Kimerling and Byung Kim, “High Frequency Proximity Heating for Injection Molding Applications,”Polymer Engineering and Science, 34, No.11, pp.938-945, 2006.
    [16] Frank W. Curtis, “Principle of Induction Heating,” High-frequency Induction Heating, McGRAW-HILL, New York, 1950.
    [17] Valery Rudnev, Don Loveless, Raymond Cook and Micah
    Black, Handbook of Induction Heating, Marcel Dekker, Inc., New York, 2003.
    [18] Frank P. Incropera, David P. Dewitt, Theodore L. Bergman and Adrienne S. Lavine, Fundamentals of Heat and Mass Transfer, John Wiley & Sons (Asia) Pte Ltd, 2007.
    [19] Daisuke Miyagi, Aisya Saitou, Norio Takahashi and Kazuhiro Ozaki, “Improvement of Zone Control Induction Heating Equipment for High-speed Processing of Semiconductor Devices,” IEEE Transactions on Magnetics, 42, No.2, pp.292-294, 2006.
    [20] Jya-Ray Fan, Development of Rapid Mold Heating System by Using Electromagnetic Induction Technique, Master thesis, Department of Mechanical Engineering, National Cheng Kung University, 2008.
    [21] ANSYS Release 10.0 Documentation.
    [22] Ned Mohan, Tore M. Undeland and William P. Robbins原著,江炫樟編譯,電力電子學,三版,全華圖書,台北,民國九十六年。
    [23] Valery I. Rudnev and Inductoheat Group, “An objective
    assessment of magnetic flux concentrators,” Heat treating
    Progress, 4, No. 6, pp.19-23, 2004.
    [24] Metglas company, www.metglas.com
    [25] Online Materials Information Resource, www.matweb.com
    [26] Ikuma Ken, Akioka Koji, Sakata Msaaki and Shimoda Tatsuya,“Dies for extrusion moulding,” European Patent Specification,1990.
    [27] 張永彥,塑膠模具設計學-理論、實務、製圖、設計,三版,全華圖書,台北,民國九十六年。

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