半導體是台灣兩兆雙星的重要產業之一，隨著市場需求和技術進步，已進入 12吋晶圓世代。因為晶圓尺寸越來越大，重量亦隨之增加，所以在12吋晶圓廠世代，工廠製造自動化程度已進入到無人化境界，機台操作由人工改成全自動化，晶圓搬運也因為晶圓良率(Yield rate)提昇及降低勞工職業傷害的考慮由人工搬運進步到由自動物料搬運系統(Automatic Material Handling System, AMHS)取代。但台灣半導體製造進入12吋晶圓廠世代約十年左右時間，所有自動物料搬運系統相關的建置都是著重在晶圓製造環節，而有關晶圓製造完的最後出貨品管檢驗(Outgoing Quality Assurance, OQA)卻一直還是由人工搬運及人工操作機台，因此也衍生出檢驗生產績效不彰及人為誤操作(Mis-Operation, MO)等相關問題。再者半導體晶圓製造即將在2、3年後進入18吋晶圓世代，因此就算是單純的出貨品管檢驗也不可能由人工搬運，因此出貨品管自動化是一個必然的趨勢。
本研究藉由將自動物料搬運系統的建置由晶圓製造往後延伸到晶圓出貨品管檢驗，打造一條龍的全自動化晶圓生產模式，並藉由價值溪流圖方法(Value Stream Mapping, VSM)來發掘案例製程的價值流程浪費，而藉由3A生產模式導入後的改善效益，再透過Arena模擬工具來驗證其相關績效提升及改善。本文以某晶圓代工公司新12吋晶圓廠出貨品管產線建置為實證研究案例，來評估建構一全新並有效率的晶圓出貨品管自動化生產模式(3A Model)，即機台自動化(Equipment Automation)、傳送自動化(Transportation Automation)、派貨自動化(Dispatching Automation)的生產模式，期能達到縮短產品週期時間、提升檢驗人員生產績效，進而降低人力需求及人為誤操作的機會。

Semiconductor Industry, which is included in the “Twin Trillion Twin Star” plan launched by the Taiwanese government for further promoting the high-tech sectors, has migrated into 12-inch wafer generation, following the demands of the market and the progress made in related technologies. Due to the increase in size and weight of the wafer, the degree of automation in the manufacturing process of the 12-inch Fab is as high as that almost no human labor is needed. To achieve the goals that the yield rate of the production could be improved and the occupational injury of the workers could be reduced, human-powered transportation of the wafers has been replaced with the Automatic Material Handling System (AMHS). Since the 12-inch Fab has been initialed to Taiwan for 10 years or so, the AMHS is mostly installed and emphasized in the manufacturing process, while the transportation and tool operation of the wafers in outgoing quality assurance (OQA) is still left to human labor. Therefore productivity poor performance and mis-operation (MO) are two major issues raised to OQA portion. Further wafer production would be migrated into 18-inch wafer generation in 2 or 3 years, it is for sure that OQA automation is the trend of the future.
Extending the AMHS deployment from the wafer manufacturing to the wafer OQA, the study tries to establish a full automation model of the wafer production, by locating the value waste through value stream mapping (VSM) methodology and verifying it’s performance and improvement with the Arena simulation tool. Taking the new OQA production line setup of foundry as an empirical case, the study tries to evaluate and construct a brand new and efficient 3A model, ie. Equipment automation, transportation automation and dispatching automation, that can reduce the production cycle time, increase the performance of inspector and reduce the demand for manpower and mis-operation caused by human factors.

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