| 研究生: |
許義忠 Sheu, Yi-Zhong |
|---|---|
| 論文名稱: |
氮化鎵材料的蝕刻以及金屬接觸之研究 The Study of the Etching and the Metal’s Contact in GaN Material |
| 指導教授: |
王永和
Wang, Yeong-Her 洪茂峰 Hong, Mau-Phon |
| 學位類別: |
碩士 Master |
| 系所名稱: |
理學院 - 光電科學與工程研究所 Institute of Electro-Optical Science and Engineering |
| 論文出版年: | 2004 |
| 畢業學年度: | 92 |
| 語文別: | 中文 |
| 論文頁數: | 96 |
| 中文關鍵詞: | 光輔助化學濕式蝕刻、歐姆接觸、蕭基接觸 |
| 外文關鍵詞: | PEC etching, ohmic contact, schottky contact |
| 相關次數: | 點閱:124 下載:3 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
在本文中,研究對於p-GaN、n-GaN簡易的光輔助化學濕式蝕刻並做了一系列的比較。和以往PEC蝕刻不同的是我們採用K2S2O8去取代傳統的白金電極。我們改變了KOH以及H3PO4的PH值對於n-GaN的蝕刻速率,並且在使用Xenon lamp的情形下,在不同光強度下,試試在PH數為多少時有最大的蝕刻速率,再來也嘗試著是否可以使用光輔助化學濕式蝕刻來蝕刻p-GaN。之後研究關於p-GaN的金屬接觸,並利用此光輔助化學蝕刻方式來做p-GaN金屬傳輸線量測(TLM)的平台(mesa),在改變不同的狀況下,我做歐姆接觸的研究,嘗試得到最好的歐姆接觸條件,也就是比較小的比接觸阻抗。最後再研製蕭基二極體,並且研究它的電性,我也使用蝕刻的方法去改變表面載子濃度,去比較有蝕刻跟未蝕刻的電性差別。
In this dissertation, we study of a simple photo enhanced etching about p-GaN and n-GaN and do a series contrast. Instead of Pt electrode in past PEC etching, we used oxidizing agent K2S2O8. We used KOH and H3PO4 solutions varied different PH value to etch n-GaN. Under using Xenon lamp situation, I change the lamp intensity in order to get maximum etching in different PH value, and then we try to etch p-GaN and to see the possibility. After that, I study of the metal’s contact about p-GaN, and use PEC etching to make the mesa of metal contact on p-GaN. I change many conditions to get better ohmic contact and low characteristic contact resistance. At last, produce the schottky diode and study the electric property. And then I used PEC method to etch the p-GaN’s surface for getting the different change with unetching layer.
[1] H. P. Maruska and J. J. Tietjen, Appl. Phys. Lett. 15(1969)367.
[2] M. S. Shur and M. Asif Khan, Mater. Res. Bull. 22, 44(1997)
[3] S. Nakamura, T. Mukai, and M. Senoh, Appl. Phy. Lett. 64, 1687(1994).
[4] S. Nakamura and G. Fasol, The Blue Laser Diodes(Springer, Heidelberg, 1997)
[5] S. Nakamura, M. Senoh, N. Iwasa, S. Nagahama, T.Yamada, and T. Mukai, Jpn. J. Appl. Phy., Part2 34, L1332(1995)
[6] T. Mukai, D. Morita, and S. Nakamuram J. Cryst. Growth 189/190, 778(1998)
[7] T. Mukai, H. Narimatsu, and S. Nakamura, Jpn. J. Appl. Phy., Part2 37, L479(1998)
[8] S. Nakamura, M. Senoh, S. Nagahama, N. Iwasa, T. Yamada, T. Matsushita, H. Kiyoku, Y. Sugimto, T. Kozaki, H. Umemoto, M. Sano, and K. Chocho, Appl. Phy. Lett. 72, 2014(1998).
[9] Strategies Unlimited, Gallium Nitride-Technology Status and Applications Analysis pp. 3, March(1997)
[10] Strategies Unlimited, Gallium Nitride-Technology Status and Applications Analysis pp. 21, March(1997)
[11] Bernard Gil, Group Ⅲ Nitride Semiconductor Compounds (Oxford, New York,,1998)
[12] 史光國編著 , “現代半導體發光及雷射二極體材料技術”(2002)
[13] S. Yoshida, S. Misawa, and S. Gonda, J. Vac. Sci. Technol. B1(1983) 250.
[14] I. Akasaki, H. Amano, Y. Koide, K. Hiramatsu, and N. Sawaki, J. Cryst. Growth 98(1989) 209.
[15] H. Amano, N. Sawaki, I. Akasaki, and Y. Toyoda, Appl. Phys. Lett. 48(1986) 353.
[16] S. Nakamura, Jpn. J. Appl. Phys. 30(1991) L1705
[17] H. Amano, M. Kitoh, K. Hiramatsu, N. Sawaki, and I. Akasaki, Jpn. J. Appl. Phys. 28(1989) L2112
[18] S. Nakamura, T. Mukai, M. Senoh, and N. Iwasa, Jpn. J. Appl. Phys. 31(1992) L139
[19] G. S. Nakamura, Semicond. Sci. Technol. 14, R27(1999)
[20] I. Adessida, A. Mahajan, E. Andideh, M. A. kahn, D. T. Olson, and J. N. Kuznia, Appl. Phys. Lett. 63, 2777(1993)
[21] S. J. Pearton, C. R. Abernathy, F. Ren, J. R. Lothian, J. Vac. Sci. Technol. A11, 1772(1993)
[22] R. J. Shul, G. B. McClellan, S. A. Casalnuovo, D. J. Rieger, Appl. Phys. Lett. 69, 1119(1996)
[23] A. T. Ping, I. Adesida, and M. A. Khan, Appl. Phys. Lett. 67, 1250 (1995)
[24] X. A. Cao et al. , Appl. Phys. Lett. 75, 232(1999)
[25] Properties, Processsing and Applications of Gallium Nitride and Related Semiconductor, edited by J. H. Edgar, S. T. Strite, I. Akasaki, H. Amano, and C. Wetzel(Inspec, London,1999).
[26] J. R. Mileham, S. J. Perton, C. R. Abern athy, J. C. MacKenzie, R. J. Shul., J. Vac. Sci. Technol., Vol. A14, pp.836-839, 1996.
[27] M. S. Minsky, M. White, E. L. Hu, Appl. Phys. Lett. 68(11), pp.1531-1533, 1996.
[28] C. Youtsey, I. Adesida, and G. Bulman, Appl. Phys. Lett.71, 2151(1997).
[29] C. Youtsey, I. Adesida, L. T. Romano, and G. Bulman, Appl. Phys. Lett. 72, 560(1998).
[30] C. Youtsey, I. Adesida, and G. Bulman, J. Electron. Mater. 27, 282(1998).
[31] C. Youtsey, I. Adesida, and L. T. Romano, Appl. Phys. Lett. 73, 797(1998).
[32] L. H. Peng, C. W. Chang, J. K. Ho, C. N. Huang, and C. Y. Chen, Appl. Phys. Lett. 72, 939(1998).
[33] J. A. Bardwell, I. G. Foulds, J. B. Webb, H. Tang, J. Fraser, S. Moisa, and S. J. Rolfe, J. Electron. Mater, Vol.28, No.10(1999).
[34] C. Youtsey, G. Bulman, I. Adesida, J. Electron, Mater, vol.27, 4, pp.282-287, 1998.
[35] C. Youtsey, I. Adesida, Appl. Phys. Lett, vol.72, num.5, pp560-562, 1998.
[36] C. Youtsey, I. Adesida, G. Bulman, Electron. Lett.33,245(1997).
[37] J. A. Bardwell, J. B. Webb, H. Tang, J. Fraser, and S. Moisa, J. Appl. Phys, vol.89, L4142(2001)
[38] S. Nakamura, The Blue Laser Diode, p.50, (Springer, 1997).
[39] 行政院國家科學委員會精密儀器發展中心, “真空技術與應用”, p.379-382.
[40] Ralph E.Williams, “Gallium Arsenide Processing Techniques”, 學風出版社(1983).
[41] S. M. Sze, in Semiconductor Devices Physics and Technology, (Willey, New York, 1985), p.193.
[42] C. E. Fiori and D. E. Newbury, “Artifacts Observed in Energy Dispersive X-Ray Spectrometry in the Scanning Electron Microscope,” Scanning Electron Microscopy, 401-422, 1978.
[43] F. S. Goulding and Y. Stone, “Semiconductor Radiation Detectors,” Science 170, 280-289, Oct.1970; A.H.F.Muggleton, “Semiconductor Devices for Gamma Ray, X Ray and Nuclear Radiation Detectors,” J.Phys.E: Scient. Instrum. 5,390-404, May 1972.
[44] J. F. Bresse, “Quantitative Investitations in Semiconductor Devices by Electron Beam Induced Current Mode: A Review,” in Scanning Electron Microscopy 1,717-725, 1978.
[45] C. R. Crowell and V. L. Rideout, Solid State Electron. 12(1969)89.
[46] R. Stratton and F. A. Padovani, Solid State Electron. 10(1967)813.
[47] S. Nakamura, M. Senoh, N. Iwasa, and S. Nagahama, Jpn. J. Appl. Phys., Part2(34), L797(1995).
[48] S. Nakamura, M. Senoh, N. Iwasa, T. Yamada, T. Matsuahita, H. Kiyoku, and Y. Sugimoto, Jpn. J. Appl. Phys., Part2(35), L217(1996).
[49] M. AsifKhan, A. R. Bhattarai, J. N. Kuznia, and D. T. Olson, Appl. Phys. Lett.63, 1214(1993).
[50] M. AsifKhan, A. R. Bhattarai, J. N. Kuznia, and D. T. Olson, Appl. Phys. Lett.62, 1786(1993).
[51] R. A. Logan and C. D. Thurmond, J. Electrochem. Soc.119, 1727 (1972).
[52] J. I. Pankove and H. E. Schade, Appl. Phys. Lett.25, 53(1974).
[53] E. H. Rhoderick and R. H. Williams, Metal-Semiconductor Contacts, Oxford Science Publication.
[54] M. Rubin, N. Newman, J. S. Chan, T. C. Fu, and J. T. Ross, Appl. Phys. Lett.64, 64(1994).
[55] N. M. Johnson, J. Walker, D. P. Bour, and R. A. Street, Appl. Phys. Lett.68, 667(1996).
[56] H. Nakayama, P. Hacke, M. R. H. Khan, T. Detchprohm, K. Hiramatsu, and N. Sawaki, Jpn. J. Appl. Phys. Part 2 35,L282 (1996).
[57] T. Mori, T. Kozawa, T. Ohwaki, Y. Taga, S. Nagai, S. Yamasaki, S. Asami, N. Shibata, and M. Koike, Appl. Phys. Lett.69, 3537(1996).
[58] K. V. Vassilevski, M. G. Rastegaeva, A. I. Babanin, I. P. Nikitina, and V. A. Dmitriev, MRS Internet J. Nitride Semicond. Res.1, 38(1996)
[59] J. -L. Lee, M. Weber, J. K. Kim, J. W. Lee, Y. J. Park, T. Kim, K Lynh, Appl. Phys. Lett.74, 2289(1999).
[60] T. Kim, M. C. Yoo, and T. Kim, Mater. Res. Soc. Symp. Proc. 449, 1061(1997).
[61] T. Km, J. Khim, S. Chae, and T. Kim, Mater. Res. Soc. Symp. Proc.468, 427(1997).
[62] J. T. Trexler, S. J. Pearton, P.H. Holloway, M. G. Mier, K. R. Evans, and R. F. Karlicek, Mater. Res. Soc. Symp. Proc.449, 1091(1997).
[63] J. K. Kim, J. -L. Lee, J . W. Lee, H. E. Shin, Y. J. Park, and T. Kim, Appl Phys. Lett.73,2953(1998)
[64] J. -S. Jang, S. -J. Park, T. -Y. Seong, J. Vac. Sci. Technol. B17, 2667 (1999).
[65] T. Kim, M. C. Yoo, and T. Kim, Mater. Res. Soc. Symp. Proc. 449, 1061(1997).
[66] J. –S. Jang, K. –H. Park, H. –K. Jang, H. -G. Kim, S. –J. Park, J. Vac. Sci, Technol. B,16, 3105(1998).
[67] J. –S. Jand, S. –J. Park, T. –Y. Seong, J. The Electrochemical Soci., 146, 3425(1999).
[68] V. Adivarahan, A. Lunev, M.AsifKhan, J. Yang, and G. Simin. Appl. Phys. Lett. 78, 2781(2001).
[69] J. K. Ho et al. Appl. Phys. Lett. 74, 1275(1999).
[70] Jong-Lam Lee, J. K. Kim, J. W. Lee, Y. J. Park, T. Kim, H. E. Shin, Appl. Phys. Lett. Vol.73, pp.2953.
[71] Jong-Lam Lee, J. K. Kim, J. W. Lee, Y. J. Park, T. Kim, H. E. Shin, Appl. Phys. Lett. Vol.74, pp.2289.
[72] K. Hattori and Y. Izumi, J. Appl. Phys. 53, 6906(1982).
[73] Jong Kyu Kim, Chong Cook Kim, Tae Sik Cho, Jung Ho Je, Joon Seop Kwak, Yong Jo Park, and Jong-Lam Lee, Jourbal of Electronic Materials, 30, 170(2001).
[74] L. L. Smith, M. D. Bremser, E. P. Carlson, T. W. Weeks, Y. Huang, M. J. Kim, R. W. Carpenter, R. F. Davids, Mater. Res. Soc. Symp. Pro, 395(1995).
[75] Masaaki Suzuki, T. Arai, T. Kawasaki, S. Kobayahi, S. Fujita, Yasuo Koide, J. Appl. Phys.86, 5079(1999).
[76] L. Sugiura et al. Jpn. J. Appl. Phys.37, 3878(1998).
[77] L. Sugiura et al. Appl. Phys. Lett.72, 1748(1998).
[78] N. Shibata, J. Umezaki, M. Arai, T. Uemura, T. Kozawa, T. Mori, and T. Owaki, Japanese Unexamined Patent, No. 09064337A.
[79] Y. Koide, T. Maeda, T. Kawakami, S. Fujita, T. Uemura, N. Shibata, and M. Murakami, J. Electron. Mater. 28, 341 (1999) (ScienceDirect).
[80] J. K. Ho, C. S. Jong, C. C. Chiu, C. N. Huang, C. Y. Chen, and K. K. Shih, Appl. Phys. Lett. 74, 1275 (1999).
[81] T. Maeda, Yasuo Koide,a) and Masanori Murakami Appl. Phys. Lett, Vol. 75, pp. 4145–4147(1999).
[82] Schroder, “Semiconductor Material and Device Characteri zation,” pp.147-159.
[83] P. Williams, “Secondary Ion Mass Spectrometry,” in Applied Atomic Collision Spectroscopy, Academic Press, New York, 1983, 327-377.
[84] 行政院國家科學委員會精密儀器發展中心, “真空技術與應用”, p.349.
[85] Q. Z. Liu and S. S. Lau, “A review of the metal-GaN contact technology,” Solid-State Electron, vol. 42, pp.677-691, 1998.
[86] H. Ishikawa, S. Kobayashi, Y. Koide, S. Yamasaki, S. Nagai, J. Umezaki,M. Koike, and M. Murakami, “Effects of surface treatments and metalwork functions on electrical properties at p-GaN/metal interfaces,” J.Appl. Phys., vol. 81, pp. 1315–1322, 1997.
[87] S. M. Sze, Physics of Semiconductor Devices, 2nd ed. New York: Wiley, 1981, pp. 249–264.
[88] L. S. Yu, Q. Z. Liu, D. J. Qiao, S. S. Lau, and J. M. Redwing, “The role of the tunneling component in the current–voltage characteristicsof metal–GaN Schottky diodes,” J. Appl. Phys., vol. 84, pp. 2099–2104,1998.
[89] I. M. Kolthoff and I. K. Miller, J. Am. Chem. Soc 73, 3055(1951).
[90] D. R. Turner, “On the mechanism of chemically etching germanium and silicon,” J. Electrochem. Soc., vol.107, 810(1960).
[91] Q. X. Guo, O. Kato, and A.Yoshida, J. Electrochem. Soc., vol. 139, pp.2008-2009, 1992.
[92] L. H. Peng, C. –W. Chuang, Y. –C. Hsu, IEEE, vol.4, 3,1998.
[93] O. J. Glembocki, E. D. Palik, G. R. de Guel, J. Electrochem. Soc., vol.138, pp.1055-1063(1991).
[94] J. O’M. Bockris and A. K. N. Reddy, Modern Electrochemistry. New Youk:Plenun, 1973.
[95] S. S. Kocha, M. W. Peterson, D. J. Arent, J. M. Redeing, J. Electrochem. Soc., 142,2625,1995.
[96] I. M. Huygens, K. Strubbe, W. P. Gomes., J. Electrochem. Soc.147(5),1797,2000.
[97] J. Z. Li, J. Y. Lin, H. X. Jiang, Salvador, A. Botchkarev, H. Morkoc, Appl. Phy. Lett. 69,1474(1996).
[98] Doo-Hyeb Yoyum, M. Lachab, M. Hao, T. Sugahara, H. Takenaka, Y. Naoi, and S. Sakai, Investigation on the P-Type Activation Mechanism in Mg-doped GaN Films Grown by metalorganic Chemical Vapor Deposition, J. J. Appl. Phys. Vol.38, pp631-634.
[99] Jingxi Sun, J. M. Redwing, A. B. Ellis, F. J. Himpsel, T. F. Kuech, Appl. Phy. Lett. Vol. 76, pp.415–417(2000).