濺鍍沉積技術已經被廣泛的應用，特別是半導體領域。對於濺鍍沉積方式中的磁式濺鍍沉積系統，有著長久以來的缺點─靶材利用率過低，造成靶材汰換週期過短，單位靶材使用成本過高。本文首先探討磁式濺鍍沉積系統原理，找出影響靶材表面離子轟擊主要因素，進而提出一傾斜式磁座設計。傾斜式磁座設計經由有限元素分析軟體-ANSYS，分析磁座最適當之磁孔傾斜角度，將磁孔傾斜角度應用到實際靶座製作。靶座製作乃採用一複合式設計，僅使半數的磁孔傾斜加工，而另半數則維持原垂直磁孔，其目的為降低確認實驗中濺鍍腔內環境條件差異問題，在同一腔室內進行濺鍍使用，以有效比較此新式設計的改良成果。分析結果顯示，磁座的磁孔傾斜式設計，能有效提昇磁力線平行分佈於靶材表面，平均靶材表面離子轟擊情形，達到增加靶材利用率。從磁式靶座之電腦輔助分析模擬到實際測試驗證都顯示出設計與實際的高度符合，可以改善靶材利用率。

It is known that the sputter deposition technology has been widely applied in semiconductor industry. However, the problem of short cycle life of target in magnetron sputtering system has been a major issue. An inclined magnet design in magnetron cathode is developed and simulated by finite element software-ANSYS in this thesis. With the magnet inclination angle, the magnetic flux distribution over target surface can be effectively and efficiently enhanced so as to smooth the unbalanced target erosion. A hybrid magnet set is developed to validate the difference between the inclined and original design under the same process condition. Experiments show that the magnet inclination design closely meets with the numerical analysis and indeed enhances the using rate of target.

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