本研究主要探討試片準備方法對角度解析度的影響，利用純度為99.99%的商用無氧銅柱做為長晶的原料，待使用Bridgeman方法獲得Cu單晶，對此銅單晶試片施以不同試片處理方式，再以EBSD對其單晶表面進行晶體方位測量，以分析軟體OIM analysis分析。
實驗結果以兩部分進行討論:第一部分針為試片準備過程所造成的取向擴張，發現對於使用粒徑越大的拋光粉當最後拋光製程時，可以觀察到極圖中的極點有取向擴張越大的現象，隨著拋光粒徑由1μm至0.02μm時，將造成試片的EBSD的取向差由4.0°至1.0°；而電解拋光造成EBSD的取向差為0.8°。
第二部分針對試片準備過程所造成的取向差雜訊進行分析，取向差雜訊可分為Type I及Type II兩類。Type I為隨機雜訊，介於取向差0°及0.7°之間，此類雜訊多為隨機分佈；Type II為製備雜訊，在0.7°及 值之間( 為涵蓋95%隨機變數值)，Type II雜訊多分佈於製備時所造成的刮痕附近，對應使用拋光粒徑1μm、0.3μm、0.02μm及電解拋光之試片，Type II範圍值分別為3.3°、0.4°、0.3°、0.1°。

In this study, the effect of sample preparation on the angular resolution was investigated using 99.99% copper single crystal which was produced by Bridgeman method. Specimen of single crystal coppers were mechanically polished using 1, 0.3, 0.02μm and electro-polishing, respectively. And then all EBSD measurements were performed using a step size of 85nm under 30kV.
It was found that using larger polishing particle size results in a larger orientation spread. As the polishing particle size were decreased from 1 to 0.02μm, the value of , that is, 95% of the total values, was also reduced from 4.0° to 1.0° and 0.8° for electro polishing.
The misorientation noise can be defined as Type I and Type II. Type I means “random noise” in the range of 0° and 0.7°, which is a random distribution. Besides, Type II is called “sample preparation noise” between 0.7° and that usually exists near scratched areas. Moreover, the range between 0.7° and are 3.3°、0.4°、0.3°、0.1°for using polishing particle size of 1、0.3、0.02μm and electro polishing, respectively.

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