在早期封裝產業中，金線為常使用之封裝線材，然而近年金線價格大幅上升，各界便開始尋求其他替代材料，目前常用的替代材料為銀線和銅線；由於封裝膠中所含的硫原子以及氯離子在長時間接觸下會使銀線和銅線材明顯產生腐蝕劣化問題。為達到降低價格與抗腐蝕劣化的效果，合金線材的應用是另一選擇，因此，本研究將進行金銀合金線材可靠度研究。
本研究金銀合金線材比對商用純金線材在性質上的差異，金銀合金線材之金銀兩元素可依照任意比例形成固溶體，若是提高銀元素比例，可以有效控制成本。另外純金線材在打線應用過程中會明顯產生介金金屬化合物，導致元件電阻上升甚至故障。銀元素的添加則可以有效降低金元素的擴散，進而減低介金屬化合物形成。研究過程中將針對線材機械性質與通電性質進行討論，並導入硫化試驗與氯化試驗來評估線材對硫化與氯化腐蝕後的耐受性差異。
機械性質方面，由於金線材抽製與退火製程後形成較細晶粒結構
，因此在細晶粒尺寸效應下，純金線材有較優異拉伸性質與硬度。通電性質部分，合金線材所呈現的電阻均高於純金線材，理由為合金化原因導致線材電阻上升，然而降低導線長度可發現金銀合金線材電阻可接近純金線材，這是因為線材長度縮短後電子移動距離下降，進而推論在封裝中合金線材會與純金線材有相似的電阻值。
進行硫化測試後，合金線材表面會形成硫化銀顆粒組織，導致金銀合金線材電阻上升趨勢明顯高於純金線材，使得通電疲勞壽命下降
；在短時間硫化後，內部硫化較為緩和，因此後合金線材仍保有一定的拉伸性質。
綜合打線結果，第一銲點部分，長時間通電後，合金線材所形成介金屬化合物厚度明顯薄於純金線材，使得合金線材可與純金線材有相接近的界面阻抗。第二銲點部分，在較低電阻且僅有少量介金屬化合物生成下，合金線材的通電循環壽命劣化率沒有增加，並且在氯化試驗後，機械性質與電阻上升是因為線材接合基板處有腐蝕現象導致第二銲點性質下降。合金線材部分性質是等同於純金線材，應可考量導入封裝應用。

SUMMARY
In this study, we found the ability of anti-chemical resistance of Au-Ag alloy wire with low sulfur diffusion is good. The Au wire after higher sulfur diffusion, the electrical properties has deteriorated significantly. For the first bond, the rate of IMC formation of Au-Ag alloy wire was slower than Au wire. The mechanical and electrical properties of the second bond after chlorination were deteriorated due to the corrosion in the Al pad. According to the results of this study, the potentiality of Au-Ag alloy wire could replace Au wire in some applied areas.

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