本研究的目的在探討添加0.05、0.1及0.5 wt.%La對Sn-3Ag-2Sb(簡稱SAS)無鉛銲料與銅銲接後，銲點內部之銲料微結構、微硬度及界面層厚度之影響，同時利用對接試件及高溫熱儲存評估銲點機械性質與抗熱性之影響。
研究結果顯示，少量La元素的添加(如：SAS0.1La)使得銲料中出現新的方塊狀LaSb化合物，且其數量隨著La添加量的增加而隨之增加。SAS銲料中添加少量La元素有助於銲料微結構的細化，使得整體組織更為均勻；在as-soldered情況下，添加0.05 wt.%La於SAS無鉛銲料中可得到Ag3Sn化合物最為細緻，且β-Sn之尺寸相較於3.5Ag銲料由原本的約略20 μm降至約5 μm，使得SAS0.05La銲料整體組織最為均勻。經過400小時150 oC熱儲存後，各銲料微結構都有粗大化的現象且網狀共晶組織逐漸瓦解；然而，比較五種銲料之微結構可發現，SAS0.05La銲料之抗熱性較為優良。銲點界面層量測知結果顯示未熱儲存前，所有銲料銲點之界面IMC層厚度差異不大；而經過400小時熱儲存後，以SAS0.5La銲料之銲點界面IMC層厚度最薄，顯示La添加量增多對IMC層成長有抑制的效果。
結合強度測試結果顯示於as-soldered情況下，添加少量La元素有助於銲點結合強度的提升，其中更以SAS0.05La銲點結合強度最高，其餘隨著La含量的增加有些許下降；經高溫時效後，雖然各銲點結合皆有下降的趨勢，仍然以SAS0.05La銲點結合強度最高。破壞模式方面也由原本的銲料模式逐漸轉變為混合模式。
綜合本研究結果顯示添加La元素對於銲料微結構、微硬度、界面IMC層成長及拉伸強度都有顯著的影響；其中，以SAS0.05La無鉛銲料具有最佳之抗熱性及良好的機械性質。

The effects of adding 0 ~ 0.5 wt.% La into Sn-3Ag-2Sb-xLa/Cu lead-free solder joints on microstructure, microhardness, adhesive strength, as well as the interfacial IMC (Intermetallic Compound) layers were studied in this research. The influences of different La addition on the adhesive strength of solder joint and thermal resistance were evaluated by performing high temperature storage tests with hot-dipped specimen.
Experimental results showed that microstructure of solder joints were mainly composed of ε-Ag3Sn and coarse β-Sn. However, a new phase, LaSb IMC, formed when the La contents is more than 0.1 wt.%. And LaSb amount is increased with the increasing La content. After thermal aging, the size of LaSb IMCs won’t be changed and remained the same. The addition of trace La element decreased the size of Ag3Sn and Cu6Sn5 particles and β-Sn grains as well. The microstructure become more uniform. With the increasing La content, the thickness of IMC layer of SASxLa/Cu were decreased. It revealed that La addition can prevent IMC layer from growing.
The adhesive strength tests show that the SAS0.05La/Cu solder joint has the highest adhesive strength, and decreased with the increasing La content. The strength of all solder joints decreased dramatically after thermal storage at 150 oC for 400 hours. Particularly for 3.5Ag/Cu solder joint, the adhesive strength decreased from 68.35 MPa to 56.27 MPa; however, the strength of SAS0.05La/Cu solder joint were 70.32 Mpa. And the fracture modes were transited from solder mode to mix mode due to the IMC layer growth. Comparing all the results of the study, the SAS0.05La/Cu solder joint has the better mechanical properties.

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