在電阻製造過程中，先將端電極的正導及被導印刷銀膏於氧化鋁陶瓷基板上，經燒結後再將電阻膏印刷於陶瓷版中間，再將保護層覆蓋於電阻膏上方。正、被導的成份大部份為銀，而覆蓋在其上的保護層及覆蓋不良、電鍍層不佳，再遭遇大氣含硫環境，很容易造成腐蝕而產生電阻阻值飄移，最後導致電阻失效。
在電容X7R及Y5V之製造過程中，其端電極的最內層為銅膏所製成，即卑金屬電極(BME，Base Metal Electrode)，另電容NPO之製造過程中，其端電極的最內層為銀膏所製成，為貴金屬電極(NME，Noble Metal Electrode)，而再經電鍍鎳層保護銅層及銀層，當鎳層電鍍不良時，再遭遇大氣含硫環境時，很容易造成電容腐蝕，進而造成電性、介電損失及絶緣阻抗等性質飄移，導致電容失效。
本研究證實參考美國試驗材料協會發佈的標準方法ASTM B809-95的方法所建立的高溫高濕硫化環境系統條件，並加高溫度於60℃及105℃之高腐蝕環境中，可成功的模擬出電阻及電容產品硫化的現象，透過SEM、EDS、XRD及TEM的驗證，得到銀及銅與硫反應，其產生為acanthite的Ag2S及hexagonal的CuS，其反應的機制為硫氣延著鎳層與陶瓷體的交界處，與端電極內層的銀膏或銅膏反應產生硫化銀及硫化銅。

In the conventional resistor manufacturing processes, the alumina ceramic substrate was printed firstly by silver paste of the front and back conductor. After that, the printed substrate was proceed with sintering, then printed again by resistance paste on the middle surface of the substrate, and lapped by protective layer in turn. The main composition in the front and back conductor is silver mostly. Sulphur-containing atmosphere, poor coverage and plating in protective layer were considered to be responsible for the phenomenon of resistance drift and failure.
Similar behavior is also observed in the industrialization of multilayer ceramic capacitors (MLCCs). MLCCs terminated with copper (Cu) base metal electrode (BME) are commonly used in the temperature specification of X7R/Y5V, while MLCCs terminated with silver (Ag) noble metal electrode (NME) are applied in NPO. The copper (Cu) and silver (Ag) layer are protected by plating nickel (Ni) layer on the surface. The most critical issue for MLCCs is electrical drift, such as deviation in capacitance, dielectric loss, and insulation resistance, and even resulted in the failure of capacitor, which is ascribed to poor plating in nickel layer and sulphur-containing atmosphere.
This study confirms that resistors and capacitors simulated successfully under the high-temperature and high-humidity vulcanization environment. The testing condition followed ASTM B809-95 standard method published by the American Society for Testing Materials, and executed under 60oC and 105oC with corrosive environment. By applying SEM, EDS, XRD and TEM, acanthite Ag2S and hexagonal CuS were both observed in resistances and capacitors with vulcanization. It was considered that sulfur gas extended to the junction of the nickel layer and the ceramic body, and then reacted with the silver layer and copper layer insides into silver sulfide and copper sulfide respectively.

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