| 研究生: |
林子翔 Lin, Tzu-Hsiang |
|---|---|
| 論文名稱: |
積層製造加工中熔滴鋪展與固化行為之模擬 Simulations of Droplet Behavior of Spreading and Solidification in Additive Manufacturing |
| 指導教授: |
黃吉川
Hwang, Chi-Chuan |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 工程科學系 Department of Engineering Science |
| 論文出版年: | 2016 |
| 畢業學年度: | 104 |
| 語文別: | 中文 |
| 論文頁數: | 55 |
| 中文關鍵詞: | 3D列印 、熔滴沉積 、COMSOL 、平行運算 |
| 外文關鍵詞: | 3D printing, Droplet deposition, COMSOL, Parallel processing |
| 相關次數: | 點閱:149 下載:0 |
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3D列印技術為近年蓬勃發展之加工技術,此技術是應用將材料分層堆疊之概念,自動化生產具有複雜形面的三維實體零件,並免去傳統加工之切銷程序不需依賴特製的模具與加工機具。目前發產的個人型3D列印機技術已相當純熟,但材料之選用是以塑膠材料為大宗,而金屬件的製作則須仰賴選擇性雷射燒結(Selective Laser Sintering)與選擇性雷射融熔(Selective Laser Melting)此類大型的設備,其加工材料為顆粒或粉末狀之金屬,在成品完成後須噴除表面批附的多於材料。未來更簡便更親民的金屬3D列印技術之發展將會是一個重要的課題,熔滴沉積之製造方法可以形成緻密的成品,並直接於加工基板上將模型完成而不需做多於耗材之移除,是一項極具發展性之3D列印技術。本研究將針對金屬熔滴之鋪展利用COMSOL有限元素分析軟體建立其流動與固化之數值分析模型,呈現出熔滴動態的鋪展過程。接著討論當研究的規模與精度提高時,記憶體之使用量也將大幅的提高,故本研究將針對COMSOL於叢集電腦上之平行運算做測試,比較不同台數間的差異。
3D printing is a manufacturing technology which is rapid development in this few years. It can synthesize a three-dimensional object with complicated geometry by using additive layer and without using traditional manufacturing like turning or milling.3D printing is very popular and we can see many kind of desktop 3D printer nowadays. But most of their product are made of plastic. If we want to manufacturing metal product, we have to use SLS(selective laser sintering) or SLM(selective laser melting), and the material will be metal powder. But we have to clean out the powder which is covering our product after the process was complete. Developing a more simple and convenient 3D printing technology were an important topic in the future. Melting droplet deposition can generate firm object, and without the remove process like SLM. It is a growth-oriented technology. This article will build an additive manufacturing model about droplet behavior of spreading and solidification by using COMSOL finite element simulation software. When the scale of the model and difficulty became higher. So did the memory usage. Therefore, this article will running COMSOL in parallel and testing the efficacy between dif-ferent number of nodes.
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校內:2019-08-31公開