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研究生：	陳雨生 Chen, Yu-Sheng
論文名稱：	熱聲超材料於散熱和減噪之應用 Thermoacoustic Metamaterials for Heatsink and Noise-reduction Applications
指導教授：	王雲哲 Wang, Yun-Che
學位類別：	碩士 Master
系所名稱：	工學院 - 土木工程學系 Department of Civil Engineering
論文出版年：	2022
畢業學年度：	110
語文別：	英文
論文頁數：	117
中文關鍵詞：	有限元素法、熱聲超材料、冷卻、減噪、微波加熱
外文關鍵詞：	Finite element method, Thermoacoustic metamaterial, Cooling, Noise reduction, Microwave heating
相關次數：	點閱：194 下載：0
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本篇論文主要針對不同幾何形狀之熱聲超材料，當應用於物體表面時，進行有限元素模擬研究，探討其對材料熱學與聲學性質的影響。本文模擬分析四種不同物理模型，分別是半導體晶片冷卻、土木建築物牆面冷卻、物體微波加熱以及牆面減噪，期望透過表面的超材料來改善材料等校性質，以達到特定效果。在不同模型的模擬中，我們將超材料的幾何形狀變化分成三個方向，分別是改變超材料的柱狀物數量、形狀以及材料之間的間距，探討這三個設計方向對於各模型的影響。經由有限元素模擬顯示，在晶片冷卻的模型中，柱狀物的數量可以降低晶片表面的平均溫度，在空氣入流為0.1m/s的情形下，比起沒有超材料於晶片表面的模型，10x10單胞的設計可以減少5.5%的溫度；柱狀物的形狀部分，挖洞的方柱比起其他形狀有最佳的降溫效果；柱狀物的間距也影響散熱效果，間距越大其散熱效果越佳，以3mm以及0.1mm的間距結果為例，在入流為0.1m/s的情形下，可以減少約4.8%的溫度。牆面冷卻的模型中，超材料的使用僅能減緩室內溫度提高的速度，在假設牆外溫度固定且讓整體模型的溫度持續達到平衡的狀況下，牆面使用超材料時的室內溫度反而較高。微波加熱的模型中，柱狀物的數量與間距大小和加熱效率沒有相對應的關係；在形狀部分，金字塔超材料的模型比起沒有超材料於加熱物表面的模型，可以將加熱速率從0.055K/hr提升至1.447K/hr，相當於提升24倍。在牆面減噪的模型中，柱狀物的數量增加可以提升牆面在STL中整體的數值，也代表著超材料的密度對於減噪有一定的效果；從形狀的模擬中得出，10x10的情況下，比起沒有超材料的模型，方柱可以提升12%的平均STL值；間距部分，不同間距的超材料在不同頻率下則有各自的效果，此外改變幾何形狀可在以提升不同頻率區段的STL。

Metamaterials are materials consisting of strongly human influenced microstructures or microprocesses. In this thesis, several designed of thermoacoustic metamaterials were conducted and analyzed for their effects on solid surface on the overall thermal and acoustic properties by using the finite element numerical method. In particular, the cooling of semiconductor chips and building walls was studied, as well as noise reduction and microwave heating. In design of the metamaterials, the aspect ratio of the surface struts and their shape and spacing are design parameters. In the chip cooling study, under 0.1 m/s air flow speed, it was found that a 5.5% reduction on metamaterial's surface temperature, as oppose to the unmodified surface, when the 10x10 unit cells were mounted. In addition, hollowed struts show better temperature-reducing capability. The strut spacing of 0.1 mm case shows a 4.8% temperature reduction when compared to the 3 mm spacing case. In the wall cooling study, the metamaterial can reduce the speed of temperature rising. It is expected that coolant fluid flow around the metamaterial is necessary to reduce indoor temperature. From the microwave study, it is found that the number and spacing of the struts on metamaterial do not affect heating performance. When the shape is pyramidal, heating rate increased from 0.055 K/hr to 1.447 K/hr, roughly a 24-fold increase. In the noise reduction study, the number of struts increase can enhance the overall sound transmission loss (STL) of the wall, indicating the mass effects of the metamaterials on noise reduction. Bandgap and other effects of metamaterials on noise reduction are not studied in the thesis. For the model with 10x10 unit cells, square struts can increase its averaged STL by about 12%, as oppose to unmodified surface. By tuning the strut spacing and shape, STL can be enhanced in certain frequency ranges.

CHINESE ABSTRACT  i
ABSTRACT  ii
ACKNOWLEDGMENTS  iii
LIST OF TABLES  vii
LIST OF FIGURES  ix
NOMENCLATURE  xvii
Introduction  1
1 Goals and motivation  1
2 Literature review  2
2.1 Metamaterial  2
2.2 Heatsink in semiconductor components  2
2.3 Cooling for building  5
2.4 Microwave heating  6
2.5 Acoustic and noise reduction  6
2.6 Laminar flow  7
3 Outline of this thesis  8
Theoretical Backgrounds 9
1 Heat equation  9
2 Thermoelasticity  9
2.1 Summary of equations  13
2.2 Constitutive law  13
2.3 Coupled thermoelasticity  15
2.4 Uncoupled thermoelasticity  17
3 Heat transfer  18
3.1 Conduction  18
3.2 Convection  20
3.3 Radiation  22
4 Microwave heating  23
5 Acoustics  25
Computational information  28
1 Finite element analysis  28
2 Numerical models  28
2.1 Chip cooling  28
2.1.1 Cases with different number of pin-fins  30
2.1.2 Cases with different shape of pin-fins  31
2.1.3 Cases with different spacing of pin-fins  32
2.2 Building cooling  34
2.2.1 Cases with different number of pin-fins  36
2.2.2 Cases with different shape of pin-fins  37
2.2.3 Cases with different spacing of pin-fins  38
2.3 Microwave heating  40
2.3.1 Cases with different number of pin-fins  41
2.3.2 Cases with different shape of pin-fins  42
2.3.3 Cases with different spacing of pin-fins  43
2.4 Noise reduction   45
2.4.1 Cases with different number of pin-fins  46
2.4.2 Cases with different shape of pin-fins  47
2.4.3 Cases with different spacing of pin-fins  48
Results and discussion  50
1 Chip cooling  50
1.1 Effects of the number of pin-fins  50
1.1.1 Cases with 0.01 m/s inflow  50
1.1.2 Cases with 0.1 m/s inflow  52
1.1.3 Cases with 1 m/s inflow  54
1.1.4 Temperature comparison  56
1.2 Effects of the shape of pin-fins  57
1.2.1 Cases with 0.01 m/s inflow  57
1.2.2 Cases with 0.1 m/s inflow  59
1.2.3 Cases with 1 m/s inflow  61
1.2.4 Temperature comparison  63
1.3 Effects of the spacing of pin-fins  64
1.3.1 Case study with 0.01 m/s inflow  64
1.3.2 Case study with 0.1 m/s inflow  66
1.3.3 Case study with 1 m/s inflow  68
1.3.4 Temperature comparison  70
2 Building cooling  71
2.1 Effects of the number of pin-fins  71
2.2 Effects of the shape of pin-fins  75
2.3 Effects of the spacing of pin-fins  78
3 Microwave heating  81
3.1 Effects of the number of pin-fins  81
3.2 Effects of the shape of pin-fins  83
3.3 Effects of the spacing of pin-fins  84
4 Noise reduction  86
4.1 Effects of the number of pin-fins  86
4.2 Effects of the shape of pin-fins  87
4.3 Effects of the spacing of pin-fins  89
4.4 Helmholtz resonator  91
Conclusion and future work  93
1 Conclusion  93
2 Future work  95
LIST OF REFERENCES  96
APPENDICES  99
Appendix A: Presentation slides  99
VITA  117
Index  118
                                    

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