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研究生： 蔡宏佳
Tsai, Hung-Chia
論文名稱： 添加In對Sn-3Ag-2Sb銲點微結構與低週疲勞特性之研究
Effects of Indium Addition on the Microstructure Evolution and Low-Cycle Fatigue Property of Sn-3Ag-2Sb Solder Joints
指導教授： 李驊登
Lee, Hwa-Teng
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年： 2007
畢業學年度： 95
語文別： 中文
論文頁數： 101
中文關鍵詞： 無鉛銲料 、硬度 、Ag2(Sn In) 、低週疲勞 、Sn-Ag-Sb-In
外文關鍵詞： low cycle fatigue, hardness, lead-free solder, Ag2(Sn In), Sn-Ag-Sb-In
相關次數： 點閱：186  下載：1 
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    • 本研究目的在於探討添加1~5 wt% In對Sn-3Ag-2Sb無鉛銲料熔點、微結構、硬度及界面 IMC層之影響，同時利用單邊搭接試件及高溫熱儲存以評估銲點之低週疲勞與抗熱性之影響。
    研究結果顯示Sn-3Ag-2Sb-xIn(SASxIn,x=1,2,3,4,5wt%)銲料熔點隨著In的增加而降低，但固、液相區間卻隨之擴大。Sn-3Ag-2Sb銲料中添加In後，化合物Ag3Sn中Sn原子逐漸被In原子所替代；在未熱儲存時， SAS2In及SAS3In為Ag3(Sn,In)，而SAS4In時轉變成Ag2(Sn,In)；625小時熱儲存後，其比例的轉變點提早在SAS3In時發生，且其形貌隨In含量的上升及熱儲存時間的增加，慢慢由長條與片狀轉變為團塊狀。Sn-3Ag-2Sb-xIn銲料與Cu銲接後，界面層Cu6Sn5中Sn原子被In替代形成Cu6(Sn,In)5。IMC層厚度隨熱儲存時間的增加而變厚，且In添加量越多之銲料，其IMC層成長的幅度越大。
    低週疲勞測試中，在±0.020 mm固定位移量下，銲點第二週期之剪切強度隨著In含量提高而上升，2Sb銲料的剪切強度為34.33 N，在添加In後，SAS1In~SAS5In分別為37.02 N、37.48 N 、41.12 N、48.09 N、51.29 N。此外，未經熱儲存之銲點疲勞壽命大致隨In的添加而增加。而經熱儲存後，由於銲料軟化導致破斷韌性提高，故SAS2In與SAS3In壽命隨著熱儲存時間的增加而延長，SAS4In在225小時熱儲存後，其壽命亦較未熱儲存長，但當時間延長至625小時後，界面金屬層逐漸增厚，形成應力集中效應，使SAS4In銲點破壞模式由銲料內部轉變成銲料與界面的混合模式，此時疲勞壽命將大幅減少。綜合銲料熔點、微結構、疲勞壽命及界面層之變化，研究結果顯示Sn-3Ag-2Sb-3In銲料會有較佳之性質。

    The goal of this research is to evaluate the effects of adding 1~5wt% Indium into Sn-3Ag-2Sb lead-free solder on melting point, microstructure, microhardness and the interfacial reaction with Cu substrate. Furthermore, the single lap specimens and high temperature storage were used to evaluate the low cycle fatigue and heat-resistance of Sn-3Ag-2Sb-xIn solder joints.
    Experimental results show that the melting point of Sn-3Ag-2Sb-xIn solders decreased with indium additions, but the gap between solidus and liquidus temperature (Mushy zone) was expanded at the same time. Indium addition into the Sn-3Ag-2Sb, lead to the partial substitution of Sn atoms in Ag3Sn by Indium. The formation of Ag-Sn-In compound is Ag3(Sn,In) in Sn-3Ag-2Sb-2In and Sn-3Ag-2Sb-3In samples. However, the compounds transform gradually into Ag2(Sn,In) when In addition reach 4wt% and over. After thermal storage for 625 hours, the transformation will be obvious even in Sn-3Ag-2Sb-3In.
    With the increase of indium additions or thermal storage time, the morphology of Ag-Sn-In compounds change from rod-like or disc-like into massive type.
    When Sn-3Ag-2Sb-xIn solders combine with Cu substrate, Ag-Sn-In and Cu-Sn-In IMC compounds were observed on the interfacial microstructure. After the 150℃ thermal storage, thickness of IMC layer will be raised as the Indium addition increasing.
    In the condition with constant displacement of 0.020mm, shear strength of the as-soldered joints is increased with greater In additions. The shear strengths are 34.33 N(Sn-3Ag-2Sb), 37.02 N(1 wt% In), 37.48 N(2 wt% In), 41.12 N(3 wt% In), 48.09 N(4 wt% In), 51.29 N(5 wt% In). Fatigue life of the as-soldered joint approximately increases with greater In additions, and 5 wt% In solder has better fatigue life.
    After 150˚C thermal storage, fatigue life will improve because of the softening of solder joints. So the fatigue life of 2wt% In and 3wt%In solder joints are higher than as-soldered. The thickness of the Intermetallic Compound(IMC) are also increased after thermal storage. The fracture modes of 4wt% In solder joint transit from solder fracture mode to mixture mode with increasing indium additions and storage time. In the meanwhile, fatigue life would be decreased.
    With compare of melting point, microstructure, fatigue life and interfacial behavior of Sn-Ag-Sb-xIn solder. The solder contains 3wt% Indium has better behaviors.

    總 目 錄 授權書 I 口試合格證書 II 中文摘要 III 英文摘要 IV 誌謝 VI 總目錄 VII 表目錄 IX 圖目錄 X 一、前言 1 二、文獻回顧 4 2-1無鉛銲料發展概況 4 2-2二元合金銲料 7 2-3 Sn-Ag-X三元合金銲料 10 2-4可靠度測試 15 2-4-1等溫低週疲勞 16 2-4-2銲點幾何形狀對疲勞壽命的影響 19 2-4-3頻率對疲勞壽命的影響 20 2-4-4界面層對疲勞壽命的影響 22 2-5實驗動機與目的 22 三、實驗步驟與方法 24 3-1實驗規劃 24 3-2試件製備 26 3-3實驗內容 30 四、結果討論 35 4-1銲料熔點與XRD成份分析 35 4-1-1 熔點分析 35 4-1-2 XRD繞射分析 39 4-2銲料微結構 41 4-2-1素材微結構 41 4-2-2 熱儲存對銲料的影響 47 4-3 Sn-Ag-Sb-xIn銲料與Cu之銲接性質 55 4-3-1 Sn-Ag-Sb-xIn銲料與Cu銲接界面上方微結構分析 55 4-3-2界面IMC層成長與形貌變化 65 4-4 Sn-Ag-Sb-xIn銲點之機械性質 71 4-4-1 Sn-Ag-Sb-xIn銲料微硬度 71 4-4-2 Sn-3.5Ag與2Sb銲點之等溫低週疲勞 73 4-4-3添加In對2Sb銲點等溫低週疲勞之影響 76 4-4-4熱儲存對銲點等溫低週疲勞之影響 79 4-4-5斷口分析 87 五、結論 91 六、建議與未來方向 93 七、參考文獻 94 著作權聲明 100 自述 101 表 目 錄 表 2-1 常見金屬元素之基本性質 6 表 2-2 NCMS選出7種最具潛力之無鉛銲料 10 表 3-1 各合金成份物理性質 28 表 3-2 實驗選用之合金成份比例(wt%) 28 表 3-3 助銲劑成份表 28 表 3-4 等溫低週疲勞測試之參數設定 34 表 4-1 SASxIn銲料中化合物的種類 53 表 4-2 銲料微結構之Ag-Sn-In化合物成份整理(at%) 54 圖 目 錄 圖 2-1 Sn-Cu二元相圖 8 圖 2-2 In-Sn二元相圖 9 圖 2-3 Bi-Sn二元相圖 9 圖 2-4 Sn-Ag-Sb三元合金相圖 15 圖 2-5 各種銲料強度測試方式 17 圖 2-6 各種銲料銲點強度測試方式 18 圖 2-7 熱浸法對接銲試件 18 圖 2-8 錫球剪切強度測試圖 18 圖 2-9 常見銲點幾何形狀 19 圖 2-10 相同體積和剪切力下，銲點形狀之應變量分佈圖 20 圖 2-11 銲點高度對疲勞壽命關係圖 20 圖 2-12 SAS1In於熱儲存條件下之荷重與週次關係 23 圖 2-13 SAS5In於熱儲存條件下之荷重與週次關係 23 圖 3-1 實驗規劃流程圖 25 圖 3-2 實際銲接試件放置圖 29 圖 3-3 Cu基板單點剪切試件之示意圖與銲接後實際試件 29 圖 3-4 Shimadzu AG-I微負荷材料試驗機及周邊電腦 33 圖 3-5 試件架設在微負荷拉伸試驗機之夾具上的情形 33 圖 3-6 不同In含量之荷重與位移曲線圖 34 圖 4-1 Sn-Ag-Sb-xIn銲料之DSC曲線 37 圖 4-2 Sn-Ag-Sb-xIn銲料熔點變化曲線圖 38 圖 4-3 Sn-In-Ag三元相圖 38 圖 4-4 圖4-3之A區放大圖 38 圖 4-5 Sn-Sb二元相圖 40 圖 4-6 In-Sb二元相圖 40 圖 4-7 XRD分析結果 40 圖 4-8 SASxIn銲料之素材微結構OM金相 42 圖 4-9 SAS2In銲料之SEM圖及EDS分析 44 圖 4-10 SAS3In銲料之SEM圖及EDS分析 45 圖 4-11 SAS4In銲料之SEM圖及EDS分析 46 圖 4-12 SASxIn銲料於150℃ x 625小時熱儲存後之OM金相 48 圖 4-13 SAS2In銲料經625小時熱儲存後之SEM圖及EDS分析 50 圖 4-14 SAS3In銲料經625小時熱儲存後之SEM圖及EDS分析 51 圖 4-15 SAS4In銲料經625小時熱儲存後之SEM圖及EDS分析 52 圖 4-16 SAS4In銲料深腐蝕之InSb化合物形貌 53 圖 4-17 SASxIn銲料Ag-Sn-In化合物比例 54 圖 4-18 界面上方微結構於625小時熱儲存前後的變化 56 圖 4-19 SAS2In/Cu之深腐蝕界面微結構SEI與EDS成份分析 59 圖 4-20 SAS3In/Cu之深腐蝕界面微結構SEI與EDS成份分析 60 圖 4-21 SAS4In/Cu之深腐蝕界面微結構SEI與EDS成份分析 61 圖 4-22 SAS2In/Cu經625小時熱儲存後之SEM圖及EDS分析 62 圖 4-23 SAS3In/Cu經625小時熱儲存後之SEM圖及EDS分析 63 圖 4-24 SAS4In/Cu經625小時熱儲存後之SEM圖及EDS分析 64 圖 4-25 SASxIn/Cu銲接之界面層形貌與厚度 68 圖 4-26 隨著熱儲存時間變化之界面IMC層總厚度 69 圖 4-27 Cu6Sn5晶粒大小與形貌 70 圖 4-28 添加In對Sn-Ag-Sb銲料之微硬度影響(As-cast) 72 圖 4-29 Sn-Ag-Sb-xIn銲料經高溫熱儲存後微硬度變化 72 圖 4-30 Sn-3.5Ag銲點未經熱儲存之hysteresis loop 74 圖 4-31 Sn-3.5Ag銲點未經熱儲存之荷重下降情形 75 圖 4-32 2Sb銲點未經熱儲存之荷重下降情形 75 圖 4-33 各銲料銲點於未熱儲存條件下之第二週期hysteresis loop 78 圖 4-34 各銲料銲點未經熱儲存之荷重與週次關係圖 78 圖 4-35 Sn-3.5Ag銲點於熱儲存條件下之第二週期hysteresis loop 82 圖 4-36 Sn-3.5Ag銲點於熱儲存條件下之荷重與週次關係圖 82 圖 4-37 Sn-3Ag-2Sb銲點於熱儲存條件下之第二週期hysteresis loop 83 圖 4-38 Sn-3Ag-2Sb銲點於熱儲存條件下之荷重與週次關係圖 83 圖 4-39 SAS2In銲點於熱儲存條件下之第二週期hysteresis loop 83 圖 4-40 SAS2In銲點於熱儲存條件下之荷重與週次關係圖 84 圖 4-41 SAS3In銲點於熱儲存條件下之第二週期hysteresis loop 84 圖 4-42 SAS3In銲點於熱儲存條件下之荷重與週次關係 84 圖 4-43 SAS4In銲點於熱儲存條件下之第二週期hysteresis loop 85 圖 4-44 SAS4In銲點於熱儲存條件下之荷重與週次關係圖 85 圖 4-45 SASxIn銲點熱儲存前後之破斷模式 85 圖 4-46 不同銲料成份經熱儲存後之銲點疲勞壽命 86 圖 4-47 不同成份銲點未經熱儲存之疲勞破壞巨觀模式 88 圖 4-48 SAS4In銲點經625小時熱儲存後之疲勞破壞巨觀 89 圖 4-49 Sn-3.5Ag銲點經625小時熱儲存後之疲勞破壞 89 圖 4-50 SAS2In銲點經625小時熱儲存之破斷面分析(銲料破壞) 89 圖 4-51 SAS3In銲點經625小時熱儲存之破斷面分析(銲料破壞) 90 圖 4-52 SAS4In銲點經625小時熱儲存之破斷面分析(混合式破壞) 90

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