本論文主要是利用電磁模擬軟體設計微機電元件，研究利用封裝的方式，改善微機電元件特性方面的研究。由於無線通訊是未來的一個趨勢，所以我們提出利用電磁耦合的方式，來取代傳統接線傳遞訊號的封裝。首先針對我們利用雙傳輸線法，並且萃取S參數來計算微機電薄膜的等效介電常數。接著就封裝的部份，利用電磁耦合的方式將訊號傳遞到微機電薄膜上的傳輸線，並且分析找出主要影響特性，頻率的因素，並且利用利用遮蔽層使得原本的特性有一個改善，反射損失改善了16dB，並且在20GHz的地方有一個零點的產生，使得衰減率也大為提升。最後將這個技術運用在微機電薄膜上的濾波器，濾波器大小約為3.5mm * 3 mm，並且利用此封裝技術改善它的特性。

　　This thesis is suggested a novel packaging technology which is made for MEMS devices. This novel packaging is different from conventional packaging such as BGA, Flip-chip which need to bond gold wires to transmit signal. Because MEMS devices are easy broken by environmental temperature or outside force, the novel packaging technique avoided bonding and made by electromagnetic coupling to transmit signal. High Frequency structure simulator (HFSS) is the major tool to simulate and design the MEMS packaging structure. First, the effective permittivity of MEMS membrane was calculated and was closed to 1.14. The second, the transmission line was made on the membrane and the novel packaging was fabricated. The result of the novel packaging can provide an use which likes filter. The third, an application of micro-shield was made on the MEMS device. It was promoted the effect of device and reduced the loss. At last, a 16 GHz band-pass filter was fabricated on the membrane and the packaging could promote the effect of MEMS devices.

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