扇出型面板級封裝因具備高 I/O 密度、大面積製程能力與成本效益，已成為先進封裝的重要技術。然而，多種材料熱膨脹係數與彈性模數的差異，易在降溫與載板卸除階段造成翹曲，進而影響對位精度、組裝良率與產品可靠度。本研究以ANSYS有限元素模擬分析方法結合田口方法，選取環氧模封料、載板材料及晶體數量等三項控制因子，探討其對翹曲行為之影響。
本研究以實際製程尺寸之 300×300 mm FOPLP 面板為分析對象，利用有限元素分析軟體 ANSYS 建立完整封裝結構模型，系統性探討環氧封裝材料、載板材料及晶體數量等關鍵控制因子對面板翹曲行為之影響。研究中採用田口實驗設計方法進行模擬規劃，並透過主效應分析與交互作用分析，量化各控制因子及其組合對翹曲變化之影響程度。
模擬結果顯示，在大面板尺度條件下，各控制因子對翹曲行為之影響具有明顯差異，其中晶體數量與材料性質之交互作用對翹曲變化尤為顯著。研究成果可作為FOPLP面板級封裝在材料選擇與結構設計上的參考依據，並有助於建立實際製程條件下之翹曲控制策略。

This study investigates the warpage behavior of fan-out panel-level packaging (FOPLP) by integrating finite element analysis (FEA) with the Taguchi design of experiments. A full-scale 300 × 300 mm panel model was developed to capture realistic process-induced deformation and scale-dependent effects. Three key control factors—epoxy molding compound (EMC), substrate material, and die quantity—were systematically evaluated using a Taguchi L9 orthogonal array. Warpage was defined as the out-of-plane displacement difference across the panel surface, and both main effects and interaction effects were quantitatively analyzed through ANOVA and interaction metrics based on deviation from additivity and root mean square (RMS).
The results show that EMC is the most influential factor due to its thermo-mechanical properties, followed by die quantity and substrate material. Significant nonlinear interactions were observed, particularly between EMC and die quantity, indicating that warpage cannot be accurately predicted using single-factor or additive approaches alone. An optimal factor combination was identified and validated through simulation, demonstrating good agreement with predicted results. The proposed methodology provides a robust framework for analyzing multi-factor interactions and offers practical guidelines for material selection, structural design, and warpage control in large-scale FOPLP applications.

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