本論文使用有限元素分析軟體ANSYS-Workbench 軟體來分析薄型QFN於測試篩選機與測試插槽之力學行為，並透過實際實驗之結果與軟體模擬結果進行匹配，並經由CAD軟體來建立薄型QFN封裝體以及測試插槽，並利用QFN構裝體之三點彎曲測試結果來比對模擬結果進而確認構裝體模型的可靠性。進而，延伸至當薄型QFN構裝體在測試環境下的因應力集中、塑性應變等力學行為對構裝體產生的不可回復性破壞來進行分析與改善，並透過測試插槽組件的設計變更，馬達作動參數優化等方式來改善測試時所產生的應力對構裝體破壞比例。

In this paper, the finite element software ANSYS is used to analyze the mechanical dynamic behavior of the extra thin QFN electronic packages in the test handler and the test socket. The simulation results of the ANSYS is used to match actual experiment results and is used in the CAD software “SpaceClaim” to build the extra thin QFN electronic package models of test environment (Test Socket, Pick Up Head, … etc). Then, the three-point bending test is conducted on the extra thin QFN electronic packages and the test result is compared with the ANSYS simulation to confirm the model reliability. The electronic package body and the test slot are respectively used to compare the simulation results with the three-point bending test result of the QFN electronic package structure to confirm the reliability of the package body model. Finally, the thin QFN electronic package model is used to analyze and improve the irreversible destruction caused by the mechanical behavior such as the stress concentration and ultimate strain in the test environment. It is also used to optimize the pick&place nozzle motor actuation parameters and the design change of the test socket assembly. It has been shown that the QFN electronic package crack and die crack ratios are drastically reduced.

1.D.Yang,M. Kengen, W.G.M. Peels, D. Heyes, and W.D.vanDriel, “Reliability Modeling on a MOSFET PowerPackage Based onEmbedded Die Technology”, 10th. Int.Conf. on Thermal, Mechanical and MultiphysicsSimulation and Experiments in Micro-Electronics andMicro-Systems, EuroSimE, pp.1-6, 2009.
2.M.G.Petcht, R.Agarwal,P.McCluskey, T.Dishong, S. Jadavpourand R.Mahajan, “Electronic Packaging Materials and their Properties”, CRC Press, London, pp. 13-15,1999.
3.K. Morgan, “Shock & Vibration using ANSYS Mechanical“ ANSYS, 2015. [Online].
4.T. P. Valayil and J. Issac, “Crash Simulation in ANSYS LS-DYNA to explore the crash performance of composite and metallic materials”, International Journal of Scientific & Engineering Research, Vol. 4, Issue. 8, 2013.
5.H. H. Lee, “Finite Element Simulations with ANSYS Workbench 19.0” SDC, Publications, 2018.
6.C.E.Tan, and GealeFonseka, “QFN Miniaturization: Challenges and Solutions,” Proc 31st International Electronics Manufacturing Technology Conf, Malaysia,Nov., pp 314-319, 2006.
7.T. Y. Tee, H.S. Ng, D Yap, Z. W.Zhong“Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages”. MicroelectronReliab, 2003.
8.孟慶勳，「有限元素分析凹痕圓管在循環負載下之行為」，國立成功大學工程科學研究所碩士論文, 2015.
9.曾詠茹，「有限元素分析不同外徑/壁厚比局部圓形凹痕圓管在循環彎曲負載下之行為」，國立成功大學工程科學研究所碩士論文, 2016.
10.鄭伃汝，「有限元素分析不同深度凹痕圓管在循環彎曲負載下之凹痕變形」，國立成功大學工程科學研究所碩士論文, 2016.
11.林倩如，「有限元素分析局部尖銳凹痕圓管在循環彎曲負載下之行為」，國立成功大學工程科學研究所碩士論文, 2016.
12.S. S. Pradeep“Impact of Layer Thickness of QFN Package Mounted Printed Circuit Boards During Drop Testing” Ms-Thesis, The University of Texas at Arlington 2015.
13.NXP internal report. ”2017 NXP 74thBIC-RCPS_Turret Handler _interial final presentation”,2017.
14.NXP internal report. “2018 NPI ATKH Alignmant and Opportunities”,2018
15.T. Futushims, H. Tsunezaki, K.I. Manabe, S. Alexsandrov “Ductile fracture and free surface roughening behaviors of pure copper foils for micro/meso-scale forming”International JournalofMachineTools&Manufacture76 pp.34-48, 2014.
16.許峻嘉，「薄型QFN封裝側面撞擊產生之破壞分析與改善」，國立成功大學工程科學研究所碩士論文, 2019.