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| 研究生： |
林文山 Lin, Wen-Shan |
|---|---|
| 論文名稱： |
覆晶封裝底部封膠技術之研究 Study on underfill encapsulation of flip chip |
| 指導教授： |
楊文彬
Young, Wen-Bin |
| 學位類別： |
碩士 Master |
| 系所名稱： |
工學院 - 航空太空工程學系 Department of Aeronautics & Astronautics |
| 論文出版年： | 2003 |
| 畢業學年度： | 91 |
| 語文別： | 中文 |
| 論文頁數： | 70 |
| 中文關鍵詞： | 毛細作用 、底部封膠 、覆晶 、錫球間距 |
| 外文關鍵詞： | flip-chip, bumping pitch, capillary, underfill encapsulant |
| 相關次數： | 點閱：266 下載：8 |
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在電子產業之快速發展中，為了因應產品短小、輕薄、高密度I/O等發展的要求，半導體封裝技術朝面陣列封裝的趨勢來發展。近年來，有別於一般傳統封裝(wire bonding)之覆晶（flip chip）因具備低成本、迷你化、重量輕和高性能等眾多優點，而於現今封裝技術中，有舉足輕重的角色；然而由於晶片與基板的熱膨脹係數差異頗大，在組裝過程中，易因熱循環產生熱應力集中，造成元件的破壞；為了減少熱應力的產生，在晶片與基板中充填封裝材料，以減少晶片與基板之熱膨脹係數差異。但是由於利用然毛細作用力做為充填驅動力，充填時間相當長，且充填過程易產生缺陷，因此，如何縮短製程時間及充改善充填品質來提高生產效能是覆晶封裝技術發展的主要關鍵。本文希望針對毛細作用填膠的過程，研究不同的錫球間距與排列方式對毛細作用的影響，以充分了解填膠時毛細作用的特徵與流場間的關係，並嘗試以不同幾何設計來改變填膠過程的速度。經實驗發現，不同的間距配合適當的排列方式可得到理想的流動模式，搭配幾何形狀的改變可進一步縮短流動時間。
關鍵字：覆晶、底部封膠、毛細作用、錫球間距
The demands of electronic packages toward lower profile, lighter weight, and higher density of I/O leads to rapid expansion in the field of area array package. Based on this concept, development of flip chip technology attracts more attention than the traditional package such as wire bonding. However, due to the mismatch of the coefficient of thermal expansion between the chip and substrate, the solder joints will experience fatigue failure during temperature cycling and lead to electrical failure. This problem can be significantly reduced by filling the gaps between chip and substrate with encapsulant. The underfilling process is driven by capillary force and this slow process of underfilling limits the productivity. Therefore, it is essential to increasing the filling speed in the underfilling process and avoids the defects. In this study, the effects of the solder bump pitch and chip geometry on the underfilling flow were investigated. It was found that the geometric shape of the chip might affect the filling speed of the underfilling process. In filling of fine pitch solder bumps, the capillary effect is anisotropic, which leads to the non-uniform filling pattern observed in experiments.
Key word：flip-chip、underfill encapsulant、capillary、bumping pitch
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2005-07-07公開