本研究目地在探討於Sn-Ag-Sb無鉛銲料中添加不同重量百分比的Ni粉顆粒(0.5,1wt.%)對Sn-Ag-Sb銲點微結構的影響。並利用單邊搭接試件及高溫儲存試驗來評估銲點剪切強度與抗熱性的影響。

　　實驗結果顯示，添加Ni至Sn-Ag-Sb銲料後，微結構仍為Ag3Sn與-Sn所構成的環狀結構，且Ni會與Sn反應生成Ni3Sn4化合物於銲料內析出，添加1wt.%Ni的Ni3Sn4化合物生成量比添加0.5wt.%Ni來得多。Sn-Ag-Sb-xNi銲料與Cu片銲接後，Cu會擴散至銲料中並取代部分的Ni，使得原先的Ni3Sn4化合物轉變為(Ni,Cu)3Sn4。而Ni會取代部分的Cu而使界面IMC層變為(Cu,Ni)6Sn5，且界面IMC層中較靠近銲料端為(Cu,Ni)6Sn5，較靠近銅片端仍然為Cu6Sn5。經150℃高溫儲存後，(Cu,Ni)6Sn5層厚度沒有變化，添加0.5wt.%及1wt.%Ni銲料的(Cu,Ni)6Sn5層厚度分別約為4.6與6.0μm，Cu6Sn5層則持續生長，添加0.5wt.%及1wt.%Ni分別從3.2與4.2成長至5.8與7.3μm。

　　在剪切強度方面，Sn-3Ag-2Sb-0.5Ni銲點剪切強度為92.3MPa，比未添加Ni的Sn-3.5Ag(44.2MPa)及Sn-3Ag-2Sb(54.8 MPa)高，另外與添加3.86 wt.%Sb的銲料(62.5MPa)比較也較高，顯示在低Sb含量的銲料添加0.5wt.%Ni，可達到高Sb銲料的剪切強度。 而添加1wt.%Ni的剪切強度(77.5 MPa)反而比添加0.5wt.%Ni還要低。從觀察銲點的破壞位置可發現，添加1wt.%Ni銲點的破斷模式主要以混和模式與界面層為主，而其他三種主要都是破斷在銲料處，可知添加1wt.%Ni後界面強度弱化，因而造成銲點剪切強度的下降。添加0.5wt.%Ni的銲點經150℃x625小時高溫儲存後，其剪切強度(81.41MPa)仍然比未經高溫儲存的Sn-3.5Ag(44.2 MPa)及添加2wt.%Sb(54.8 MPa)的銲點高，顯示在Sn-Ag-Sb無鉛銲料內添加0.5wt.%Ni粉顆粒對銲料的抗熱性有提升的效果。綜合銲點剪切強度、抗熱性及破壞模式，在Sn-Ag-Sb無鉛銲料中添加0.5wt.%Ni粉顆粒會有較佳性質表現。

　　The effect of Ni particle additions (0.5,1 wt%) on microstructure of Sn-Ag-Sb solder joints is studied in this research. The single lap specimens are employed and high temperature storage tests are performed to evaluate the shear strength of solder joint and their thermal resistance.
The experimental results show that the microstructures of solder are composed of Ag3Sn and -Sn in form of circular structure when Ni particles are added. Ni will react with Sn to form the Ni3Sn4 compound precipitated in the solder. 　
　　The amount of Ni3Sn4 precipitate is increased with increasing Ni Addition. After the Sn-Ag-Sb-xNi solder are combined with the Cu substrate, the Cu atoms will diffuse from the substrate into the solder, and the original Ni3Sn4 compound will transform into (Ni,Cu)3Sn4, because some Ni atoms will be replaced by the Cu atoms. The Ni atoms will also replace some Cu atoms to make IMC layer turn into (Cu,Ni)6Sn5. There are two distinct regions in the IMC layer. The region near the solder has a composition of (Cu,Ni)6Sn5, and the composition of the region near the Cu substrate is still Cu6Sn5. After high temperature storage at 150℃, the thickness of (Cu,Ni)6Sn5 layer has no evident change, the thickness is 4.6 and 6.0μm with the 0.5 and 1wt.% Ni particles additions. But the Cu6Sn5 layer grows continuously, the Cu6Sn5 layer grows up from 3.2 to 5.8μm by 0.5wt.% Ni addition and 4.2 to 7.3μm by 1 wt.% Ni addition.

　　The shear strength of the Sn-3Ag-2Sb-0.5Ni solder joint is 92.3MPa, which is much higher than that of Sn-3.5Ag(44.2MPa) and Sn-3Ag-2Sb(54.8MPa) solder joints. Compare the shear strength with Sn-2.92Ag-3.86Sb solder joints(62.5MPa), Sn-3Ag-2Sb-0.5Ni solder joint also has higher strength. It shows that adding 0.5wt.% Ni particles into solder with low Sb addition in more effective on strength behavior than higher Sb addition. But the shear strength of solder joint with 1wt.% Ni particles addition(77.5 MPa) is contrarily lower than with 0.5wt.% Ni particles addition. Fracture observation reveals that the fracture mode of solder joints with 1wt.% Ni particles addition is mainly mixture of solder and IMC fracture mode, and the rest are mainly solder fracture mode. It shows that the adding of 1wt.% Ni particles lead to fracture occurred on IMC layer, and result in the decrease in shear strength. After high temperature storage at 150℃x 625hrs, the shear strength of solder joint with 0.5wt.%Ni additions(81.41MPa) is still higher than the strength of as-soldering Sn-3.5Ag solder joints(44.2MPa) and Sn-3Ag-2Sb solder joints(54.8MPa). It shows that adding 0.5wt.% Ni particles can improve the thermal resistance of solder joints. According to the shear strength and thermal resistance and fracture mode, the solder adding 0.5wt.% Ni particles has better performance.

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