在電子IC構裝封膠製程中，封膠材料（EMC；Epoxy Molding Compound）在熟化成型過程中會與IC模具表面產生黏著的現象，稱之為黏著效應（Adhesive Effects）；而此黏著效應對於脫模作業過程會有所影響，甚至可能會造成封膠失敗、可靠度不佳與生產良率降低等結果。所以如何在不影響現有模具設計前提下，能夠藉由適當的表面處理以及鍍膜選擇，來有效改善封裝生產線產能，是目前產業界及研究單位所重視的主題。
本論文將利用已開發完成的一套電子構裝黏著力量測技術來進行界面科學的研究，並且配合田口氏實驗設計法，針對影響IC封裝模具與塑料膠體間黏著力之重要製程參數可控制因子，進行因子效應的研究。且進行各因子對黏著力的因子效應、因子與表面處理之交互作用等工作事項，進而得知各製程參數控制因子對黏著效應的關係。
同時，本論文也將利用自行發展的量測技術，配合膠體且搭配IC構裝製程中的製程參數來進行連續實驗，並觀察其黏著力量的趨勢，希望可以找出黏著效應發生的原因，確實掌握清模時機，進而增加產能，解決黏模問題，以減少黏模效應所產生的不良影響。

In IC packaging, when epoxy molding compound（EMC）is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate.
In this project, we will use the adhesion tester to measurement adhesion force in the interface between EMC and mold surface. By measuring the adhesion force, we can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. In this project, we also study the IC encapsulation mold adhesion force using Taguchi’s parameter design method. By using Taguchi’s method, we can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
In IC encapsulation process, some residue substance will adhere to the mold surface after 500 to 600 shots. Using the EMC adhesion force test technology, one can measure the adhesion force between mold surface and EMC continuously. By recording the adhesion force and analyzing the mold surface, we can understand more about what happened and key issues for mold adhesive effects in IC encapsulation process.

[1] Loos, A. C., and G. S. Springer, “Curing of the Epoxy Matrix Composites,” J. Comp. Mat., 135, (1983).

[2] Springer, G. S., “Resin Flow During the Curing of Fiber Reinforced Composites,” J. Comp. Mat., 16, 400(1982).

[3] Gonzalez, U. F., S. F. Shen, and C. Cohen, “Rheological Characterization of Fast-Reacting Thermosets Through Spiral Flow Experiments,” Polym. Eng. Sci., 32, 172-181(1992).

[4] Frutiger, R. L., “The Effect of Flow on Cavity Surface Temperatures in Thermoset and Thermoplastic Injection Molding,” Ploym. Eng. Sci., 26, 243-254(1986).

[5] Lee, C. C., and C. L. Tucker III, “Flow and Heat Transfer in Compression Mold Filling,” J. Non-Newtonian Fluid Mech., 245-264(1987).

[6] “Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading,” STD. ASTM D1002-94.

[7] “Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds,” STD. ASTM D1062-96.

[8] “Standard Test Method for Tensile Properties of Adhesive Bonds,” STD. ASTM D897-95a.

[9] B. A. Chapman, H. D. DeFord, G. P. Wirtz and S. D. Brown, in: Technology of Glass, Ceramic, or Glass-Ceramic to Metal Sealing, W. E. Moddeman, C. W. Merten and D. P. Kramer(Eds), MD-Vol. 4,pp. 77-87. American Society of Mechanical Engineers, New York(Copyright 1987).

[10] Xiang Dai, Mark V. Brillhart, and Pauil S. Ho, “Polymer Interfacial Adhesion in Microelectronic Assemblies,” Manuscript for the 48th Electronic Components and Technology Conference, Seattle, Washington (1998).

[11] 張祥傑, “微材料測試系統之設計與製作,” 國立成功大學機械工程研究所碩士論文(1999).

[12] 王俊祥, ”電子封裝黏模效應之量測技術開發與研究,” 國立成功大學機械工程研究所碩士論文(2000).

[13] 莊俊華, ”IC構裝黏模測試機之設計與製造,” 國立成功大學工程科學研究所碩士論文(2001).

[14] R. J. Good, “Treatise on Adhesion and Adhesives,” Vol. 1, R. L. Partick, ed., MARCEL DEKKER INC(1967).

[15] 韓錦鈴, “環氧樹脂及聚胺脂交聯環氧樹脂之研究,” 國立台灣大學材料科學研究所博士論文(1993).

[16] Matsumoto, A. and M. Oiwa,”Studies of Polymerization of Diallyl Compounds. VII. Kinetics of the Polymerization of Diallyl Esters of Aliphatic Dicarboxylic Acids,” J. Appl. Polym. Sci., 17, 2415(1973).

[17] Son, P. N. and C. D. Weber, “Selectivity and Kinetics of Epoxy Resin-Bisphenol A Reaction Catalyzed by Certain Guanidine Derivatives,” J. Appl. Sci., 17, 2415(1973).

[18] Babaylvsky, P. G. “Epoxy Thermosetting Systems: Dynamic Mechanical Analysis of the Reactions of Aromatic Diamines with the Diglycidyl Ether of Bisphenol A,” J. Appl. Polym. Sci., 17, 2067(1973).

[19] Lee, W. A. “Study of Cure of Epoxy Resins by Torsional Braid Analysis,” Brit. Polym. J., 15, 40(1983).

[20] Horie, K. “Calorimetric Investigation of Polymerization Reactions III. Curing Reaction of Epoxides with Amines,” J. Polym. Sci., A-1,8, 1357(1970).

[21] Willard, P. E. “Determination of Cure of Diallyl Phthalate Using Differential Scanning Calorimetry,” Polym. Eng. Sci., 12, 120(1972).

[22] Kamal, M. R. “Kinetics and Thermal Characterization of Thermoset Cure,” Polym. Eng. Sci., 13, 59(1973).

[23] Prime, R. B. “Differential Scanning Calorimetry of the Epoxy Cure Reaction,” Polym. Eng. Sci., 13, 365(1973).

[24] Dusek, K. and M. Bleha, “Curing of Epoxide Resins: Model Reaction of Curing with Amine,” J. Polym. Sci., Polym. Chem. Ed., 15, 2393(1979).

[25] Moroni, A., J. Mijovic, E. M. Pearce, and C. C. Foun, “Cure Kinetics of Epoxy Resins and Aromatic Diamines,” J. Appl. Polym. Sci., 32, 3761(1986).

[26] Pusatcioglu, S. Y., A. L. Fricke and J. C. Hassler, “Hests of Reaction and Kinetics of a Thermoset Polymer,” J. Appl. Polym. Sci., 24, 937(1979).

[27] B. A. Chapman, H. D. DeFord, G. P. Wirtz and S. D. Brown, in: Technology of Glass, Ceramic, or Glass-Ceramic to Metal Sealing, W. E. Moddeman, C. W. Merten and D. P. Kramer(Eds), MD-Vol. 4,pp. 77-87. American Society of Mechanical Engineers, New York(Copyright 1987).

[28] J. D. Achenbach ”Fracture mechanics : fundamentals and applications” (1994)

[29] S. D. Brown, Room-Temperature Adhesive Strength Tests of Various Flame-Sprayed and Flame-Plated Ceramic Coatings. Progress Report No. 20-374. Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA (1959).

[30] ASTM Standard C633-79, Standard Test Method for Adhesion of Cohesion Strength of Flame-Sprayed Coatings. 1992 Annual Book of the ASTM Standards, Vol.02.05, pp. 663-667(1992)

[31] 李輝煌編著, ”田口方法─品質設計的原理與實務,” 國立成功大學工程科學系(2000)