Sn-Zn合金具有電導率佳之優點，應用於光伏導帶上可改善光伏模組之電子傳遞效率。因此本實驗選用Sn-9Zn、Sn-25Zn及Sn-50Zn三種成分之無鉛銲錫合金，作為應用在太陽能模組上光伏銅帶之鍍錫層，並以剝離力測試及界面組織觀察評估Sn-Zn合金對光伏模組之適用性，接著以高電流通電測試模擬之後應用上界面變化對Sn-Zn光伏模組體電阻之影響。
從光伏銅帶之界面組織觀察顯示，銅帶經過浸鍍後會在solder/Cu界面處形成Cu5Zn8層，且厚度隨著Zn含量增加而上升。與銀膠回銲之後，Ag會和Zn形成介金屬化合物AgZn3及AgZn，且AgZn會隨著回銲時間增加而消失並轉而生成AgZn3，AgZn3主要分布在solder/Cu5Zn8及solder/Ag界面處。隨著AgZn3持續生成，基板上之銀膠同時被消耗導致厚度降低。剝離測試結果則顯示，Sn-9Zn多由solder/Cu界面處破壞，而Sn-25Zn及Sn-50Zn則由銲錫基地中及銀膠和基板界面處破壞，且光伏模組之剝離力隨著Zn含量及回銲時間增加而降低。由界面組織及剝離結果推論，介金屬化合物之生成可增加界面接合強度，而添加過多之Zn會消耗銀膠導致模組接合強度降低。
經由通電測試可觀察到，使用Sn-Zn合金作為銲錫之光伏模組，其體電阻較錫銀銅合金低，且以Sn-25Zn合金具有最低之體電阻。而經過長時間高電流密度通電後，三種成分之Sn-Zn光伏模組之體電阻皆上升，上升幅度隨著鋅含量增加而變大。通電後之模組界面組織演變則為銲錫基地相中之殘留富鋅相持續與Cu及Ag反應生成IMC並消耗銀膠，殘留富鋅相也因此而減少。

Due to its excellent conductivity, Sn-Zn lead-free solder can be applied to photovoltaic ribbon (PV ribbon) for improving the efficiency of electron transport. The Sn-xZn lead-free alloys (x= 9, 25, and 50 wt%) were used for photovoltaic copper ribbon in this study. The applicability of Sn-xZn alloys were evaluated by peel test and interfacial microstructure. And then, electrification test with high current density was applied to photovoltaic module (PV module), and the interfacial microstructures before and after electrification test were observed to estimate how the interface transition affected the volume resistence of PV module.
The interfacial microstructure of the PV ribbon reveals that Cu5Zn8 layer forms between Sn-Zn solder and Cu after dipping, and the thickness of Cu5Zn8 layer increases with increasing the Zn content. After reflowing with Ag paste, Ag reacts with Zn to form intermetallic compound (IMC) including AgZn3 and AgZn. AgZn will transform into AgZn3 as reflowing time increases, AgZn3 mainly forms at both Sn-Zn solder/Cu5Zn8 interface and Sn-Zn solder/Ag interface. The thickness of Ag paste decreases when AgZn3 keeps forming because Ag paste is consumed to form AgZn3. The result of peel test shows the fracture of Sn-9Zn PV module is situated at Sn-9Zn solder/Cu interface, but that of Sn-25Zn and Sn-50Zn modules occurs not only between Ag paste and substrate but in Sn-Zn solder base. The peel force of PV module decreases as Zn content and reflowing time increase. According to interfacial microstructure and peel test, the generaton of IMC can improve the bonding strength between solder and substrate, while the excessive zinc can consume Ag paste and decrease the bonding strength.
After electrification test, the volume resistence of Sn-Zn PV module is less than that of Sn-Ag-Cu PV module, and that of Sn-25Zn is the lowest one. All the volume resistence of Sn-Zn PV modules increase after prolonged electrification and the rise range of their volume resistence increases with increasing the Zn content. The residual Zn-rich phase in solder base reacts with Cu and Ag to form IMC and consumes Ag paste, causing Ag paste to become thinner, and the residual Zn-rich phase becomes less.

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