| 研究生: |
謝一豪 Hsieh, Yi-Hao |
|---|---|
| 論文名稱: |
在Tri-Dexel基準下使用Marching Cube來平滑化三維表面與銳利化邊緣特徵及工件輪廓量測 Tri-Dexel-Based 3D Surface Smoothing and Feature Sharpness Enhancement Using Marching Cube and Workpiece Profile Measurement |
| 指導教授: |
連震杰
Lien, Jenn-Jier |
| 學位類別: |
碩士 Master |
| 系所名稱: |
電機資訊學院 - 資訊工程學系 Department of Computer Science and Information Engineering |
| 論文出版年: | 2016 |
| 畢業學年度: | 104 |
| 語文別: | 英文 |
| 論文頁數: | 56 |
| 中文關鍵詞: | 逆向工程 、切削模擬 、自動光學檢測 、Tri-dexel 、Marching Cube |
| 外文關鍵詞: | Reverse Engineering, Milling Simulation, AOI, Tri-dexel, Marching Cube |
| 相關次數: | 點閱:104 下載:0 |
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本論文提出一套逆向工程系統,並研究實作其中的三個子系統:一、從點雲到CAD轉換子系統,二、切削模擬子系統,三、工件二維輪廓量測與誤差計算子系統。首先使用三維重建系統建立岀待測物的點雲,在第一個子系統中,將點雲轉換為tri-dexel架構模型,並使用基於Marching Cube衍生岀的演算法,來建構並校正模型的表面平滑度及邊角銳利度。接著,將CAD進行切銷路徑的計算,產生CAM與NC加工路徑後帶入第二個子系統。第二個子系統中基於tri-dexel架構模型,數位化模擬CAD/CAM系統中產生的NC加工路徑,用以在加工前檢測加工路徑的正確性,並回饋錯誤資訊以進行路徑校正優化。優化後的切削路徑輸入機台並切削加工後,將工件成品帶入第三個子系統。第三個子系統中,使用自動光學檢測的方式,將工件取像後使用影像處理演算法偵側輪廓,並計算誤差,用以校正機台或切削路徑使用。最後,在檢測誤差小於制定的閥值後,即可得到逆向工程推算岀的工件。
The thesis establishes a reverse engineering system and researches three subsystem: (1) Converting point cloud to CAD. (2) Milling simulation. (3) Workpiece profile measurement. In first subsystem, converting point cloud reconstructed by DLP to tri-dexel model and using some Marching Cube algorithms to construct and correct the model with smooth surface and sharp feature. Then estimating the tool path CAM and NC code of CAD and bringing them to the second subsystem. In second subsystem, using tri-dexel model and Boolean operation to perform the NC code on the computer and judging the tool path in NC code is correct or not. The third subsystem using AOI to take pictures of workpiece and detecting the profile using image processing. After getting the profile information, estimating the error between profile and CAD to compensate the tool path. If the error is less than threshold, the reverse engineering is finish and get the workpiece.
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校內:2021-12-31公開