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研究生: 陳弘達
Chen, Hung-Ta
論文名稱: 以微機電技術製作含溫度感測器之微流道系統及兩相流熱傳研究
Fabrication of micro-channel system with temperature sensors by MEMS for study two phase flow heat transfer
指導教授: 高騏
Gau, Chie
學位類別: 碩士
Master
系所名稱: 工學院 - 航空太空工程學系
Department of Aeronautics & Astronautics
論文出版年: 2005
畢業學年度: 93
語文別: 中文
論文頁數: 72
中文關鍵詞: 熱傳微流道
外文關鍵詞: heat transfer, micro-channel
相關次數: 點閱:97下載:9
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  •   本研究之主要目標在於研發一套建構在Pyrex 7740玻璃之上的微流道系統,其中並利用微電機機械系統(MEMS)製造技術將微陣列溫度感測器及微加熱器整合於微流道晶片。模型建立方法為將微陣列溫度感測器密集且等間距地埋設在微流道壁面,每個感測器之線寬僅有3μm、間距92μm,可詳細地量測底部具有微加熱器之微流道內部的局部壁面溫度,並進行研究不同進口雷諾數條件的局部微尺寸熱流傳輸現象。另外於微加熱器部分,經由溫度校正實驗可得一TCR趨近於零的溫度-電阻關係式,在提供一固定的直流電壓情況下,可供微流道一穩定的加熱功率。

      在製程方面,微陣列溫度感測器與微加熱器的材質皆為金屬,並利用金屬剝離法(Lift Off)將兩者分別製作於Pyrex 7740玻璃上,其中利用電漿輔助式化學器相沉積法(PECVD)製作絕緣層於金屬層間。待製作完畢後,由於晶圓會因為感測器的存在而使得表面呈現高低起伏情形,所以在製作微流道結構之前,利用SOG將晶圓表面做平坦化處理,以減少表面粗糙度對微流道內部的熱傳影響。

      最後在製作微流道結構體時,皆使用極低熱傳導係數的材料如:SU-8負型光阻、環氧樹脂、PMMA及玻璃基材,因此可非常有效地減少及控制熱系統的熱損失,並精確地量取微加熱管道內局部詳細的熱傳分佈資料。

      Fabrication of a complicated micro-channel system on a Pyrex 7740 glass substrate by MEMS technique is developed. The channel is integrated with a set of micro heater and an array of temperature sensors for study of the local micro-scale heat transfer process at different Reynolds number flow conditions. The heaters are designed to be able to provide uniform heating with TCR being almost equal to zero. The micro temperature sensors have the width of only 3μm that can provide precise measurement of wall temperatures and can be used to obtain the local heat transfer coefficient.

      Lift off method is used to pattern the metal film deposited on the Pyrex 7740 glass wafer to obtain both the micro temperature sensors and the heater. An oxide layer is deposited by PECVD between sensors and heater, and used as a insulator. The channel wall formed by the heater and sensors layer is not very smooth which may become a parameter to effect the heat transfer. To avoid the wall roughness effect, SOG planarization technique is used to reduce the wall roughness.

      Finally, heat loss form the channel was a serious problem in heat transfer experiments. Thus, the channel structure was fabricated successfully using low thermal conductivity materials, such as negative tone photoresist (SU-8), epoxy, PMMA, and the glass substrate to reduce the heat loss problem, and therefore, accurate measurement of local heat transfer distribution inside the channel can be expected.

    中文摘要 目錄..........................................................................I 表目錄.......................................................................IV 圖目錄........................................................................V 符號說明....................................................................VII 第一章 緒論  1-1 研究動機.................................................................1 1-2 文獻回顧.................................................................2 第二章 微流道晶片系統設計 2-1 微流道設計................................................................7 2-2 理論分析..................................................................8 2-2-1 內部流場...............................................................8 2-2-2 入口流與已發展流.......................................................9 2-2-3 熱傳分析..............................................................10 2-2-4 電雙層效應(Electric Double Layer Effect)..............................11 2-3 溫度感測器原理..........................................................12 2-3-1 電阻溫度感測器....................................................12 2-4 微加熱器與微溫度感測器設計............................................. 14 第三章 微流道晶片製作 3-1 晶圓清洗.................................................................16 3-2 微加熱器與微溫度感測器製作...............................................16 3-2-1 金屬剝離法(Lift off)製程........................................ 17 3-2-2 微影製程...........................................................18 3-2-3 金屬薄膜沉積.......................................................19 3-2-4 開接觸窗(Contact Hole Opening)之製作...............................21 3-2-5 金屬導線之製作.....................................................23 3-3 微流道製作.............................................................. 24 3-3-1 SOG(Spin on Glass) ................................................24 3-3-2 開接觸窗(Contact Hole Opening) ....................................25 3-3-3 以SU-8負型光阻製作微流道...................................... ....25 第四章 實驗供應與量測系統 4-1 液體供應與控制系統..................................................... 29 4-2 微溫度感測器與微加熱器校正..............................................29 第五章 結果與討論 5-1 晶圓清洗.................................................................33 5-2 微影製程................................................................ 34 5-3 蝕刻製程................................................................ 35 5-4 SOG平坦化之製作........................ ...............................36 第六章 結論與未來工作........................................................37 參考文獻.....................................................................38 自述.........................................................................71 著作權聲明...................................................................72

    [1]D. B. Tuckerman, R. F. W. Pease, “High- Performance Heat Sinking for VLSI”, IEEE Electron Device Letters, Vol. EDL-2, No. 5, May, 1981.
    [2]X. F. Peng, G. P. Peterson, and B. X. Wang, “Heat transfer characteristics of water flowing through microchannels”, Experimental Heat Transfer, Vol. 7, pp. 265-283, 1994.
    [3]X. F. Peng, G. P. Peterson and B. X. Wang, “Frictional Flow Characteristics Of Water Flowing Through Rectangular Microchannels”, Experimental Heat Transfer, Vol. 7, pp. 249-264, 1994.
    [4]X. F. Peng, G. P. Peterson, “The Effect of Thermofluid and Geometrical Parameters on Convection of Liquid Through Rectangular Microchannels”, International Journal of Heat Mass Transfer, Vol. 38, n. 4, pp. 755-758, 1995.
    [5]D. Yu, R. Warrington, R. Barron, and T. Ameel, “Experimental and theoretical investigation of fluid flow and heat transfer in microtubes”, ASME-JSME Thermal Engineering Joint Conference, Vol. 1, pp. 523-530, 1995.
    [6]Mala, Gh. Mohiuddin, Li Dongqing, and J. D. Dale, “ Heat transfer and fluid flow in microchannels, “Micro-Electro-Mechanical Systems(MEMS), ASME DSC, Vol. 59, pp. 127-136, 1996.
    [7]T. N. Tran, M. W. Wambsganss and D. M. France, “Small Circular and Rectangular Channel Boiling with Two Refrigerants”, Int. J. Multiphase Flow, Vol.22, No.3, pp.485-498, 1996.
    [8]Linan Jiang, Man Wong, Yitshak Zohar, “Transient temperature performance of an integrated micro-thermal system”, Journal of Micromechanics and Microengineering, Vol 10, n3, pp. 466-476, 2000.
    [9]Linan Jiang, Man Wong, Yitshak Zohar, “Forced Convection Boiling in a Microchannel Heat Sink”, IEEE. pp. 80~87, 2001.
    [10]H. Y. Wu, Ping Cheng, “Visualization and Measurements of Periodic Boiling in Silicon Microchannels”, International Journal of Heat and Mass Transfer Vol. 46, pp.2603-2614, 2003.
    [11]H. Y. Wu, Ping Cheng, ”Liquid/Two-Phase/Vapor Alternating Flow During Boiling in Microchannels at High Heat Flux”, Int. Comm. Heat Mass Transfer, Vol. 30, No. 3, pp.295-302, 2003.
    [12]楊賢政,「白金薄膜感測器應用於微流道的現地溫度量測」,碩士論文,2000年。
    [13]蕭聰鑫,「微流道之熱流實驗分析」,碩士論文,2000年。
    [14]黃青峯,「微渠道之微加熱器及溫度感測器設計製作」,碩士論文,2004.
    [15]Merle C. Potter, David C. Wiggert 著,吳順治‧譯, “流體力學/Mechanics of fluids, ” 東華書局,臺北市,pp.226-238,1st,1995.
    [16]Hunter R. J., Zeta Potential in Colloid Science: Principles and Applications. Academic Press, New York, 1981.

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